The invention discloses a novel three-dimensional
microwave multi-
chip module structure, and relates to the field of
microwave microelectronic packaging. The structure comprises a bottom
silicon chip, an MMIC
chip, a top
silicon chip and an ASIC chip from the bottom to the top. The bottom
silicon chip is provided with a chip installation groove through
etching, and the surface of the bottom
silicon chip is plated with a first
metal layer. The MMIC chip is bound at the bottom of the chip installation groove through a conductive glue layer, and the upper surface of the MMIC chip and the upper surface of the bottom
silicon chip are sequentially provided with a sealed
protection layer, a second
metal layer and a first
solder mask layer. A part, corresponding to the chip installation groove of the bottom
silicon chip, of the bottom of the top silicon chip is provided with a bottom groove in an
etching manner. The corresponding parts of the bottom and top silicon chips are respectively provided with a
welding ball convex point pole in an
etching manner. A third
solder mask layer of the top silicon chip is provided with a
metal electrode in an etching manner, and the ASIC chip is welded on the metal
electrode of the top silicon chip. The technological production of a three-dimensional
microwave multi-chip module is completed in a mode of
wafer level through employing a silicon cavity structure and
benzocyclobutene secondary wiring, and the production efficiency is improved.