112 results about "Active edge" patented technology

The present invention comprises a distal rest pad for supporting a portion of a wafer seated on an end effector. In one embodiment, the rest pad includes a bottom support pad and an edge stop. Each element is mounted separately to the distal end of a support plate. The bottom support pad includes an inclined surface that transitions to a substantially horizontal surface at its distal end. The edge stop has a substantially vertical wafer contact surface that the peripheral edge of a wafer eventually contacts as the wafer is urged towards the distal rest pad. In another embodiment, the bottom support pad comprises an inclined surface. In yet another embodiment, the distal rest pad comprises a single structure. This distal rest pad includes a backstop portion and a bottom support separated by a particle collection groove. The bottom support may include an inclined lead-in surface that transitions into a flat contact surface or only comprise an inclined lead-in surface.

Electrosurgical devices for ablating tissue and methods of making the same are disclosed. The electrosurgical devices include an electrode with a lumen for aspirating gasses and debris produced during surgery. The electrode also includes a plurality of upper active edges for ablating tissue in an electrosurgical procedure. The upper active electrodes are spaced apart to form a filter that filters out large tissue particles from being aspirated into the lumen. The upper active edges ablate the large particles to form particles that can pass into the lumen. A lower active edge is formed at the terminal end of the lumen for ablating tissue being aspirated into the lumen. The lower active edge prevent tissue particles from occluding the opening to the lumen.

The present invention generally relates to an end effector that utilizes a gripping mechanism to grip a peripheral edge of the wafer and secure the wafer to the end effector. In one embodiment, the gripping mechanism includes a pair of gripper arms that pivot between a wafer-loading position and a wafer-engaging position. In another embodiment, an active plunger moves linearly between the wafer-loading and wafer-engaging positions. Both the gripper arms and the plunger device are driven by a motor assembly. A force feedback system monitors the force the gripping mechanism exerts on the wafer and, based on the amount of force, controls the operation of the motor assembly to dynamically adjust the position of the gripping mechanism.

A semiconductor integrated circuit comprises a combinational circuit section having a combinational circuit, a scan path circuit for inputting and outputting a value from and to the combinational circuit section in accordance with a scan enable signal and in synchronization with a clock signal, and a clock control section for generating and outputting a predetermined number of pulses as the clock signal after a predetermined period has passed since a time when an output command signal was received. The clock control section has an oscillator circuit for generating and outputting the pulse, and is configured to output a last pulse of the predetermined number of pulses in a manner which holds a logical value immediately after an active edge for the scan path circuit.

The present invention provides systems, apparatus and methods for selectively applying electrical energy to body tissue in order to ablate, contract, coagulate, or otherwise modify a tissue or organ of a patients. An electrosurgical apparatus includes an electrode support bearing an active electrode in the form of a plasma blade or hook having an active edge and first and second blade sides. The active edge is adapted for severing a target tissue via localized molecular dissociation of tissue components. The first and second blade sides are adapted for engaging against, and coagulating, the severed tissue. A method of the present invention comprises positioning an electrosurgical probe adjacent to the target tissue so that a blade- or hook-like active electrode is brought into at least close proximity to the target tissue in the presence of an electrically conductive fluid. A high frequency voltage is applied between the active electrode and a return electrode to effect cool ablation or other modification of the target tissue. During application of the high frequency voltage, the electrosurgical apparatus may be translated, reciprocated, or otherwise manipulated such that the active edge is moved with respect to the tissue. The present invention volumetrically ablates or otherwise modifies the target tissue with minimal or no damage to surrounding, non-target tissue.

A method for applying graphs to determine creditworthiness is discussed. The method includes receiving a request for a transaction between a first and a second user. The method accesses a graph with directed edges between nodes, the directed edges indicating trusted relationships between users. First node is accessed to determine first user's risk score using weighted edges between the first node and other nodes (associated with other users). Active user ratio is determined based on number of active edges from the first node to first nodes, and on number of revoked edges from the first node to second nodes. Active edges correspond to edges between the first node and first nodes, revoked edges correspond to edges between the first node and second nodes that were removed prior to receipt of the request. Creditworthiness of the transaction is determined based on the risk score and active user ratio.