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Method for repairing circuits of embedded circuit board

A circuit board and circuit technology, used in printed circuit components, secondary processing of printed circuits, metal pattern materials, etc., can solve problems such as open circuit, circuit short circuit, and waste of embedded circuit board production costs, so as to reduce waste, Avoid the effect of overflow

Inactive Publication Date: 2010-06-16
UNIMICRON TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] When the electroplating process is performed on the metal layer to form a circuit layer with traces or when the metal carrier board is reverse-pressed on the film, the traces have defects due to process variation or other factors, and this defect may cause the circuit. Electrical problems such as short circuit or open circuit
Since the line width of the embedded circuit is small, when the embedded circuit is found to be defective, the usual processing method is to directly scrap and discard it, thus making the production cost of the embedded circuit board a waste

Method used

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  • Method for repairing circuits of embedded circuit board
  • Method for repairing circuits of embedded circuit board
  • Method for repairing circuits of embedded circuit board

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Embodiment Construction

[0038] Figure 1A to Figure 1B It is a schematic cross-sectional view of a method for repairing lines of an embedded circuit board according to an embodiment of the present invention, Figure 1C for repair Figure 1B The top view enlarged schematic diagram of the local circuit of the embedded circuit board. Please refer to Figure 1A According to the method for repairing the circuit of an embedded circuit board in this embodiment, firstly, an embedded circuit board 100 is provided. The embedded circuit board 100 includes a dielectric layer 110 and a plurality of circuits 120a-120c ( Figure 1A Only three are schematically shown in ), wherein the dielectric layer 110 has a surface 112 and an indented pattern 114, the lines 120a-120c are located in the indented pattern 114 of the dielectric layer 110, and the line 120c has a defect 122a.

[0039] It is worth mentioning that the structure of the embedded circuit board 100 may only have a single circuit layer, or may have multi...

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Abstract

The invention relates to a method for repairing circuits of an embedded circuit board, which comprises the following steps of: firstly providing an embedded circuit board, wherein the embedded circuit board comprises a dielectric layer and a plurality of circuits, the dielectric layer is provided with a surface and a notched pattern, and the circuits are positioned in the notched pattern, the partial circuits are provided with at least one defect; and then, spray printing a conductive fluid material on the defects in a spray printing mode to repair the circuits.

Description

technical field [0001] The present invention relates to a circuit repair method, and in particular to a circuit repair method of an embedded circuit board. Background technique [0002] Today's circuit board technology has developed from a common non-embedded circuit board to an embedded circuit board. In detail, the characteristic of the common non-embedded circuit board is that the circuit protrudes from the surface of the dielectric layer, while the feature of the embedded circuit board is that the circuit is embedded in the dielectric layer. [0003] A conventional process for wiring an embedded circuit board includes the following steps. Firstly, a substrate with a metal layer and a metal carrier is provided. Next, a photoresist layer is coated on the metal layer. Then, exposing and developing the photoresist layer to form a patterned photoresist layer. Then, an electroplating process is performed on the metal layer to form a circuit layer, wherein the circuit layer...

Claims

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Application Information

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IPC IPC(8): H05K3/22H05K3/10H05K1/09
Inventor 曾子章陈俊谦
Owner UNIMICRON TECH CORP
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