Novel three-dimensional microwave multi-chip module structure

Abstract

The invention discloses a novel three-dimensional microwave multi-chip module structure, and relates to the field of microwave microelectronic packaging. The structure comprises a bottom silicon chip, an MMIC chip, a top silicon chip and an ASIC chip from the bottom to the top. The bottom silicon chip is provided with a chip installation groove through etching, and the surface of the bottom silicon chip is plated with a first metal layer. The MMIC chip is bound at the bottom of the chip installation groove through a conductive glue layer, and the upper surface of the MMIC chip and the upper surface of the bottom silicon chip are sequentially provided with a sealed protection layer, a second metal layer and a first solder mask layer. A part, corresponding to the chip installation groove of the bottom silicon chip, of the bottom of the top silicon chip is provided with a bottom groove in an etching manner. The corresponding parts of the bottom and top silicon chips are respectively provided with a welding ball convex point pole in an etching manner. A third solder mask layer of the top silicon chip is provided with a metal electrode in an etching manner, and the ASIC chip is welded on the metal electrode of the top silicon chip. The technological production of a three-dimensional microwave multi-chip module is completed in a mode of wafer level through employing a silicon cavity structure and benzocyclobutene secondary wiring, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the field of microwave microelectronic packaging. Background technique [0002] With the development of microwave and millimeter wave technology, miniaturization, integration and multi-function have become the development direction of RF microwave components. The development of miniaturization and integration is mainly reflected in the following two aspects: (1) the development of multifunctional chips, which can include low-noise amplifiers, drive amplifiers, mixers, filters, switches, digitally controlled attenuators, digitally controlled phase shifters Microwave functional units are integrated on a microwave monolithic integrated circuit (MMIC) to realize the miniaturization of the system, but this method cannot realize the functional integration of chips made of different materials. (2) Using a three-dimensional system integration scheme, the large-scale integrated circuit (ASIC) and MMIC of different materials in the comp...

AI Technical Summary

Problems solved by technology

[0006] (3) The current three-dimensional microwave multi-chip components need to be individually assembled for each component, which has low production efficiency and is not suitable for mass production

[0007] (4) The current three-dimensional microwave multi-chip components use metal partitions to solve the electromagnetic compatibility problems of high-gain amplification links and multi-channel components, which is technically difficult and increases the size of components

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