Provided is an auxiliary hand-operated wafer bonding apparatus including a long elbow bend joint, a wafer groove A, a wafer groove B, a fixed angle hinge, a buffer block A, a buffer block B, a linear bearing A, a linear bearing B, a linear bearing C, a linear optical axis A, a linear optical axis B, a linear optical axis C, a spring A, a spring B, a spring C, a linear bearing connecting member, and a base, the short end of the long elbow bend joint is in interference fit with the center of the wafer groove A, the wafer groove A is fixedly connected with the linear bearing C via the fixed angle hinge, the wafer groove B is fixedly connected with the base via the three linear optical axes, the three springs are in clearance fit with the three linear optical axes and are arranged at the ends close to the base, the three linear bearings are in interference fit with the three linear optical axes and are fixedly connected with the upper ends of the three springs, and the buffer A and the buffer B are fixedly connected with the linear bearing A and the linear bearing B. The auxiliary hand-operated wafer bonding apparatus prevents the direct contact between one's hands and a wafer and improves the hand-operated wafer bonding quality.