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Multilayer structure with embedded multilayer electronics

A technology of multi-layer components and electronic devices, applied in the structural connection of printed circuits, electric solid-state devices, multi-layer circuit manufacturing, etc., can solve the problem of reducing spatial resolution and other issues

Active Publication Date: 2018-12-21
TACTOTEK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, in some applications, placing several features on a common substrate next to each other or at some distance is in any case sub-optimal since the resulting rather limited spatial separation of the features reduces the achieved The achievable spatial resolution of a function (for example it may be a sensing function) of

Method used

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  • Multilayer structure with embedded multilayer electronics
  • Multilayer structure with embedded multilayer electronics
  • Multilayer structure with embedded multilayer electronics

Examples

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Embodiment Construction

[0053] In various embodiments, either or both substrate films may contain at least one window defined by an opening, such as a through hole, flap (flap, flap) or cutout, in the associated material layer. .

[0054] The window(s) may optionally contain a filler material that is different from the material of the membrane. The material is optionally optically translucent or transparent, taking into account the selected, eg, visible, wavelength(s), optionally glass or plastic, such as glazed. For example, it may define optical functional elements such as lenses, prisms or other refractive and / or diffractive elements.

[0055] The window(s) may display desired indications and / or decorative shapes, such as numbers, symbols, graphic patterns and / or at least partial shapes of pictures, texts. However, when applicable, the window material may be of a selected color.

[0056] In various embodiments, the material of the molding layer can construct at least a portion of the window fil...

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Abstract

An integrated multilayer assembly (100, 200, 300) for an electronic device comprising a first substrate film (106) configured to accommodate electrical features on at least first side thereof, said first substrate film having the first side and a substantially opposing second side, a second substrate film (202) configured to accommodate electrical features on at least first side thereof, said second substrate film having the first side and a substantially opposing second side, the first sides of the first and second substrate films being configured to face each other, at least one electrical feature (214B) on the first side of the first substrate film, at least one other electrical feature (214A) on the first side of the second substrate film, and a molded plastic layer (204) between the first and second substrate films at least partially embedding the electrical features on the first sides thereof. A related method of manufacture is presented.

Description

field of invention [0001] Generally, the present invention relates to multilayer structures associated with electronic devices, related devices and related methods of manufacture. In particular, though not exclusively, the invention relates to providing functional elements such as electronic devices in a multilayer stack. Background technique [0002] Generally, in the context of, for example, electronic devices and electronic products, such as various electronic devices, there are various stacked components and structures. [0003] The motivations behind stacking elements in common structures can be as varied as the context of use involved. Efficient integration of components or relatively often size savings, weight savings, cost savings, usability benefits are sought only when the resulting optimized solution finally exhibits a multi-layered nature, eg in terms of manufacturing process or logistics. Whereas relevant usage scenarios may relate to product packaging or food...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/00H05K3/28H05K5/06H05K1/03H05K1/14H01L23/522H01L23/538B29C39/12B29C45/16B32B27/08G06F3/044B32B17/10
CPCB29C45/16B29C39/12H01L23/538H05K1/0274H05K1/185H05K2201/10106H05K2201/10121H05K2201/09118H05K2203/1305H05K2203/1327H05K2203/1316H01L21/565H01L2924/181H05K1/0393H05K1/0313G06F3/041G06F3/017G06F3/04883G06F3/03547H05K3/46H05K1/144H05K3/4046H05K2203/063H05K2201/10295B32B2307/206B32B5/26B32B2307/546B32B2457/00B32B15/085B32B9/025B32B27/308B32B2255/06B32B2255/10B32B27/281B32B2307/204B32B9/06B32B9/04B32B2250/05B32B27/32B32B2307/75B32B9/041B32B2307/732B32B2307/202B32B27/12B32B29/02B32B27/365B32B2307/304B32B27/06B32B7/023B32B9/045B32B3/30B32B15/082B32B2307/416B32B15/088B32B27/08B32B9/047B32B27/10B32B27/34B32B2307/536B32B2307/412B32B27/302B32B2307/418B32B2307/58B32B2307/41B32B15/09B32B5/02B32B2307/738B32B3/06B32B2255/02B32B2307/414B32B3/266B32B15/14B32B27/36B32B29/08B32B17/06G06F3/0445H05K2201/10151H05K3/284B29C45/14639B29C45/14819B29L2031/34G06F2203/04101G06F2203/04103H05K1/0266H05K3/12H05K3/285H05K3/368H05K2201/0108H05K2201/042H05K2201/09936
Inventor 亚尔莫·萨斯基亚尔科·托威宁帕斯·拉帕娜米科·海基宁
Owner TACTOTEK
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