244results about "Electrical connection between arm and support" patented technology

A disk drive comprises a housing including a base; a disk rotatably attached to the base; a printed circuit board coupled to the base and including a plurality of circuit board pads; a head stack assembly pivotally coupled to the base about a pivot axis and a flex-to-board connector. The head stack assembly includes a head for reading and writing to the disk and a flex cable assembly that includes a flexible film including a plurality of conductive traces that are electrically coupled to the head. The flexible film includes a connecting portion in which each of the plurality of conductive traces defines a trace pad. Each trace pad is disposed on a surface of the flexible film that is generally parallel to the pivot axis. The flex-to-board connector is attached to the base and is configured to couple to the connecting portion of the flexible film and to maintain the surface of the flexible film on which the trace pads are disposed in an orientation that is generally parallel to the pivot axis. The flex-to-board connector includes a plurality of conductive fingers, each configured to electrically connect one of the trace pads to a corresponding one of the plurality of circuit board pads.

A method and apparatus for actively controlling the gram load on a disk drive suspension assembly and to a disk drive using the present disk drive suspension assembly. The gram load can be actively changed by changing the applied voltage to one or more multi-layer piezoelectric actuators attached to the head suspension. The active gram control system allows the gram load to be changed on a non-permanent basis and to control the gram load to a much finer scale than can be accomplished using conventional techniques. By attaching the first and second ends of the piezoelectric actuator to discrete locations on the load beam, while the portion of the piezoelectric actuator between the first and second ends remains unattached to the load beam, a force non-parallel to the load beam can be applied to the head suspension.

Terminals of a flexible printed circuit board and terminals of a wiring trace in a head suspension assembly are to be connected with each other by soldering without causing a soldering defect. In an embodiment, a terminal structure of a multi-connector in a wiring trace which includes an insulating layer and a conductor pattern portion formed on a surface of the insulating layer is provided with exposed portions of terminals exposed from apertures formed in part of the insulating layer and is also provided with lining portions adjacent to the exposed portions in a longitudinal direction of the conductor pattern portion and bonded to the insulating layer. Even if terminals of the multi-connector are cracked when soldered, not only conductivity is ensured, but also it is possible to strengthen the terminals, because the lining portions of the terminals are bonded to the insulating layer.

A carriage assembly of a hard disk drive is constructed so that the bonding of flying leads of a long tail suspension circuit board and bonding terminals of a flexible printed circuit board can be carried out uniformly and reliably, and the problem of the flying leads breaking when the flying leads are pulled off the bonding terminals does not occur. The flexible printed circuit board is attached to a reinforced part by an adhesive in which spacers with a substantially equal particle diameter are mixed, and the flying leads and the bonding terminals are bonded together by ultrasonic bonding by applying ultrasonic vibration in a state where the flying leads are pressed onto the bonding terminals. In addition, an insulating film is provided on an opposite surface of the flying leads to the surface bonded to the bonding terminals, and during the ultrasonic bonding, ultrasonic vibration is applied in a state where the flying leads are pressed via the insulating film onto the bonding terminals.

A method for forming an electrical interconnect to the spring metal layer in an integrated lead suspension or suspension component of the type having a multi-layer structure including a spring metal layer and a conductor layer separated by a dielectric insulator layer. The method includes forming an aperture through at least one of either the spring metal and conductor layers, and optionally through the dielectric layer, at an interconnect site. A first mass of malleable conductive metal is inserted into the aperture. The mass of metal is then coined to form a stud that engages at least the spring metal layer at the interconnect site.

A piezoelectric element 13 has a common electrode 19 that receives electricity from a terminal 57. The terminal 57 has a through hole 67 and an electric insulating layer 61. The piezoelectric element 13 is arranged so that the common electrode 19 faces the electric insulating layer 61 of the terminal 57. A liquid stopper 69 is formed around the through hole 67 so as to come between the common electrode 19 and the terminal 57 when the common electrode 19 and terminal 57 are set to face each other. A liquid conductive adhesive 71 is injected into the through hole 67 to fill a gap defined by the liquid stopper 69 between the terminal 57 and the common electrode 19 and secure electric connection between the terminal 57 and the common electrode 19. This configuration improves the reliability of wiring to the piezoelectric element and prevents the piezoelectric element from being damaged.

A fixing member is spaced from a head actuator by a predetermined distance. A flexible printed circuit board extends at least from the head actuator to the fixing member. The flexible printed circuit board is superposed on the surface of the fixing member. A viscoelastic layer and a protecting layer are overlaid on the surface of the flexible printed circuit board. A clip clips all the fixing member, the flexible printed circuit board, the viscoelastic layer and the protecting layer together. When a head slider is positioned, the head actuator changes its attitude relative to a recording disk. The inertial force based on the rotation causes the first flexible printed circuit board to vibrate when the actuator block stops rotating. The viscoelastic layer serves to absorb this residual vibration of the first flexible printed circuit board. Vibration of the flexible printed circuit board can be suppressed.

A plurality of bonding structures and their forming methods for bonding a FPC to a bonding pad, in particular a bonding pad of a wireless suspension in a head gimbal assembly, using anisotropic conductive adhesive; such structures eliminate the spring-back force in typical anisotropic bonding to ensure durable bonding. At the same time, these structures also allow for reworkability under which the bonded parts can be separated easily.

An apparatus and method for reducing heat absorption around solder pads on an electrical lead suspension (ELS). The method provides a base-metal layer having at least one opening. A dielectric layer is also provided above the base-metal layer, the dielectric layer covering a portion of the base-metal layer and at least one of the openings in the base-metal layer. A signal conductive layer is provided above dielectric layer. The signal conductive layer carries at least one solder pad portion, wherein the solder pad portion is placed above the portion of the dielectric layer such that the solder pad portion does not align with the at least one opening in the base-metal layer. In so doing, the heat absorption with respect to the base-metal layer is reduced.

Interventional procedures on the carotid arteries are performed through a transcervical access while retrograde blood flow is established from the internal carotid artery to a venous or external location. A system for use in accessing and treating a carotid artery includes an arterial access device, a shunt fluidly connected to the arterial access device, and a flow control assembly coupled to the shunt and adapted to regulate blood flow through the shunt between at least a first blood flow state and at least a second blood flow state. The flow control assembly includes one or more components that interact with the blood flow through the shunt.

A module substrate includes an insulating substrate, a circuit pattern formed on at least a main surface of the insulating substrate, a protection film formed on the main surface of the insulating substrate including the circuit patter such as to expose a mount region of the circuit pattern, an active element part mounted on the mount region of the circuit pattern, a fluororesin film formed on the protection film at least in a vicinity of the mount region of the active element part, and an underfill filled between the active element part and the mount region of the circuit pattern.

A method of assembly a dual stage actuated suspension includes either applying an adhesive to a microactuator motor and then B-staging, it or applying an adhesive that has already been B-staged such as in film adhesive form, then assembling it to a microactuator and then finishing the adhesive cure. The method allows greater control over how much adhesive is used, and greater control over spread of that adhesive, than traditional liquid epoxy dispense methods. Additionally, a suspension is provided that has a wrap-around electrode such that both the driving voltage and the ground, which are normally connected at different sides of a PZT, can be connected at the same side of the PZT, thus simplifying electrical connections to the PZT.