1589results about "Gear teeth manufacturing tools" patented technology

An improved pad and process for polishing metal damascene structures on a semiconductor wafer. The process includes the steps of pressing the wafer against the surface of a polymer sheet in combination with an aqueous-based liquid that optionally contains sub-micron particles and providing a means for relative motion of wafer and polishing pad under pressure so that the moving pressurized contact results in planar removal of the surface of said wafer, wherein the polishing pad has a low elastic recovery when said load is removed, so that the mechanical response of the sheet is largely anelastic. The improved pad is characterized by a high energy dissipation coupled with a high pad stiffness. The pad exhibits a stable morphology that can be reproduced easily and consistently. The pad surface resists glazing, thereby requiring less frequent and less aggressive conditioning. The benefits of such a polishing pad are low dishing of metal features, low oxide erosion, reduced pad conditioning, longer pad life, high metal removal rates, good planarization, and lower defectivity (scratches and Light Point Defects).

A knife-edge conditioning apparatus comprises at least one precision angled knife guide with one face of the knife blade maintained in sustained sliding or rolling contact and which guides the elongated edge of the blade into sustained contact with the hardened surface of an object and positions the plane of the adjacent edge facet at a precise predetermined angle relative to the contact plane of the hardened surface made of a material of equal or greater hardness than the metal of the knife blade without any tendency to abrade as the blade face is moved along the guide with its elongated edge in sustained contact with the hardened surface.

Flexible abrasive sheet materials having annular bands of precise height flat-topped raised island structures that are coated with a mono layer of abrasive particles or abrasive agglomerates, processes for manufacture of the abrasive sheet materials, processes for using the abrasive sheeting in high speed lapping / abrading processes, and apparatus for using the abrasive sheeting are described. The process for manufacturing the abrasive sheeting provides an economical method for providing an improved configuration of abrasive sheeting that can provide precisely flat workpiece surfaces that are also highly polished.

This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.

A grinding disk (13) for manually held, motor-driven grinders (1) has a centrally arranged fastening recess (15) open at the grinding disk upper side with an internal thread arrangement (16), with which the grinding disk (13) can be screwed onto a connecting part (8), which is arranged on the side of the grinder and is driven for the grinding motion during operation, and which connecting part has a thread section (11) with an external thread arrangement (12), which is associated with the internal thread arrangement (16) of the grinding disk (13). The internal thread arrangement (16) is formed by a multiple thread with at least two thread courses, which are arranged angularly offset to one another. The diameter ratio between the diameter of the internal thread arrangement (16) and the outside diameter of the grinding disk (13) is at least approximately 0.25.

Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method of improving retention of superabrasive particles held in a solidified organic material layer of an abrading tool, a portion of each of said superabrasive particles protruding out of the solidified organic material layer is provided. The method may include securing a plurality of superabrasive particles in the solidified organic material layer in an arrangement that minimizes mechanical stress impinging on the protruding portion of any individual superabrasive particle when used to abrade a work piece. As an example, the arrangement of the plurality of superabrasive particles may be configured to uniformly distribute frictional forces across substantially each superabrasive particle.

A CMP pad conditioner including: (a) a disk-shaped substrate having a working surface which is provided by one of its axially opposite end surfaces and which is to be brought into contact with the CMP pad; and (b) abrasive grains which are fixed to the working surface. The substrate includes a radially inner portion and a radially outer portion which is located radially outwardly of the radially inner portion. The working surface in the radially outer portion is inclined with respect to the working surface in the radially inner portion, such that a thickness of the radially outer portion as measured in an axial direction of the substrate is reduced as viewed in a direction away from an axis of the substrate toward a periphery of the substrate. A ratio of an outside diameter of the radially inner portion to an outside diameter of the substrate is 60–85%.