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204results about How to "Avoid missed connections" patented technology

Component-incorporated wiring substrate and method of manufacturing the same

A component-incorporated wiring substrate is provided. Some embodiments include a plate-like component incorporated in a core substrate and a build-up layer having an insulation layer and a conductor layer disposed in alternating layers. The component has terminal electrodes formed at its opposite ends having a side surface and a main surface. An insulation layer disposed on the main surface of the component has via conductors formed therein which are connected to the side surfaces and the main surfaces of the respective terminal electrodes. The via conductors are tapered, such that their via diameter decreases in a direction toward the terminal electrode, and their via diameter at a position where they connect to the main surface is greater than a length of the main surface. Accordingly, the area of connection between the via conductors and the corresponding terminal electrodes is increased, improving connection reliability through enhancement of tolerance for positional deviation.
Owner:NGK SPARK PLUG CO LTD

Semiconductor device and method of fabricating the same

There is provided a semiconductor device including a semiconductor pellet having a plurality of bump electrodes on a surface thereof, a wiring board having a plurality of pad electrodes on a surface thereof, each one of the pad electrodes being engaged to an associated one of the bump electrodes when the wiring board is coupled to the semiconductor pellet, and a resin layer sandwiched between the semiconductor pellet and the wiring board for connecting them with each other therethrough, each of the bump electrodes being formed with one of a projection and a recess into which the projection is able to be fit, and each of the pad electrodes being formed with the other. For instance, the bump electrodes are formed by compressing a molten ball formed at a tip end of a gold wire onto the semiconductor pellet, and the projection is formed on the bump electrodes by cutting the gold wire so that a tip end portion of the gold wire leaves on the bump electrodes. In accordance with the above-mentioned semiconductor device, even if the resin layer was cracked to thereby weaken the engagement between the bump and pad electrodes, the electrical connection therebetween is ensured in sufficient condition.
Owner:NEC ELECTRONICS CORP

Organic el display device

An organic EL display device includes: thin film transistors that are arranged in respective pixels within a display area which are arranged in a matrix; a planarization film that is formed over the thin film transistor and made of an organic insulating material; contact electrodes that are connected to drains or sources of the respective thin film transistors through contact holes formed within the planarization film; contact hole planarization films that are arranged over the respective contact electrodes with which the contact holes are embedded, and made of an organic insulating material; a lower electrode that is formed to be electrically connected onto the contact electrodes, and formed over the contact hole planarization film; and an organic layer that is arranged over the lower electrode to cover the overall display area, and formed of a plurality of organic material layers including a light emitting layer.
Owner:JAPAN DISPLAY INC

Method, device and terminal for answering incoming call

The invention discloses a method, a device and a terminal for answering incoming calls, belonging to the technical field of terminals. The method comprises the following steps: after receiving an incoming call of a caller, a terminal answers the incoming call through an automatic incoming call answering function and communicates with the caller; if an instruction of a phone owner is received during the process of communicating with the caller, the terminal operates according to the instruction of the phone owner; if the instruction of the phone owner is not received during the process of communicating with the caller, the emergency degree of the incoming call is determined according to the communication content, and the terminal operates according to the determined emergency degree. According to the method, the terminal operates according to the determined emergency degree if no instructions of the phone owner are received during the process of communicating with the caller, so that not only the user needs not to afford extra expense, but also no important incoming call is omitted; and moreover if the instructions of the phone owner are received during the process of communicating with the caller, the terminal operates according to the instructions of the phone owner, so that the remote control to the incoming call is realized under the condition that the user cannot or is inconvenient to answer the incoming call.
Owner:HUAWEI DEVICE CO LTD

Mobile phone and method for automatically switching incoming call prompt of mobile phone

The invention discloses a mobile phone with function of automatically switching incoming call prompt modes, and a method for automatically switching incoming call prompt, which is applied to the mobile phone. The mobile phone at least comprises a main body, a control unit, a receiver and a sensor, wherein the control unit is arranged in the main body and at least comprises an incoming call prompt control module, and a plurality of incoming call prompt modes are preset in the incoming call prompt control module; and the receiver is used for receiving an incoming call signal and transmitting the incoming call signal to the control unit, and is positioned in the main body and electrically connected with the control unit. The incoming call prompt modes of the mobile phone can be automatically switched along with the posture state of the main body of the mobile phone, so a phenomenon that a user misses receiving an incoming call of the mobile phone is avoided, or untimely incoming call ringing of the mobile phone can be avoided. Therefore, the practicability and convenience of the mobile phone are greatly improved.
Owner:INVENTECSHANGHAI TECH
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