A convex pattern in which a plurality of substantially congruent projections composed of an
infrared absorbing material are arranged at a substantially constant
pitch is formed on the side of a photoreceptor that is irradiated with
infrared rays, or a concave pattern in which a plurality of substantially congruent holes are arranged at a substantially constant
pitch is formed in an
infrared absorption film disposed on the side irradiated with infrared rays, and the infrared rays incident on the photoreceptor are dispersed by the convex pattern or concave pattern. By this configuration, reflection of infrared rays is minimized, the
absorption efficiency of infrared rays is increased, and the sensitivity of the thermal-type infrared detection element is enhanced. This convex pattern can be formed using a common
semiconductor manufacturing device, and has excellent adhesion to the immediately underlying infrared absorption film. The reliability and uniformity of the thermal-type infrared detection element can therefore be enhanced.