72results about "Offset printing" patented technology

An apparatus and method for making a printed circuit board comprising a substrate and an electrical circuit is provided. The circuit is formed by deposition of a plurality of electronic inks onto the substrate and curing of each of the electronic inks. The deposition may be performed using an ink-jet printing process. The inkjet printing process may include the step of printing a plurality of layers, wherein a first layer includes at least one electronic ink deposited directly onto the substrate, and wherein each subsequent layer includes at least one electronic ink deposited on top of at least a portion of a previous layer when the previous layer has been cured. One or more of the layers may include at least two of the electronic inks.

Wirings 2B1 are formed by application of heat treatment after an ink jet system is used to discharge a conductive liquid L onto a provisional substrate 5 having a predetermined repellent property, bonding an insulating layer 4B1 to the wirings 2B1 with an adhesive material 3B1 therebetween, peeling and removing the provisional substrate 5, and bonding and fixing the wirings 2B1 together with the insulating film 4B1 to a main substrate 1 by an adhesive material 3B1.

Methods and apparatus for generating and performing digital communications using a randomized generatable interleaver. In accordance with one exemplary embodiment of the invention, a pseudo random interleaver of size n*m with excellent randomness and spread properties may be generated from a set of seed values. The interleaver of size N=n*m is defined by dividing the N possible address in the interleaver (0-N−1) into n subsets. The subsets are preferably generatable from a single value within the subset either using an algorithm or a memory based lookup table. The set of n seeds comprises one value selected from each subset. An improved communication system incorporating the aforementioned interleaver and using turbo codes or other concatenated coding systems is also disclosed.

The present invention discloses an apparatus for manufacturing electronic devices using a roll-to-roll rotary pressing process, comprising a winding roll around which flexible printing paper is wound; a plurality of printing units arranged in a straight line; at least one coating unit; a rewinding roll to rewind the printing paper when printing has been completed; a plurality of guide rolls arranged between the winding roll and the rewinding roll, thus guiding the printing paper; a plurality of drying units, each drying unit being provided on a printing paper-path between the printing unit and the adjacent guide roll to dry ink transferred to the printing paper or on a printing paper-path between the coating unit and the adjacent guide roll to dry the printing paper on which coating agent is supplied; and tension regulating units installed around the winding roll and the rewinding roll, respectively, for regulating tension of the printing paper.

A paste coater that can apply an amount of a solder paste to small-diameter bump electrodes at a narrow pitch is described. A paste coater includes: a transfer roller, supported by a sub frame; a roller drive mechanism for rotating the transfer roller; a paste storage unit for storing paste to be supplied to the surface of the transfer roller; a squeegee having a distal edge, parallel to the rotary shaft of the transfer roller, separated by a gap from the distal edge to the surface of the transfer roller; a squeegee holder for holding and including biasing means for pushing the squeegee in a first direction thereby widening the gap; and a gap adjustment mechanism with biasing means for pushing the squeegee in a second direction thereby narrowing the gap.

A method for forming a pattern using a printing process is disclosed in the present invention. The method includes forming a resist layer on a substrate having an etching layer thereon, locating a master having a convex pattern over the substrate, pressing the master against the substrate until the convex pattern of the master directly contacts the etching layer, and removing a portion of the resist layer to expose a surface over the substrate, the removed portion of the resist layer having a width substantially the same as the convex portion of the master.

A stretchable circuit board includes plural stretchable bases, and plural stretchable wiring portions, at least one of which is provided on each of main surfaces, facing each other, of the plural stretchable bases, in which the stretchable wiring portions provided on the main surfaces are electrically continuous with each other through a connecting portion.

A printing plate for reversed relief offset printing ensures the prevention of the internal omission of a desired pattern without increasing the depths of depressions of the plate. The printing plate comprises a base material having depressions and a non-depressed part on a surface thereof, and ink repellent layers that cover inner surfaces of the depressions, respectively. The depressions of the base material whose inner surfaces are respectively covered with the ink repellent layers have a plan shape that defines a desired pattern. The non-depressed part of the base material is formed in such a way that a part of an ink film corresponding to the non-depressed part can be transferred to the printing plate in a process of reversed relief offset printing. The parts of the ink film corresponding to the depressions are not transferred to the printing plate due to the repelling action of the ink repellent layers.

The present invention relates to a method and an arrangement for transferring a conductive picture (12) to an irregular surface of a mobile phone casing (4) for shielding the mobile phone casing from electromagnetic radiation. It also relates to the printing color used for the conductive picture and tampon pads (5) used for the transferring of the conductive printing color to the phone casing (4). Conductive partial pictures (7) are printed on the irregular surface of the casing (4) step by step by means of tampon pads until the complete conductive picture (12) is achieved. The tampon pad has a shape corresponding to the surface of the phone casing. The printing color has a composition, which facilitates the adhering on the tampon pad. The invention also describes a method for printing an electric circuit pattern on a phone casing (4) by using the above mentioned tampon pads and printing color.

In a method for the manufacture of a printed circuit on a dielectric carrier (2), in a first step a circuit pattern (1) is applied with an electrically conductive ink and, in a second step, the circuit model is plated, the electrically conductive ink being applied by means of a method of gravure printing and the plating being done by electrolytic or chemical means.

A paste coater that can apply an amount of a solder paste to small-diameter bump electrodes at a narrow pitch is described. A paste coater includes: a transfer roller, supported by a sub frame; a roller drive mechanism for rotating the transfer roller; a paste storage unit for storing paste to be supplied to the surface of the transfer roller; a squeegee having a distal edge, parallel to the rotary shaft of the transfer roller, separated by a gap from the distal edge to the surface of the transfer roller; a squeegee holder for holding and including biasing means for pushing the squeegee in a first direction thereby widening the gap; and a gap adjustment mechanism with biasing means for pushing the squeegee in a second direction thereby narrowing the gap.

By flexographic printing or inkjet printing, insulating ink is applied on a wiring pattern in accordance with a predetermined printing pattern. The insulating ink is hardened, whereby an insulating layer is formed. A contact region of the wiring pattern that is used for electrical connection with a conductor other than the wiring pattern is not covered with the insulating layer. The printing pattern is delimited by the outline of a non-printing region including the contact region. The wiring pattern includes, in the non-printing region, a trunk wiring line leading, to the contact region, from a position on the wiring pattern at which the wiring pattern overlaps with the outline and a branch wiring line extending from a point on at least one side of the trunk wiring line and terminating without making contact with the outline.

A method of manufacturing a metal film pattern forming body, the method including: forming a desired metal film pattern on one surface of a stamp by using a catalyst for activating a surface of a plastic base; activating the surface of the plastic base by transferring the catalyst formed on the surface of the stamp onto the surface of the plastic base; and plating the surface of the activated plastic base.

A method of printing an electronic circuit or components thereof uses a printing machine to print a conductive structure on the front printing side (back side of the sheet) of a printing substrate. The sheet is then reversed and a decorative printing motif is printed on the back side in one work step. Alternatively, the circuit or components of a circuit may be printed by having a printing machine for color printing preceded by a printing machine for printing on the back side of the printing substrate. A chip is applied to the printing substrate where the back side of the printing sheet with the printing motif is cooled to prevent any negative effect on the printing motif and / or the printing substrate.