This invention relates to a
photodetection device, etc., equipped with a structure that efficiently cools a CCD reading part and can realize a downsizing of the entire device. The
photodetection device comprises: a
semiconductor substrate having a back surface which serves as a light-incident surface, and a front surface which opposes the back surface and is provided with a CCD reading part that detects light propagating from the back surface; a cooling device cooling the CCD reading part; and a
package having a cavity that houses the
semiconductor substrate and cooling device. The
semiconductor substrate is fixed to a cavity bottom part of the
package via the cooling device, and at the back surface thereof, a portion corresponding to a region at which the CCD reading part is disposed, is made thin. The cooling device has a cooling surface contacting the front surface of the semiconductor substrate while covering the region at which the CCD reading part is disposed. The size of the cooling surface is larger than the region at which the CCD reading part is disposed and yet smaller than the front surface of the semiconductor substrate. Also,
electrode pads, disposed on the front surface of the semiconductor substrate and positioned at the
peripheral of the region covered by the cooling surface of the cooling device, and
package terminals provided on the package are electrically connected via bonding wires.