431results about "Support wheels" patented technology

The invention provides a method and apparatus for making an abrasive product comprising providing a substantially horizontally deployed flexible backing having a first surface bearing an at least partially cured primer coating and an opposite second surface; providing a dry flowable particle mixture comprising abrasive particles and particulate curable binder material; depositing a plurality of temporary shaped structures comprised of said particle mixture on the at least partially cured primer coating of the first surface of the backing; softening said particulate curable binder material to provide adhesion between adjacent abrasive particles; and curing the softened particulate curable binder material to convert said temporary shaped structures into permanent shaped structures and cure the at least partially cured primer coating on the first surface of the backing. The invention also provides an abrasive product made by the method.

Backing plates are provided for use with abrasive disks designed to permit a view of the surface while abrading is occurring. This is achieved by the removal of portions of the circumference of the plate and preferably also viewing apertures in the body of the plate.

An attachment system for attaching an abrasive article, such as an abrasive sheet or disc, to a sanding tool includes an article having a first major surface including an attachment region with attachment material for attachment with an associated mating surface on the sanding tool, and a non-attachment region along at least a portion of an edge of the first major surface forming a sufficiently weak attachment with the associated mating surface to allow a user to grasp the abrasive article and separate the abrasive article from the sanding tool.

Methods of abrading surfaces by rotationally reciprocating abrasive surfaces in contact with the surfaces, abrasive articles for use in rotationally reciprocating tools, and methods of removing defects in a surface, where the methods include sanding using a rotationally reciprocating abrasive surface followed by one or more polishing operations are disclosed.

In a tool comprising a supporting part and a disk-shaped working part for machining operation, the supporting part comprises a supporting face for the working part and a permanent magnet within the supporting face. The working part comprises a coupling member of ferromagnetic material which is movable into magnetically clinging connection with the permanent magnet upon application of a counterpart supporting face to the supporting face.

A soft brittle functional crystal grinding and machining method belongs to the technical field of soft brittle functional crystal machining, and particularly relates to a soft brittle functional crystal ultra-precision grinding and machining method for a semiconductor and a photoelectric crystal. The method is characterized in that a micro-powder diamond segmental variable speed feed and a soft abrasion grinding wheel chemical mechanical grinding method are adopted to machine the soft brittle function crystal. During the crude grinding period and the accurate grinding period, the feeding speed of the grinding wheel is firstly high and then low. A grinding fluid is de-ionized water. A soft abrasive agent grinding wheel is adopted to conduct the chemical mechanical grinding. The soft abrasive agent is a macromolecule polymer or waterproof resin. A filler is NaHCO3 or a refined naphthalene foaming agent. The chemical and mechanical grinding fluid is adopted as a reaction fluid and a cooling fluid. The grinding fluid mainly contains lactic acid, acetic acid and de-ionized water. The pH value of the grinding fluid is 2-4. The invention has the advantages of high grinding and machining efficiency, low machining cost and high surface precision. In addition, no surface/sub-surface damage is caused to the surface of a workpiece, such as small scratches, embedment of free abrasive agent, plastic deformation, residual stress, and the like.

A polishing pad is retained on a platen by structures which do not require adhesive. In one embodiment, a polishing pad has a top polishing surface and an undersurface. The undersurface has a surface profile which is configured to interfit with a complementary surface profile on a platen. The surface profile of the undersurface may comprise an array of parallel ridges and grooves.

The present invention provides a resilient hand-held abrasive article comprising a flexible and/or conformable grip comprising a top surface, a bottom surface and individual small high-grip pads attached to each other in a pattern that leaves voids therebetween, the individual small high-grip pads comprising a top and a bottom. The top surface of a sanding article is attached, and in certain embodiments removably attached, to the bottom of the high-grip pads and a bottom surface having abrasive particles coated thereon. In certain embodiments, the flexible and/or conformable grip may not comprise voids.

A rotary die cuter for a box making machine has an abrading cylinder mounted for rotation alongside the anvil for engaging and resurfacing the blanket of the anvil on a virtually continuous basis to smooth, level and even the surface of the blanket. This resurfacing occurs during normal operation of the rotary die cutter so no production is lost. The abrading cylinder has a sheet layer of abrasive material spirally wrapped on the surface of the cylinder and bonded thereto with adhesive material on the backside of the sheet layer. The abrading cylinder is movable towards or away from the anvil by a servo motor and gearbox. The position of the abrading cylinder relative to the anvil is determined by an encoder which sends the information to a computer or programmable controller which calculates the changing diameter of the blanket and the amount of speed change that must be imparted to the anvil to compensate for its changing diameter. The computer or programmable controller is connected to a drive system of the anvil to effect the speed change.

A polishing pad assembly is provided that is useful for the chemical mechanical polishing of glass and electrical devices such as semiconductor wafers that comprises a polish pad and a semi-rigid base material firmly adhered to the polishing pad for positioning on a polishing platen of a polishing machine; wherein the semi-rigid base material has a modulus of rigidity of 0.01-50 GPa (GigaPascals) determined according to ASTM D 790, a thickness of 0.25-15.0 mm, and a grooved surface having a pitch of 5-100 mm and the grooves have a width of 0.025-2.5 mm and a depth of 0.1-2.5 mm.

A fixing member is provided for fixing a front end section to the rest of a base plate. The fixing member is provided with a surface fastener which is integrally molded with the fixing member.

An optical-grade surfacing tool includes: a rigid holder (60); an elastically compressible interface (12) secured to the rigid holder (60); and a flexible pad (13) that can be applied against a surface to be machined (71) and secured to the interface (12) opposite the rigid holder (60). The pad (13) is carried by an elastically extensible membrane (14) including: a central plate (15); and a plurality of straps (18) each radially protruding from the periphery of the plate (15) and each having a distal portion engaged with a fastening element (38), each strap (18) rotating about the side surface (28) of the interface (12) and extending up to the fastening element, each strap (18) being taut.