1257results about "Structural fixed capacitor combinations" patented technology

A TANK filter is provided for a lead wire of an active medical device (AMD). The TANK filter includes a capacitor in parallel with an inductor. The parallel capacitor and inductor are placed in series with the lead wire of the AMD, wherein values of capacitance and inductance are selected such that the TANK filter is resonant at a selected frequency. In a preferred form, the TANK filter reduces or even eliminates the use of ferro-magnetic materials, and instead uses non-ferromagnetic materials so as to reduce or eliminate MRI image artifacts or the force or torque otherwise associated during an MRI image scan.

A tank filter is provided for a lead wire of an active medical device (AMD). The tank filter includes a capacitor in parallel with an inductor. The parallel capacitor and inductor are placed in series with the lead wire of the AMD, wherein values of capacitance and inductance are selected such that the tank filter is resonant at a selected frequency. A passageway through the tank filter permits selective slidable passage of a guide wire therethrough for locating the lead wire in an implantable position. The Q of the inductor may be relatively maximized and the Q of the capacitor may be relatively minimized to reduce the overall Q of the tank filter to attenuate current flow through the lead wire along a range of selected frequencies. In a preferred form, the tank filter is integrated into a TIP and / or RING electrode for an active implantable medical device.

A one-piece cylindrical bandstop filter for medical lead systems incorporates parallel capacitive and inductive elements in a compact cylindrical configuration. The compact cylindrical configuration of the bandstop filter does not add significantly to the size or weight of the medical lead system. Preferably, the bandstop filters are of biocompatible materials or hermetically sealed in biocompatible containers. The parallel capacitive and inductive elements are placed in series with the medical lead system, and are selected so as to resonate at one or more selected frequencies, typically MRI pulsed frequencies.

Chip capacitors 20 are provided in a printed circuit board 10. In this manner, the distance between an IC chip 90 and each chip capacitor 20 is shortened, and the loop inductance is reduced. In addition, the chip capacitors 20 are accommodated in a core substrate 30 having a large thickness. Therefore, the thickness of the printed circuit board does not become large.

A microwave tunable filter having some advantages as follows: a) the integration of MEMS tunable filter and MMIC; b) the very low signal transmission loss and low dispersion; and c) the drastic variation and linear characteristic of frequency by means of MEMS capacitor and an external control signal. The microwave tunable MEMS filter includes a plurality of unit resonant cells, each unit resonant cell being formed by various serial and parallel combination of an inductor, a capacitor, a transmission line, and a variable MEMS capacitor, whereby capacitance variation of the variable MEMS capacitor in the unit resonant cell converts a resonant frequency of the unit resonant cell to thereby convert a center frequency of the filter.

A tank filter is provided for a lead wire of an active medical device (AMD). The tank filter includes a capacitor in parallel with an inductor. The parallel capacitor and inductor are placed in series with the lead wire of the AMD, wherein values of capacitance and inductance are selected such that the tank filter is resonant at a selected frequency. A passageway through the tank filter permits selective slidable passage of a guide wire therethrough for locating the lead wire in an implantable position. The Q of the inductor may be relatively maximized and the Q of the capacitor may be relatively minimized to reduce the overall Q of the tank filter to attenuate current flow through the lead wire along a range of selected frequencies. In a preferred form, the tank filter is integrated into a TIP and / or RING electrode for an active implantable medical device.

A small inductor built-in electronic part whose Q is high is provided. An LC resonator comprises a laminate composed of a number of laminated electronic layers. Capacitor electrodes, common electrodes, and ground electrodes are formed between the dielectric layers. Two via holes are formed penetrating through the plurality of intermediate dielectric layers in the thickness direction thereof leaving a space therebetween. These via holes act as inductor elements.

An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.

The quick recharge energy storage device has a sufficient capacity due to the combination of a micro-battery and at least one micro-supercapacitor connected between two terminals of an integrated circuit. The integrated circuit, powered by the micro-battery, monitors high-speed (less than one second) charge of the micro-supercapacitors from an external energy source. The micro-supercapacitor can be connected in parallel with the micro-battery so as to subsequently recharge the micro-battery during the necessary time. The micro-battery provides a sufficient energy capacity, while the micro-supercapacitors allow high recharging speeds compatible with various applications (smart cards, smart labels, micro-system power supply, etc . . . ). The micro-battery and micro-supercapacitors are preferably formed on the same substrate, either side by side or stacked. Series connection of several micro-supercapacitors provides sufficient voltage for charging the micro-battery.

One or more inductors and one or more capacitors are physically disposed relative to one another in series and are electrically connected to one another in parallel to form a bandstop filter. Chip inductors and chip capacitors having spaced apart conductive terminals are physically arranged in end-to-end abutting relation to minimize electrical potential between adjacent conductive terminals. The bandstop filter may be hermetically sealed within a biocompatible container for use with an implantable lead or electrode of a medical device. The values of the inductors and the capacitors are selected such that the bandstop filter is resonant at one or more selected frequencies, such as an MRI pulsed frequency.

A vertical electrical device includes a region in a substrate extending from a surface of the substrate, the region having an inner wall and an outer wall circumscribing the inner wall. An inner electrically conductive layer is disposed on the inner wall and an outer electrically conductive layer is disposed on the outer wall, with an electrically insulative material disposed between the inner and outer layers. An electrical conductor in the substrate is bounded by the inner electrically conductive layer.

In various embodiments, a bonded structure is disclosed. The bonded structure can include an element and a passive electronic component having a first surface bonded to the element and a second surface opposite the first surface. The passive electronic component can comprise a first anode terminal bonded to a corresponding second anode terminal of the element and a first cathode terminal bonded to a corresponding second cathode terminal of the element. The first anode terminal and the first cathode terminal can be disposed on the first surface of the passive electronic component.

A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.

A wiring board comprising: a board core (11) having a core main surface (12) and a core reverse surface (13); a capacitor (101, 101A, 101B, 101C, 101D, 101E, 101F, 101G, 101H, 101J, 1101, 1101′, 1101″, 1101′″, 1101″″, 1101′″″) having a capacitor main surface (102) and a capacitor reverse surface (103) and having a structure in which first inner electrode layers (141) and second inner electrode layers (142) are alternately laminated and arranged via a dielectric layer (105), the capacitor (101, 101A, 101B, 101C, 101D, 101E, 101F, 101G, 101H, 101J, 1101, 1101′, 1101″, 1101′″, 1101″″, 1101′″″) being accommodated in the board core (11) in a state in which the core main surface (12) and the capacitor main surface (102) are oriented on a same side; and a wiring laminated portion (31) having a structure in which interlayer insulating layers (33, 35) and conductor layers (42) are alternately laminated on the core main surface (12) and the capacitor main surface (102), wherein an inductor (251, 252, 253) or a resistor (301, 302, 311, 312, 321, 322) is formed on or in the capacitor (101, 101A, 101B, 101C, 101D, 101E, 101F, 101G, 101H, 101J, 1101, 1101′, 1101″, 1101′″, 1101″″, 1101′″″).

A variable capacitor is formed by a multilayer circuit board having a plurality of dielectric layers; a first conductive plate, provided within the multilayer circuit board, for serving as one electrode of the variable capacitor; a second conductive plate, provided within the multilayer circuit board, for serving as the other electrode of the variable capacitor; a plurality of third conductive plates provided between the first conductive plate and the second conductive plate; and a plurality of switching means provided for grounding the third conductive plates selectively.

Chip capacitors 20 are provided in a printed circuit board 10. In this manner, the distance between an IC chip 90 and each chip capacitor 20 is shortened, and the loop inductance is reduced. In addition, the chip capacitors 20 are accommodated in a core substrate 30 having a large thickness. Therefore, the thickness of the printed circuit board does not become large.

A one-piece cylindrical bandstop filter for medical lead systems incorporates parallel capacitive and inductive elements in a compact cylindrical configuration. The compact cylindrical configuration of the bandstop filter does not add significantly to the size or weight of the medical lead system. Preferably, the bandstop filters are of biocompatible materials or hermetically sealed in biocompatible containers. The parallel capacitive and inductive elements are placed in series with the medical lead system, and are selected so as to resonate at one or more selected frequencies, typically MRI pulsed frequencies.

A monolithic capacitor structure includes opposed and overlapping plates within a dielectric body, which are arranged to form a lower frequency, higher value capacitor. Other conductive structure is located either inside the dielectric body or on an external surface thereof and is effective to form a higher frequency, lower value capacitor in parallel with the lower frequency, higher value capacitor. The resulting array of combined series and parallel capacitors integral with the dielectric body provides effective wideband performance in an integrated, cost-effective structure.

There is a provided a magnetic and dielectric composite electronic device, comprising: a first region with a plurality of magnetic material sheets being layered; a second region with a plurality of dielectric material sheets being layered; and a third region as a middle layer interposed between the first region and the second region, including a Zn—Ti based material to prevent diffusion of the materials during co-firing of the first region and the second region, and the first region, the second region and the third region are integrally formed in a single body. In accordance with the present invention, the low pass filter including the function of the varistor is realized to obtain the EMI function and the ESD control effect. Furthermore, the one chip electronic device having the composite functions is manufactured by a simple process, and the interdiffusion between the different materials forming the magnetic and the dielectric parts is prevented to secure the durability and electrical characteristics of the product.

The present invention relates to a passive electronic component architecture employed in conjunction with various dielectric and combinations of dielectric materials to provide one or more differential and common mode filters for the suppression of electromagnetic emissions and surge protection. The architecture allows single or multiple components to be assembled within a single package such as an integrated circuit or connector. The component's architecture is dielectric independent and provides for integration of various electrical characteristics within a single component to perform the functions of filtering, decoupling, fusing and surge suppression, alone or in combination.

A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic electronic component are coupled to each other. The multilayer ceramic capacitor includes a first ceramic body comprising dielectric layers and internal electrodes, the internal electrodes having at least one of the dielectric layers interposed therebetween; and first and second external electrodes disposed on first and second end portions of the first ceramic body. The ceramic electronic component includes a second ceramic body coupled to a lower portion of the multilayer ceramic capacitor and made of ceramic; and first and second terminal electrodes disposed on first and second end portions of the second ceramic body and connected to the first and second external electrodes, and the multilayer ceramic capacitor and the ceramic electronic component have different lengths.

A multilayer capacitor having a low parasitic inductance includes a first electrode, a second electrode, a dielectric, a first contact, and a second contact. The first electrode is substantially rectangular and it includes a first contact finger. The dielectric has a first surface and a second surface, wherein the first and second surfaces are situated opposite with each other. The first surface of the dielectric is coupled with the first electrode. The second electrode is substantially rectangular and it includes a first contact finger. The second electrode is coupled to the second surface of the dielectric. The first contact is coupled to the first contact finger of the first electrode. The second contact is coupled to the first contact finger of the second electrode. The second contact is situated at a minimal space from the first contact to reduce the parasitic inductance.

Compact and integral arrangements for an energy-conditioning arrangement having various predetermined energy pathways utilized in part for the purpose of conditioning energies of either one or multiple of circuitry that would otherwise detrimentally effect a predetermined application having a single or multiple, circuitry systems. Some energy-conditioning arrangement variants can be operable to provide multiple energy-conditioning operations.

An embedded MIM capacitor in a logic circuit and method for forming the same are disclosed. The device includes a substrate, a bottom electrode, a dielectric film, and a top electrode. The substrate comprises an insulator region. The bottom electrode comprises a first conductor and overlies the insulator region. The dielectric film overlies the bottom electrode, remaining parts of the bottom plate exposed. The top electrode comprises a second conductor and overlies the dielectric film. The dielectric film lines sidewalls and bottom of the top electrode.

A modular EMI filtered terminal assembly for an active implantable medical device (AIMD) includes a hermetic terminal subassembly having at least one conductor extending through an insulator in non-conductive relation with the AIMD housing, and a feedthrough capacitor subassembly disposed generally adjacent to the hermetic terminal assembly. The feedthrough capacitor subassembly includes a conductive modular cup conductively coupled to the AIMD housing, and a feedthrough capacitor disposed within the modular cup. A first electrode plate or set of electrode plates is conductively coupled to the conductor, and a second electrode plate or set of electrode plates is conductively coupled to the modular cup.

A module incorporating a capacitor, the module including a circuit board and a layer incorporating a capacitor, wherein the circuit board includes a wiring layer and a via contact for providing electrical conductivity to a cathode and an anode of the capacitor. The layer incorporating the capacitor includes a ferromagnetic layer integrated with at least a portion of a surface of the capacitor, and in the circuit board or the layer incorporating the capacitor, a coil is wound around the capacitor, or an inductor component is disposed in parallel with the capacitor. Accordingly, a module incorporating a capacitor in which miniaturization, a higher density and a reduced thickness have been achieved, as well as a method for producing the module and a capacitor used for the module, are provided.

The present invention provides a multilayered electronic component (110) having improved thermolytic effect for an electronic circuit module (100), facilitating the realization of a miniaturization of the electronic circuit module (100). The multilayered electronic component (110) is provided with a first surface (111), a second opposite surface and side surfaces. A heat dissipation pattern (116) is formed in the multilayered electronic component (110) in a vicinity of the first surface (111) thereof on which a plurality of lands (114) is formed, in such a way that at least one land (114) is electrically connected to the heat dissipation pattern (116). A semiconductor chip (140) is mounted on the first surface (111) of the multilayered electronic component (110), thereby forming the electronic circuit module (100). Heat induced in the semiconductor chip (140) is emitted from the heat dissipation pattern (116), which will, in turn, make a thermolytic effect of the electronic circuit module (100) be improved.

Internal dielectric layers isolated between them by a ceramic layer are arranged in a dielectric body, other internal conductor layers also isolated between them by a ceramic layer are arranged in the dielectric body by being isolated from the above internal conductor layers. Each of the all internal conductor layers is formed with a cut part, and a channel part is formed around the cut part, and the channel parts are arranged so that currents flow in mutually reverse directions between channel parts of internal conductor layers adjoining across a ceramic layer. Consequently, the equivalent serial inductance of the multilayer capacitor is largely reduced and fluctuations of a power source voltage of a CPU is made small.