110results about How to "Ensure interval" patented technology

A screen printer and a screen printing method in which a matter being printed on can be utilized effectively while print reliability is secured by preventing contact between a print mask and the matter being printed on without increasing the interval (gap) between print areas. Curvature (R1) of that region S1 on a print base (2) corresponding to a squeegee slide section (11) where a squeegee (4) slides on a print mask (1) is set larger than the curvature (R2) of that region S2 on the print base (2) corresponding to a squeegee non-slide section (12) contiguous to a print end portion P where sliding of the squeegee (4) on the print mask (1) ends. When a matter (3) being printed on is carried reversely to the carrying direction W, the curvature (R1) of that region on the print base (2) corresponding to the squeegee slide section (11) is set larger than the curvature (R2) of that region corresponding to a squeegee non-slide portion contiguous to a print start portion where sliding of the squeegee (4) on the print mask (1) is started.

To maintain the chip interval appropriately, by removing wrinkles from a tape by a simple device configuration. A dividing method of a wafer using a division device for dividing a wafer (W) supported on a ring frame (F) via a tape (T) into individual chips (C) at division start points along a division line has: a holding step of holding the ring frame on a ring frame holding section (20), and holding a wafer on the inside of the ring frame on a holding table (10); a division step of stretching the tape by separation of the holding table and the ring frame holding section, thus dividing the wafer at the division start points; and a rip separation step of separating a chip by thermally contracting the heating range of a heater (51) for thermally shrinking the stretched tape by a predetermined heating range, at a time, in the circumferential direction or radial direction between the outer periphery of the wafer and the inner periphery of the ring frame.

A dipping type film-separating apparatus comprises a flow producing device having a plurality of film cartridges arranged at a predetermined spacing, for producing flows of one direction along the film faces of the film cartridges, and wall members on the two sides of the passages of the one-direction flows formed between the adjoining film cartridges. These film cartridges can be mounted on and demounted from the other direction substantially orthogonal to the one-direction flows and substantially orthogonal to the arranging direction of the film cartridges.

The present invention relates to an image sensor and to a method for driving same. Disclosed is an image sensor which includes a first photoelectric conversion unit generating a charge by receiving a plurality of light beams other than the light beam of a first wavelength, and a second photoelectric conversion unit generating a charge by receiving the light beam of the first wavelength, wherein at least a portion of the first and second photoelectric conversion units are provided so as to be spaced apart from each other in the vertical direction.

There is provided an imaging lens including a first lens having a positive refracting power, a second lens having a concave surface on an object side and having a negative refracting power, and a third lens having a positive refractive power and a meniscus shape having a convex surface on the object side and at a vicinity of an optical axis, in order from the object side. The imaging lens satisfies conditional equations below. f designates a focal length of the total system, f1 designates a focal length of the first lens, D2 designates an interval between the first lens and a second lens on an optical axis, v123 designates an average of Abbe numbers of the first lens, the second lens and the third lens, and v2 designates the Abbe number of the second lens.

0.7<f1/f<1.3   (1)

0.25<D2/f<0.50   (2)

55<v123   (3)

|v123−v2|<5   (4)

Disclosed is a package board wherein a malfunction or error occurs even when a high-frequency IC chip, in particular an IC chip of more than 3 GHz is mounted. A conductor layer (34P) having a thickness of 30 mum is formed on a core substrate (30), and a conductor circuit (58) having a thickness of 15 mum is formed on a interlayer resin insulating layer (50). By forming the conductor layer (34P) thick, the volume of the conductor itself is increased, thereby reducing the resistance. In addition, the power supply capacity to the IC chip can be improved by using the conductor layer (34) as a power supply layer.

The invention discloses an operation method of a three-dimensional flash memory array unit with variable programming stages. The operation method comprises the following steps: S1, receiving an erasing operation instruction and address information; S2, erasing the selected block structure; S3, receiving a multi-level programming instruction and address information; S4, judging whether the addressoverflows or not, if yes, entering S5, otherwise, receiving programming level information of the target unit, and entering S6; S5, completing the programming operation of the selected block structure,and ending; S6, performing multi-level programming operation on the current flash memory unit according to the multi-level programming instruction, the address information and the programming level information of the target unit; S7, judging whether the difference of the threshold voltages is not smaller than the preset minimum interval voltage or not, if yes, changing the address information, entering S3, and performing the programming operation of the next flash memory unit; And otherwise, carrying out multi-level programming operation on the current flash memory unit for no more than the preset number of times again. The flash memory unit is subjected to target stage number programming, the threshold voltage of the flash memory unit is accurate to the preset value, and therefore the data state of the flash memory unit is accurately controlled.

A semiconductor light-emitting element assembly includes: a semiconductor light-emitting element having first and second leads, a semiconductor light-emitting element chip die-bonded to the first lead and wire-bonded to the second lead, a metal body for heat dissipation fixed to the first and second leads via an insulating adhesive layer, and a reflector fixed to the first and second leads and reflecting light from the chip; a wiring board having an opening for receiving the reflector; a heat dissipator disposed on the metal body for heat dissipation; and a fastening part for fastening the heat dissipator and the wiring board, wherein the first and second leads are fixed to the wiring board so that the reflector is received in the opening, and an interval holding part for holding an interval between the heat dissipator and the wiring board.

PROBLEM TO BE SOLVED: To provide a battery with a circuit board disposed along a battery cell and integrally fixed to the battery cell with a mold, having the improved filling efficiency of a resin in the mold, and allowing prevention of an appearance defect. SOLUTION: This battery A has a battery cell 1, and a circuit board 5 disposed along one face 4 of the battery cell 1, while the circuit board 5 is integrally fixed to the battery cell 1 with the mold 2. The circuit board 5 is formed such that at least border lines 20A each showing a border line in the width direction of a border line 20 when projecting the circuit board 5 upon the face 4 are positioned inside a border lien 21 of the face 4, and the circuit board 5 is embedded in the mold 2.