30results about How to "Avoid overflow situations" patented technology

The invention discloses a solid-liquid separation device for photocatalytic treatment of volatile organic pollutants, relates to the technical field of photocatalytic treatment, and specifically includes a separation chamber, a blower and a gas collection bottle. A material guide pipe is installed above the separation chamber. The blower is installed on the left side of the separation chamber, and the input end and the output end of the blower are respectively flange-connected with an air inlet pipe and an air outlet pipe, and the end of the separation chamber is connected with a discharge pipe, and the end of the discharge pipe A liquid collection box is connected through it, and the gas collection bottle is installed on the right side of the separation chamber, and the top of the gas collection bottle is connected with a gas collection pipe through it. In this photocatalytic solid-liquid separation device for volatile organic pollutants, the end of the feed pipe is embedded in the inside of the feed pipe and is connected to the feed pipe in a flexible manner, which is convenient for users to adjust the gap between the feed pipe and the feed pipe. connection, and inject liquid volatile organic pollutants into the guide tube through external mechanical action or injection.

The golf club head making process includes the steps of preparation, butt jointing, presetting, machining and formation. First, casing, beating panel and hard welding material of different materials are prepared; and then, after the casing and the beating panel are contacted and the hard welding material is set in the holding position of the contact part, the semi-finished golf club head is heated to make the hard welding material flow into the gap between the casing and the beating panel. The made golf club head has one casing, one beating panel connected to the casing and hard welding material to combine the casing and the beating panel. The present invention can avoid the overflow of the hard welding material, raise the connection strength between the casing and the beating panel and raise assembling efficiency.

A method for repairing circuits of an embedded circuit board. First, embedded circuit boards are provided. Embedded circuit boards include dielectric layers and multiple circuits. The dielectric layer has a surface and a concave pattern. The circuits are located in the concave pattern, and some of the circuits have at least one defect. Then, the conductive fluid material is sprayed on the defect by jet printing to repair the circuit.

The invention discloses a chemical machinery for automatically conveying materials that prevents leakage of raw materials, comprising a chemical raw material storage tank, a feeding port, a connecting pipe, a damping spring and an embedded groove, and a driving motor is installed on the upper end of the chemical raw material storage tank , and the output end of the driving motor is connected with a rotating shaft, the outer wall of the rotating shaft is respectively fixed with a first stirring rod and a second stirring rod, the shock-absorbing spring is installed at the end of the second support rod, and the embedded groove is opened in the support Above the inside of the base, the side wall of the chemical raw material storage tank is provided with an anti-collision shell, the outer side of the chemical raw material storage tank is provided with a water storage tank, and the inside of the water storage tank is provided with a water pump. In the chemical machinery for automatic material delivery to prevent raw material leakage, the first stirring blade and the second stirring blade are arranged in a staggered manner, which can stir the chemical raw material inside the chemical raw material storage tank, so that the chemical raw material can be mixed evenly. In order to facilitate the subsequent production of the mixed chemical raw materials by the user.

The cooling device for computing equipment provided by the present invention includes: a base plate, a flow limiting plate and a cover body; the cover body is provided with a first hollow structure, the base plate is provided with a fin array, and the fin array is placed In the first hollow structure; the first hollow structure is provided with a first groove and a second groove, and the first groove is arranged opposite to the second groove; the restrictor plate is arranged on the between the fin array and the cover; the restrictor plate is provided with a first gap and a second gap; the first groove communicates with the fin array through the first gap, the The second groove communicates with the fin array through the second gap. The cooling device for computing equipment provided by the invention can avoid the overflow of the working fluid caused by the large water flow resistance in the gap between the fins, and improve the heat exchange efficiency.