The invention relates to a
power module comprising a substrate (2), whose surfaces are provided with at least one
electrically conductive layer (4, 6), at least one active
semiconductor chip (8), which is electrically connected to an
electrically conductive layer (6), a film (12) consisting of an
electrically conductive material, which is in
close contact with the surfaces of the
semiconductor chips (8) of the electrically conductive layer (6) and the substrate (2) and is provided with planar printed conductors (16). According to the invention: the module is equipped with a second film (18), which is in
close contact with the surfaces of the printed conductors (16) and the first film (12); a passive
semiconductor chip (22) is applied to said second film (18), above the active
semiconductor chip (8) and is electrically connected to the planar printed conductor (16)
lying below by means of a window (14) that is configured in the second film (18); the module is equipped with a third film (24), which is in
close contact with the surfaces of the passive
semiconductor chip (22) and the second film (18) and said third film (24) is provided with a planar printed conductor (28), which is conductively connected to the conductive layer (6)
lying below the active
semiconductor chip (8). The invention thus provides a compact
power module that can comprise complex topologies.