1201results about "De-icing/drying-out arrangements" patented technology

A patch antenna for operation within a high temperature environment. The patent antenna typically includes an antenna radiating element, a housing and a microwave transmission medium, such as a high temperature microwave cable. The antenna radiating element typically comprises a metallization (or solid metal) element in contact with a dielectric element. The antenna radiating element can include a dielectric window comprising a flame spray coating or a solid dielectric material placed in front of the radiating element. The antenna element is typically inserted into a housing that mechanically captures the antenna and provides a ground plane for the antenna. Orifices or passages can be added to the housing to improve high temperature performance and may direct cooling air for cooling the antenna. The high temperature microwave cable is typically inserted into the housing and attached to the antenna radiator to support the communication of electromagnetic signals between the radiator element and a receiver or transmitter device.

According to one aspect of the present disclosure, a microwave antenna assembly is disclosed. The antenna assembly includes a feedline having an inner conductor, an outer conductor and an inner insulator disposed therebetween and a radiating portion including a dipole antenna having a proximal portion and a distal portion. The antenna assembly also comprises a sheath disposed over the feedline and the radiating portion defining a chamber around the feedline and the radiating portion. The chamber is adapted to circulate coolant fluid therethrough. The antenna assembly further includes a connection hub having cable connector coupled to the feedline, an inlet fluid port and an outlet fluid port. The connection hub includes a bypass tube configured to provide for flow of the coolant fluid from the cable connector directly to the outlet fluid port.

An apparatus includes a heat receiving portion which receives heat within a footprint from a heat generating structure, and a cooling arrangement which causes flow of a coolant that absorbs heat at the heat receiving portion, the cooling arrangement being disposed in its entirety within a width of the footprint in a particular direction. A different feature involves an apparatus which includes a heat receiving portion at which a coolant receives heat, and a coolant separating portion which receives coolant traveling away from the heat receiving portion, and which separates liquid coolant from vapor coolant.

A transmitter including a transmitter board comprising multiple electrical ports, each port configured to: receive any of a plurality of antenna boards, and provide electrical signals to a received antenna board. Each respective antenna board comprises antenna elements configured to transmit radio frequency (RF) power waves using the provided signal. The transmitter board further includes a processor configured to: determine whether antenna boards are connected to respective ports of the multiple electrical ports, and after determining that a respective antenna board has been received at a respective port: (i) instruct the transmitter board to provide, via the respective electrical port, electrical signals to the antenna board, and (ii) control transmission of RF waves by antenna elements of the respective antenna board to cause each of the RF waves to constructively interfere with at least one other RF wave at a receiver device located within a transmission field of the transmitter.

An integrated circuit module includes a carrier substrate, a semiconductor die disposed in the carrier substrate, a ground pad disposed on the carrier substrate, and an antenna partially embedded in the carrier substrate. The antenna includes a ground layer in thermal contact with the ground pad for dissipating heat generated from the semiconductor die.

According to one embodiment, an apparatus includes a fluid coolant and structure which reduces a pressure of the fluid coolant through a subambient pressure at which the coolant has a cooling temperature less than a temperature of the heat-generating structure. The apparatus also includes structure that directs a flow of the fluid coolant in the form of a liquid at a subambient pressure in a manner causing the liquid coolant to be brought into thermal communication with the heat-generating structure. The heat from the heat-generating structure causes the liquid coolant to boil and vaporize so that the coolant absorbs heat from the heat-generating structure as the coolant changes state. The structure is configured to circulate the fluid coolant through a flow loop while maintaining the pressure of the fluid coolant within a range having an upper bound less than ambient pressure. The apparatus also includes a first heat exchanger for exchanging heat between the fluid coolant flowing through the loop and a second coolant in an intermediary loop so as to condense the fluid coolant flowing through the loop to a liquid. The apparatus also includes a second heat exchanger for exchanging heat between the second coolant in the intermediary cooling loop and a body of water on which the ship is disposed.

Various embodiments of the present invention comprise: an antenna module; and at least one RRH which is arranged to face the outer surface of the antenna module, is coupled by being directly connected to the antenna module and arranged along the longitudinal direction of the antenna module, wherein a plurality of cooling air gaps are provided between the outer surface of the antenna module and the RRH.