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Semiconductor light-emitting element assembly

A technology of light-emitting elements and semiconductors, applied in the direction of semiconductor devices, electrical components, electric solid-state devices, etc., can solve the problems of shortened service life and reduced luminous efficiency of light-emitting diode elements 59, and achieve the effect of increasing size and improving heat dissipation performance

Inactive Publication Date: 2008-01-30
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] As the temperature of the LED element 59 rises, the luminous efficiency decreases, and the service life of the LED element 59 also shortens.

Method used

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  • Semiconductor light-emitting element assembly
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  • Semiconductor light-emitting element assembly

Examples

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no. 1 example

[0019] Referring to FIGS. 1A to 1C, a semiconductor light emitting element assembly (hereinafter also referred to as "assembly") of a first embodiment of the present invention will be described. 1 shows a plan view of the first embodiment assembly, FIG. 1B shows a cross-sectional view taken along line I-I of FIG. 1A , and FIG. 1C shows a cross-sectional view taken along line II-II of FIG. 1A .

[0020] The assembly according to the present embodiment has a semiconductor light emitting element 1, a wiring board 19, a heat sink 23, a fastening portion 31, and a space maintaining portion. The components are described below.

[0021] (1) Semiconductor light emitting element

[0022] The semiconductor light-emitting element 1 has first and second leads 2 and 5, a semiconductor light-emitting element chip 3 that is bonded to the first lead 2 and wire-bonded to the second lead 5, and is fixed to the first and second leads through an insulating adhesive layer 7. The heat dissipation...

no. 3 example

[0046] A semiconductor light emitting element assembly according to a third embodiment of the present invention will be described with reference to FIGS. 3A to 3C. 3A shows an assembly plan view according to the third embodiment, FIG. 3B shows a cross-sectional view taken along line I-I of FIG. 3A , and FIG. 3C shows a cross-sectional view taken along line II-II of FIG. 3A .

[0047] The assembly according to the third embodiment is similar to that of the second embodiment except for the placement of the partition 33 . In the third embodiment, the number of partitions 33 is two. Two spacers 33 are placed on extension lines along the extension directions of the first and second leads 2 and 5 . Also, with the spacer 33 placed in such a position, deformation of the first and second leads 2 and 5 can be suppressed.

no. 4 example

[0049] A semiconductor light emitting element assembly according to a fourth embodiment of the present invention will be described with reference to FIGS. 4A to 4C. 4A shows an assembly plan view according to the fourth embodiment, FIG. 4B shows a cross-sectional view taken along line I-I of FIG. 4A , and FIG. 4C shows a cross-sectional view taken along line II-II of FIG. 4A .

[0050] The components according to the fourth embodiment are similar to those of the first embodiment except for the configuration of the semiconductor light emitting element 1 . In the fourth embodiment, the semiconductor light emitting element 1 has a plurality of light emitting modules 35 . Each light-emitting module 35 consists of first and second leads 2 and 5 , and a semiconductor light-emitting element chip 3 that is die-bonded to the first lead 2 and wire-bonded to the second lead 5 . A plurality of light emitting modules 35 are arranged along a direction perpendicular to the extending directi...

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Abstract

A semiconductor light-emitting element assembly includes: a semiconductor light-emitting element having first and second leads, a semiconductor light-emitting element chip die-bonded to the first lead and wire-bonded to the second lead, a metal body for heat dissipation fixed to the first and second leads via an insulating adhesive layer, and a reflector fixed to the first and second leads and reflecting light from the chip; a wiring board having an opening for receiving the reflector; a heat dissipator disposed on the metal body for heat dissipation; and a fastening part for fastening the heat dissipator and the wiring board, wherein the first and second leads are fixed to the wiring board so that the reflector is received in the opening, and an interval holding part for holding an interval between the heat dissipator and the wiring board.

Description

technical field [0001] The present invention relates to a semiconductor light-emitting element assembly, more particularly, to a semiconductor light-emitting element assembly capable of effectively dissipating heat. Background technique [0002] Referring first to FIG. 6, a surface mount type light emitting diode will be described as an example of a conventional semiconductor light emitting element (for example, see Japanese Laid-Open Patent Publication No. H11-46018). [0003] The light-emitting diode has an insulating substrate 51, a wafer bonding electrode pattern 53 and a second electrode pattern 55 extending from the upper surface of the insulating substrate 51 to the lower surface of the insulating substrate 51 via the side, and is fixed on the wafer bonding surface by a conductive adhesive 57. The LED element 59 on the electrode pattern 53 , the bonding wire 61 for connecting the LED element 59 and the second electrode pattern 55 , and the translucent resin assembly 6...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L33/54H01L33/56H01L33/62H01L33/64
CPCH05K1/021H01L33/64H05K2201/10106H01L2224/48091H01L2224/73265H01L2224/32245H01L2924/00014
Inventor 石仓卓郎伊藤富博
Owner SHARP KK
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