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136results about How to "Strengthen the connection structure" patented technology

Rechargeable battery and battery module using the same

The present invention relates to a rechargeable battery including an electrode assembly comprising a positive electrode, a negative electrode, and a separator interposed therebetween. The battery further comprises a case accommodating the electrode assembly and a plurality of positive electrode terminals and negative electrode terminals that are exposed outside of the case, connected to the case, and coupled to the electrode assembly.
Owner:SAMSUNG SDI CO LTD

Flat fuel cell assembly and fabrication thereof

A connecting structure of a flat fuel cell assembly. The assembly includes a plurality of fuel cells, each of which has a membrane electrode assembly with an anode, a proton exchange membrane and a cathode combined. Two conductive nets are attached to the surfaces of the anode and the cathode of each membrane electrode assembly by thermosetting adhesive and heat pressing to collect and transmit electrons.
Owner:IND TECH RES INST

Printed circuit board

A printed circuit board (PCB) reduces a simultaneous switching noise (SSN) causing power noise, thereby reducing radiated electromagnetic interference (EMI). In a double-layered PCB, a first substrate is arranged in parallel with a second substrate while being spaced apart from the second substrate by a predetermined distance. The first substrate includes a ground plane, which is deposited over an entirety of the first substrate. The second substrate includes a power plane deposited at a position of a component mounted to the printed circuit board (PCB) to transmit power to the component. Thus, the power trace of the PCB is simplified in structure, thereby reducing EMI radiation noise.
Owner:SAMSUNG ELECTRONICS CO LTD

Packaged chip capable of lowering characteristic impedance

A packaged chip lowering characteristic impedance comprises a chip, a lead wire frame, a plurality of metal layers, adhesive layers, lead wires, and a mold, being formed into TSOP LOC and thin-small-sized packaging types; from a specified site above or under each row of leads of the lead wire frame, metal layers are fixed respectively with adhesives layers to the lead wire frame; lead wires are connected respectively between electrode contacts of the chip and leads of the lead wire frame and a lead wire provided is connected between at least one lead and the metal layer, so the packaged chip using metal layers as a Ground or Power plane is formed; thus, electrical noises and EMI are lowered and a problem of poor transmission of signals is eliminated so that a stable transmission of signals and an efficient transmission speed may be further developed.
Owner:DOMINTECH

Shift range changeover mechanism

A vehicle range changeover mechanism is driven in response to operation of a shift lever. The range changeover mechanism has an output sector gear that is unrotatably connected to a range control shaft, and a position detecting sensor, a portion of which that is interlocked with and connected to the range control shaft. Looseness between the output sector gear and the position detecting sensor portion is eliminated by provision of a leaf or spring plate, thereby assuring rotation of the position detecting sensor portion corresponding one to one with the rotational motion of the range control shaft.
Owner:AISIN AW CO LTD

Connecting structure for an aircraft or spacecraft and method for producing the same

The present invention relates to a connecting structure for an aircraft or spacecraft, with a structural component and a stringer. The stringer is connected to the structural component by means of connecting regions. In order to reduce stress peaks that result for example from impact in the structural component, a high impact material is introduced into at least one of the connecting regions to provide a local increase in the energy absorbing capacity of the at least one connecting region.
Owner:AIRBUS OPERATIONS GMBH

Formed electrical contact pad for use in a dual stage actuated suspension

A flexible electrical circuit such as for use in a hard disk drive dual stage actuated (DSA) suspension has a dimple or other raised feature such as a jog formed in an electrical contact pad. The dimple raises up at least part of the contact pad in height so as to reduce the distance that an electrical bridging component or material such conductive epoxy, solder paste, or jet dispensed solder must traverse in order to complete an electrical connection from the contact pad to an adjacent piezoelectric microactuator or other electrical component for which the electrical circuit carries an electrical signal or electrical power. The reduced distance improves the cleanliness and reliability of the electrical and physical bond, and can allow for electrical connection types that would otherwise be impractical.
Owner:MAGNECOMP
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