Preparation method of Mini LED display module

A display module and chip technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of low efficiency, poor welding wire, disconnection, etc., and achieve good reliability, high mechanical strength, simple and convenient The effect of volume transfer

Pending Publication Date: 2020-04-24
LATTICE POWER (JIANGXI) CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the above deficiencies, the present invention provides a method for preparing a Mini LED display module, which effectively solves the technical problems of the existing Mini LED display module such as low efficiency, poor welding and risk of disconnection in the bonding process of the existing Mini LED display module.

Method used

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  • Preparation method of Mini LED display module
  • Preparation method of Mini LED display module
  • Preparation method of Mini LED display module

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Embodiment Construction

[0018] In order to more clearly illustrate the implementation cases of the present invention or the technical solutions in the prior art, the specific embodiments of the present invention will be described below with reference to the drawings. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative work, other drawings can be obtained based on these drawings and obtained Other embodiments.

[0019] The invention provides a method for preparing a Mini LED display module, including:

[0020] S1 prepares the vertical structure of the red light chip 1, the green light chip 2 and the blue light chip 3, the red light chip, the green light chip and the blue light chip have a bump structure on the P electrode side, such as figure 1 As shown, the red chip 1 corresponds to the boss structure 11, the green chip 2 corresponds to the boss structure 21, and the blue chip 3 corresponds to th...

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Abstract

The invention provides a Mini LED display module preparation method. The method comprises the steps that a red light wafer, a green light wafer and a blue light wafer which are of a vertical structureare prepared, and one side of a P electrode of each of the red light wafer, the green light wafer and the blue light wafer is of a boss structure; a polyester film is prepared on the surface of a supporting film, and grooves matching the boss structures on one sides of the P electrodes of the red light wafer, the green light wafer and the blue light wafer respectively are prepared in the polyester film; the red light wafer, the green light wafer and the blue light wafer are embedded into the groove of the polyester film in sequence; the red light wafer, the green light wafer and the blue light wafer are transferred to the surface of the transparent conductive substrate through one side of an N electrode, and the support film and the polyester film are removed; epoxy resin glue is filled among the red light wafer, the green light wafer and the blue light wafer; and the red light wafer, the green light wafer and the blue light wafer are welded with the substrate with the circuit throughone side of the P electrode to finish the preparation of the Mini LED display module. A large amount of wafers can be transferred easily and conveniently, and the prepared Mini LED display module ishigh in mechanical strength and good in reliability.

Description

Technical field [0001] The invention relates to the field of LED technology, in particular to a method for preparing a purple Mini LED display module. Background technique [0002] Traditional backlight LEDs have been developed for many years, and have reached a technical bottleneck, and their profits are relatively low. Coupled with the continuous erosion of the backlight display market by OLED displays with high functionality such as light, thin and flexible, the layout of OLED displays Manufacturers actively invest in the development of Mini LEDs to improve their competitive advantages. [0003] Mini LED's direct-lit backlight has the characteristics of local dimming, which is comparable to the high-contrast effect of OLED's self-illumination. In addition, Mini LED's direct-lit backlight is easier to produce high-curved displays. Supplying different needs, performance is comparable to OLED The display can compete with each other at a lower cost. Taking TV products as an exampl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/62
CPCH01L25/0753H01L33/483H01L33/62H01L2933/0033
Inventor 肖伟民
Owner LATTICE POWER (JIANGXI) CORP
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