Method for connecting an
integrated circuit to a substrate and corresponding circuit arrangementThe present invention provides a method for connecting an
integrated circuit (C1), in particular a
chip or a
wafer or a
hybrid, to a substrate (C2), which has the following steps: provision of a first electrical contact structure (KF1, BP, LB; KF1, BP′) on a first main area (HF1) of the
integrated circuit (C1); provision of a corresponding second electrical contact structure (KF2) on a second main area (HF2) of the substrate (C2); at least one of the contact structures, the first electrical contact structure (KF1, BP, LB; KF1, BP′) or the second electrical contact structure (KF2), being elastic; placement of the first electrical contact structure (KF1, BP, LB; KF1, BP′) onto the corresponding second electrical contact structure (KF2), so that both are in electrical contact and under mechanical
compression pressure (P); and connection of a region of the main area (HF1) surrounding the first electrical contact structure (KF1, BP, LB; KF1, BP′) to a corresponding region surrounding the second electrical contact structure (KF2) of the second main area (HF2) by an
adhesive layer (KS), so that the first electrical contact structure (KF1, BP, LB; KF1, BP′) and / or the second electrical contact structure (KF2) are compressed in the connected state. The invention likewise provides a corresponding circuit arrangement.