The invention provides an efficient
inspection method for inspecting a hermetically sealed
package for pinholes, in which when a hermetically sealed
package whose contents such as
electrically conductive fluid or food are covered with an electrically insulating film is inspected for pinholes by using a
high voltage, the inspection can be achieved with an extremely simple procedure while fully preventing occurrence of misoperations due to the
atmosphere such as
humidity during the inspection.In a hermetically sealed
package in which contents 1 such as
electrically conductive fluid are covered with an electrically insulating film 2, an
electrical conductor 4 derived from a
voltage output terminal of a DC
high voltage power supply 6 is put into contact with or proximity to a side face portion 31 of the hermetically sealed package, by which the contents 1 in the hermetically sealed package 3 are electrified. Next, a lead wire 8 is connected to a connecting terminal 5a of an
electrode 5 put into
close contact with or opposed proximity to an inspection-object portion 3a of the package 3 where pinholes are most likely to occur, and the lead wire 8 is grounded. Then, a
discharge current derived from the inspection-object portion 3a that flows only when a pinhole is present is detected by a
discharge current
detector 7, by which the presence or absence of a pinhole is detected depending on the presence or absence of the
discharge current. In this procedure, the inspection can be made by placing the package on a support
electrode derived from an AC
high voltage power supply and electrifying the contents.