PCT/TLCP resin composition for 5G antenna oscillator base material as well as preparation method and application thereof

Abstract

The present invention provides a PCT / TLCP resin composition for a 5G antenna oscillator base material, a preparation method and applications thereof. Based on the total weight of the PCT / TLCP resin composition being 100 parts, the composition includes: 20-65 parts by weight of a PCT resin, 5-30 parts by weight of a TLCP resin, 20-60 parts by weight of glass fiber, 1-15 parts by weight of a compatible toughening agent, and 0.5-7 parts by weight of other auxiliary agents. The resin composition provided by the invention has excellent dielectric property, mechanical property and electroplating property, the bonding strength of a molded product and an electroplated layer is high, and the stability of the electroplated layer is good; meanwhile, the PCT / TLCP resin composition has extremely low hygroscopicity and creep property and good processability, and thereby the PCT / TLCP resin composition provided by the invention can meet the application requirements of 5G antenna oscillator substrates.

Description

technical field [0001] The invention belongs to the technical field of new engineering plastics, and relates to a PCT / TLCP resin composition for a 5G antenna vibrator base material and a preparation method and application thereof. Background technique [0002] Antenna vibrator is a component and functional part in a communication base station. Its main function is to guide and amplify electromagnetic waves, so that the electromagnetic signal received by the antenna is stronger. It is an important component of the antenna. It is used in a large amount in communication base stations and antennas. The structural design is more complicated. The traditional manufacturing process of the antenna vibrator is die-casting of metal materials (aluminum alloy or zinc alloy). However, due to the complex structure of the antenna vibrator, the use of metal materials has many machining and forming processes, which is difficult and the accuracy is difficult to guarantee, resulting in product ...

AI Technical Summary

Problems solved by technology

However, there are still deficiencies in the LDS process. At present, the LDS process uses LDS-TLCP materials, which are heavy and costly. TLCP has fewer sources of raw materials, high processing technology requirements, and high equipment requirements; The mold temperature, barrel temperature, injection pressure, injection speed and molding cycle of the injection molding process are very high, and the yield rate is generally 85%, and the cost of the injection molding process is relatively high; all coating surfaces using the LDS process need to be laser engraved. The cost of laser engraving is high; the LDS process has high requirements for coating, and the overall plating production process takes a long time, low efficiency and high process cost

[0005] CN110655792A discloses a low-dielectric laser direct molding composite material suitable for 5G communication and its preparation method. The composite material is composed of the following components by weight: base resin (polyphenylene ether, polyimide, liquid crystal polymer and One or more of polyphenylene sulfide) 52-86 parts, glass fiber 0-30 parts, filler 10-30 parts, flame retardant 1-9 parts, toughening agent 4-15 parts, lubricant 0.1 -1 part, 0.2-1 part of antioxidant, 10-30 parts of laser sensitive additive; the preparation method of the composite material is: use a twin-screw extruder to process, the melt extrusion temperature is 250-380 ° C, and the screw speed is 150- 300rpm / min; the composite material provided by this patent application has a low dielectric constant, but its base resin uses few sources of polyphenylene ether and liquid crystal polymer, and the processing technology requirements are relatively high, and the patent uses laser direct Molding technology, higher production cost and lower yield rate

[0007] CN110982297A discloses a 5G low dielectric strength LCP composite material and a preparation method thereof. The 5G low dielectric strength LCP composite material includes the following components in parts by weight: 650-700 parts of LCP resin, 80-120 parts of glass fiber , 50-100 parts of sericite, 50-100 parts of glass microspheres, 2-5 parts of antioxidant; the preparation method comprises the following steps: S1. mixing main materials, S2. extruding strands, S3. cooling and cutting; The composite material provided by this patent application has low dielectric constant and dielectric loss, but still faces the disadvantages of few sources such as liquid crystal polymer, high price, low impact strength, significant anisotropy, and low weld line strength. And it will cause great damage to the processing equipment, and the surface is rough, and it is difficult to electroplate

Images