136results about "Abrading process" patented technology

A variety of techniques may be employed, alone or in combination, to enhance contact between a processed substrate and applied megasonic energy. In accordance with one embodiment of the new invention, the vibration plate is brought into intimate contact with one surface of the substrate, while cleaning or processing fluid contacts the other. In accordance with an alternative embodiment of the present invention, a reflecting surface may be provided to cause emanated energy to be reflected back into the near field and make it more uniform. In accordance with another alternative embodiment of the present invention, energy may be transferred across a substrate bounded on both sides by liquid with incidence of megasonic energy that is either normal to the substrate surface or within a critical range of incident angles. In yet another embodiment, generated dilatational waves may be converted to surface waves prior to contacting the substrate.

An abrasive super-finishing method for workpieces, such as metallic thin-film magnetic discs, employs a polishing / texturing material having a backing, such as synthetic resin film or woven material or non-woven cloth, and a layer which can hold abrasive grains on the backing, such as flocked fibre or a porous polymer foam, on one surface of the backing. An electrolytic solution in which abrasive grains are suspended is supplied to the polishing / texturing material to conduct polishing or texturing of the workpiece surfaces. The workpiece is connected to an anode and a pressure roller or a cathode bar is connected to a cathode. A voltage is applied between the workpiece and the pressure roller or cathode bar to conduct simultaneously electrolytic polishing and abrasive polishing / texturing.

A polishing body, e.g., pad (200, 230, 260, 300) or belt (400, 500) having a polishing layer (214, 404) that includes a backmixing region (202, 232, 262, 308, 416, 508) wherein backmixing can occur within a slurry (116) between a wafer (204, 234, 264, 304, 408), or other article, and the polishing layer under certain conditions. The polishing layer includes a first groove configuration (206, 236, 266, 312, 428, 504) within the backmixing region and a second grove configuration (208, 238, 268, 320, 432, 520) outside of the backmixing region that is different from the first groove configuration. The first groove configuration is designed based upon whether or not the presence of spent slurry within the backmixing region is detrimental or beneficial to polishing the wafer.

A conductive polishing pad that includes one or more anodes and one or more cathodes formed at or near the polishing surface of a polishing pad. The anodes and cathodes are connected to a wiring network that is part of an electrical connector system that allows for a current source to be connected to the polishing pad and provide a current to the anodes and cathodes even if the polishing pad is moving relative to the current source. An electrolytic polishing fluid introduced between the polishing surface and the metal layer of a wafer forms an electrical circuit between the anode, cathode and the metal layer. The conductive polishing pad allows for electrochemical mechanical polishing (ECMP) to be performed on a conventional chemical mechanical polishing (CMP) tool.

In a polishing apparatus, a polishing tool including abrasive particles and a binder for bonding together the abrasive particles is pressed against a substrate to polish the substrate. The polishing apparatus has a light source for irradiating a polishing surface with light rays for weakening a bond force of the binder for bonding together the abrasive particles, and a waste matter removing mechanism for forcefully removing waste matter produced by polishing or waste matter produced by irradiation. By irradiating the polishing surface with the light rays, dressing of the polishing surface is performed, and products resulting from dressing and the like are removed. The polishing apparatus supplies abrasive particles to the polishing surface stably by dressing and allows high-speed polishing of the substrate.

A handheld instrument for minimizing pain during administration by injection of a liquid, such as, an anesthetic that has a main body, a vibration unit mounted in the main body when initiated to cause the main body to vibrate, and a detachable tip cantilever mounted on the main body to vibrate with it, the tip having a free end characterized by a bifurcation to form two spaced projections defining a space between them, whereby the spaced projections can be placed in proximity to, adjacent to and bracketing a preselected injection site on a human or animal and the tissue at said preselected injection site and vibrated while an injection is given.

Methods and compositions are provided for the chemical mechanical planarization of ruthenium. The method includes polishing the ruthenium layer using a low contact pressure and exposing the ruthenium layer to a planarization composition while polishing. The planarization composition comprises a dispersing medium and a plurality of abrasive particles. The method further includes removing the ruthenium of the ruthenium layer as a ruthenium hydroxide if the pH of the composition is in the range of from about 8 to about 12. The planarization composition may further comprise an oxidizing agent, with the ruthenium removed as a ruthenium hydroxide if the pH of the composition is in the range of from about 2 to about 14. The planarization composition may further comprise a complexing agent, with the ruthenium transformed into an ionic state and removed as a ruthenium complex if the pH of the composition is no greater than about 2.5.

New, versatile finishing surfaces are described. Unitary finishing elements having discrete finishing members attached to unitary resilient body are disclosed for finishing microdevices such as semiconductor wafers. Finishing surfaces such as discrete finishing members can be comprised of a multiphase polymeric composition. The new unitary finishing elements have lower cost to manufacture and high precision. The unitary finishing elements and finishing surfaces can reduce unwanted surface defect creation on the semiconductor wafers during finishing.

In a process for the profiling of a grinding worm (1) with at least two grinding width zones (4, 6) with differently modified thread profile for the grinding of spur and helical gears with three-dimensionally modified flank profile, the grinding width zones (4, 6) are arranged overlapping in order to gain optimum exploitation of the grinding worm width (3). In one variant, profiling of the grinding worm (1) is performed with an abrasive coated profiling gear (25) with a tooth flank geometry and facewidth differing from that of the workpiece to be ground. By suitable selection of the diagonal ratio and the allocation of the width zones (28, 29) of the profiling gear (25) to the grinding width zones (4, 6) of the grinding worm (1), it is possible to adapt the modifications of the grinding worm flanks to the requirements of the workpiece without having to alter the flank geometry of the profiling gear (25). In another variant the grinding worm (1) is profiled in a first stage across its entire width (3) with the desired profile form of the roughing zone, and in a second stage the finish grinding zone (36, 37) and the adjacent transition zones (34, 35) of the right and left flanks of the grinding worm (1) are finish profiled by means of NC controlled line by line profiling with a form dressing roll (40).

An apparatus and method of removing scale from the surfaces of processed sheet metal employs high pressure jets of water directed from nozzles positioned in close proximity to the sheet metal surfaces.

The electro-chemical machining apparatus of this invention is designed to smoothing a metal film by efficiently reducing initial rough surface and removing excessive metal film with reduced damages to the metal film. For this end, the electro-chemical machining apparatus performs electro-chemical machining of an object to be machined having a metal film on the surface to be machined. Such apparatus has a means for holding the object to be machined, a wiper for wiping the surface of the object to be machined, a means for supplying electrolytic solution onto the surface of the object to be machined, a first electrode disposed at a position opposed to the surface of the object to be machined, a second electrode disposed at a peripheral portion on the surface of the object to be machined, and a power supply for causing electrical current to flow between the second electrode on the surface of the object to be machined and the first electrode.

A gear grinding machine, a method for dressing a threaded grinding wheel, and a method for grinding a work are disclosed. A dressing tool is rotated in a vertical plane, with its position being fixed. The position of a threaded grinding wheel is NC-controlled, whereby the dressing tool is brought into contact with the starting point of the thread of the threaded grinding wheel at a somewhat lower surface of the circumferential surface of the threaded grinding wheel and, in accordance with the rotation of the threaded grinding wheel, the position of contact of the dressing tool with the threaded grinding wheel is moved along the circumferential surface of the threaded grinding wheel.

A centerless grinder for grinding an elongated workpiece includes a grinding wheel having a working surface with a plurality of raised areas extending circumferentially around at least a portion of the working surface. A platform is provided having an elongated top surface for supporting the workpiece substantially adjacent to the working surface of the grinding wheel and a front surface with a plurality of lateral grooves for receiving the raised areas on the working surface of the grinding wheel such that movement of the platform toward the working surface into a working area adjacent to the grinding wheel enables the raised areas to pass into the lateral grooves and grind the workpiece. The centerless grinder further includes a first spindle and collet in front of the working area and a second spindle and collet behind the working area, for grinding both ends of an elongated workpiece without removing the workpiece from the grinder, and a wire spool assembly for grinding wire stock directly from the wire spool.

The invention is directed to chemical-mechanical polishing pads comprising a transparent window. In one embodiment, the transparent window comprises an inorganic material and an organic material, wherein the inorganic material comprises about 20 wt. % or more of the transparent window. In another embodiment, the transparent window comprises an inorganic material and an organic material, wherein the inorganic material is dispersed throughout the organic material and has a dimension of about 5 to 1000 nm, and wherein the transparent window has a total light transmittance of about 30% or more at at least one wavelength in the range of about 200 to 10,000 nm. In yet another embodiment, the transparent window comprises an inorganic / organic hybrid sol-gel material. In an additional embodiment, the transparent window comprises a polymer resin and a clarifying material, wherein the transparent window has a total light transmittance that is substantially higher than a window comprising only the polymeric resin.

To prepare a surface with a surface preparation device, an apparatus including a mount, a platform, and a suspension system is utilized. The mount supports and positions the surface preparation device. The platform moves the apparatus. The suspension system is disposed between the mount and the platform and controls an amount of force pressing the mount towards the surface. The suspension system and mount are operable to position the surface preparation device in contact with the surface.

A porous polishing pad is useful for polishing semiconductor substrates. The porous polishing pad has a porous matrix formed from a coagulated polyurethane and a non-fibrous polishing layer. The non-fibrous polishing layer has a polishing surface with a pore count of at least 500 pores per mm2 that decreases with removal of the polishing layer; and the polishing surface has a surface roughness Ra between 0.01 and 3 μm.

A grinder assembly (10) contacts a tire (T) supported by a frame (F) relative to the tire (T). The grinder assembly (10) includes at least one section, and a vertical repositioning system (118) supporting the at least one section. The vertical repositioning system (118) enables the at least one section to be vertically repositioned relative to the tire (T). The at least one section includes a grinding head (24), a radial positioning system (18) supporting the grinding head (24) for radial movement with respect to the tire (T), and a tilt adjuster (90) provided adjacent the grinding head (24) to provide for pivotal movement thereof. The vertical repositioning system (118) includes at least one rail extending along the frame (F), and a rail carriage supporting the at least one section on the at least one rail, the rail carriage being vertically repositionable along the at least one rail.

The present invention provides a hobbing machine. The hobbing machine includes a clamp fixture adapted to retain a gear blank. A motor is operatively connected to the clamp fixture and is configured to rotate the clamp fixture and the gear blank together at a predetermined speed. A rotatable cutter is translatable into engagement with the gear blank and is configured to cut the gear blank and thereby produce a plurality of gear teeth. A de-burring tool is translatable into engagement with the gear blank and is configured to remove burrs from the gear blank as the gear teeth are being cut. A motorized spindle is operatively connected to the de-burring tool, and is configured to power and rotate the de-burring tool at a predefined speed to optimize the removal of the burrs.

The present invention describes an apparatus that includes a polish pad, the polish pad including a first through-opening; a vertical distribution layer located below the polish pad, the vertical distribution layer connected to the through-opening; a lateral distribution layer located below the vertical distribution layer, the lateral distribution layer connected to the vertical distribution layer; and a slurry dispense located over a front-side of the polish pad, the slurry dispense to provide a slurry to be transported through the polish pad to the lateral distribution layer.The present invention further describes a method including dispensing a slurry at a front-side of a polish pad; flowing the slurry to a location below the polish pad; flowing the slurry upwards and outwards, towards edges of the polish pad; and distributing the slurry to an upper surface of the polish pad.