45results about How to "Mass transfer" patented technology

The present invention represents a radical departure from most conventional macro-scale batch processing methods employed to synthesize and coat colloidal nanoparticles. Synthesis and coating are in series and in-situ, obviating the need for numerous cumbersome, and often expensive intermediate-processing steps. In one embodiment, the invention is a method and apparatus for synthesizing colloidal nanoparticles. In another embodiment, the invention is a method and apparatus for enabling coating of colloidal nanoparticles using an electrophoretic switch for contacting and separating said colloid nanoparticles.

The invention belongs to the technical field of semiconductors, and particularly discloses a micro device laser peeling huge quantity transfer device and method based on winding process, The inventioncomprises a micro device stripping and transferring module, an auxiliary tape carrying module, a transition tape carrying module, a transfer tape carrying module, a substrate carrying module, a microdevice filling module, a curing module, a packaging module and a substrate transferring module, wherein the micro device stripping and transferring module is used for realizing the detection and stripping of the micro device; The auxiliary tape module is used to adhere the stripping micro-device; The transition tape module is used for picking up the micro device and transferring it to the transfer tape module. The transfer tape module is used for picking up the micro device and transferring it to the substrate carrying module. A substrate carry module is used for pas that micro device into afilling module, a curing module, a packaging module and a substrate handling module to realize filling, curing, packaging and loading and unloading. The invention realizes the massive transfer of themicro device by using the winding process and the laser technology, and has the advantages of high production efficiency, low production cost and the like.

The invention discloses a preparation method of a light emitting display. The preparation method comprises the steps of providing a packaging substrate, sinking the packaging substrate into a suspension, sinking a plurality of light emitting diodes into the suspension, and horizontally injecting the suspension, wherein a plurality of recesses are arranged at the top of the packaging substrate; each recess is provided with a first electrode region and a second electrode region in different height; the light emitting diodes are provided with planes and curved surfaces; the suspension has different flow rates on the planes and the curved surfaces of the light emitting diodes; all the light emitting diodes are respectively embedded into all the recesses according to the different flow rates; and each light emitting diode is electrically connected with the first electrode region and the second electrode region of the corresponding recess to form the light emitting display. According to thepreparation method, the packaging substrate and the light emitting diodes are assembled according to a bernoullis theorem on the premise that no damage is caused to the packaging substrate or the light emitting diodes.

The invention concerns a rotating wall vessel bioreactor (100) using Taylor vortex flow for cell culture in the annular space between the two concentric cylindrical bodies, wherein the internal one (2) is rotating and the external one (1) is stationary. The internal rotating body (2) is composed of an external wall around which a polymeric tubular membrane (6) is wrapped, which is connected to the hollow tubular axis (5) of the internal body (2) for the introduction of gases into the annular space (d). Said annular space (d) is filled with a suspension of cells or cells immobilized on microcarriers.

The invention discloses a micro light-emitting diode display panel and a preparation method thereof, the micro light-emitting diode display panel comprises: a driving back plate, wherein one surface of the driving back plate is provided with a plurality of grooves, the bottom of each groove is provided with a first magnetic electrode, and the sectional dimensions of the grooves are gradually increased from bottom to top; and a micro light-emitting diode which is embedded into the groove of the driving back plate, wherein a second magnetic electrode is arranged at one end of the micro light-emitting diode, the second magnetic electrode and the first magnetic electrode are in contact with each other, and the maximum section size of the micro light-emitting diode is not smaller than that of the groove. In this way, the transfer efficiency of the micro light-emitting diode can be improved, and large-scale transfer is achieved.

The invention provides a Mini LED display module preparation method. The method comprises the steps that a red light wafer, a green light wafer and a blue light wafer which are of a vertical structureare prepared, and one side of a P electrode of each of the red light wafer, the green light wafer and the blue light wafer is of a boss structure; a polyester film is prepared on the surface of a supporting film, and grooves matching the boss structures on one sides of the P electrodes of the red light wafer, the green light wafer and the blue light wafer respectively are prepared in the polyester film; the red light wafer, the green light wafer and the blue light wafer are embedded into the groove of the polyester film in sequence; the red light wafer, the green light wafer and the blue light wafer are transferred to the surface of the transparent conductive substrate through one side of an N electrode, and the support film and the polyester film are removed; epoxy resin glue is filled among the red light wafer, the green light wafer and the blue light wafer; and the red light wafer, the green light wafer and the blue light wafer are welded with the substrate with the circuit throughone side of the P electrode to finish the preparation of the Mini LED display module. A large amount of wafers can be transferred easily and conveniently, and the prepared Mini LED display module ishigh in mechanical strength and good in reliability.

The invention described herein concerns microchannel apparatus that contains, within the same device, at least one manifold and multiple connecting microchannels that connect with the manifold. For superior heat or mass flux in the device, the volume of the connecting microchannels should exceed the volume of manifold or manifolds. Methods of conducting unit operations in microchannel devices having simultaneous disrupted and non-disrupted flow through microchannels is also described.

The invention discloses a chip weakening structure, a manufacturing method of the chip weakening structure, a mass transfer method and a display panel. The LED chip weakening structure comprises a plurality of Micro-LED chips and connecting bridges located between the adjacent Micro-LED chips. On the one hand, the connecting bridge plays a role in temporary connection, and the problems of poor precision and low efficiency of mass transfer caused by random scattering of the Micro-LED chips with the vertical structures after falling off from the substrate are avoided; on the other hand, the connecting bridges fix the positions of the Micro-LED chips of the vertical structures, so the Micro-LED chips of the vertical structures can be conveniently positioned by a clamping or adsorption device in the mass transfer process, the transfer precision can be improved, and mass transfer can be quickly realized.

The present invention provides a spring tube type flexible micro chemical reactor. It comprises a reactor body, a thermal control device, and a gas generating device. The spring tube type flexible micro chemical reactor enhances the heat and mass transfer using the scroll spring tube, which is able to achieve accurate mixing and dynamic adjustment of the heat and mass transfer and is able to effectively solve the problems of blocking of channels by solid reactant, the poor portability of the reaction, etc.

A bioreactor system for manufacturing and extracting a desired biomaterial from a microorganism by fermenting the microorganism in the bioreactor. The system includes a horizontal reactor vessel, one or more vertical discs rotatably mounted around a hollow shaft, a motor to power the shaft, and one or more spray nozzles arranged to spray required liquids on to the discs. The system is arranged so that the microorganism is not kept submerged within the reactor vessel during the fermentation process. The system is suitable for any type of microorganism, including fungi and bacteria, and can be modified to produce many types of desired biomaterials, including antibiotics, enzymes, ethanol, butanol, chitin, and chitosan. The method of the present invention generally provides steps for placing substrate on the vertical discs of the reactor vessel, inoculating the discs, introducing media, fermenting the microorganism, and extracting the desired biomaterial from the reactor vessel.

A method for transferring LEDs, which includes the following steps: providing a receiving substrate and a plurality of LEDs, the receiving substrate has a plurality of receiving areas, each receiving area is used to receive one LED correspondingly, and the opposite ends of each LED are respectively provided with The magnetically opposite first electrode and second electrode can be used for magnetically attracting materials; using the first electromagnetic plate to magnetically adsorb multiple LEDs, so that each LED can be transferred to a first electrode with the first electrode facing up or the second electrode facing up. A platform; using a second electromagnetic flat plate to magnetically adsorb a plurality of LEDs on the first platform, and transfer them to a second platform after rough positioning; and utilizing a third electromagnetic flat plate to adsorb a plurality of LEDs on the second platform, Make it finely positioned and transfer to the receiving area of ​​the receiving substrate correspondingly. Also provided is a method for preparing the LED display panel.

The invention belongs to the technical field of semiconductors, and specifically discloses a micro-device laser peeling mass transfer device and method based on a winding process, which includes a micro-device peeling transfer module, an auxiliary carrier tape module, a transition carrier tape module, a transfer carrier Belt module, substrate carrying module, micro-device filling module, curing module, packaging module and substrate handling module, micro-device peeling transfer module is used to realize the detection and peeling of micro-device; auxiliary tape-carrying module is used for adhesion and stripping of micro-device; transition The carrier tape module is used to pick up micro devices and transfer them to the transfer carrier tape module; the transfer carrier tape module is used to pick up micro devices and transfer them to the substrate carrier module; the substrate carrier module is used to send micro devices into Filling, curing, packaging and loading and unloading are realized in the filling module, curing module, packaging module and substrate handling module. Through the invention, the mass transfer of micro devices is realized by using the winding process and the laser technology, and has the advantages of high production efficiency, low production cost and the like.

The invention discloses a mass transfer method of micro LED chips, which comprises the steps of preparing micro LED chips on a growth substrate; equipping a temporary carrier with a sticky surface onone side; placing the chips on the surface of the growth substrate towards the temporary carrier, stripping the chips from the growth substrate and dropping the chips to the surface of the temporary carrier; preparing a stamp with a specific material, wherein the surface of the stamp is provided with regularly arranged bumps, and the surfaces of the bumps are sticky; placing the side with bumps ofthe stamp towards the surface of the temporary carrier, carrying out UV irradiating or heating on the temporary carrier, and enabling the bumps in the stamp to take down the corresponding chips fromthe surface of the temporary carrier; placing the stamp with the chips towards a target substrate, transferring the chips to the surface of the target substrate by means of bonding, and carrying out UV irradiating or heating on the bumps on the stamp so as to remove the stamp; and repeating the steps S2-S6 until the mass transfer of the chips is completed. The mass transfer method is simple and convenient, can achieve the purpose without complex equipment and saves a lot of cost.