The invention discloses a preparation method of a
high heat conductive and hight temperature resistant corrugated
ceramic-based
heat exchanger chip. The method comprises the following steps of: first, impregnating a
ceramic fiber paper in a
sizing agent; carrying out hot-press forming on the
ceramic fiber paper by using a corrugated
paper machine so as to obtain a single-face corrugated paper; bonding the single-face corrugated paper with the flat-plate ceramic
fiber paper impregnated by the
sizing agent so as to obtain a double-face corrugated paper;
cutting the double-face corrugated paper into square shapes with same sizes; and then overlapping the squares with each other along the
square face according to a corrugated paper passage of 90 degrees; bonding the squares with each other soas to obtain the corrugated ceramic-based
heat exchanger chip; curing, bonding and
sintering the corrugated ceramic-based
heat exchanger chip; naturally cooling the corrugated ceramic-based heat exchanger chip to
room temperature; impregnating the chip into a suspension consisting of
silica gel and a
high heat conductive
inorganic filler; impregnating, depositing and taking out the chip;
drying the chip after blowing the liquid; and
drying the chip so as to obtain the
high heat conductive and hight temperature resistant corrugated ceramic-based heat exchanger chip. According to the invention,by using the overlapped
honeycomb structure, the heat exchanging area of the heat exchanger
unit volume is increased, no
inference is caused between the heat exchanging passages so that clean heat exchanging
airflow is obtained to get the characteristics of heat exchanging continuity, compact structure and the like.