82results about How to "Reduce crosstalk noise" patented technology

The present disclosure is directed to systems and methods for a multiport connector assembly, used in telecommunication systems, that is designed to reduce electrical port to port crosstalk noise. The assembly is adapted to reduce noise from adjacent ports by placing balancing isolators and capacitor radiators in noise reducing regions of a printed circuit board. The signals are radiated in properly selected areas to rebalance the noise generated from adjacent transmission ports. By rebalancing noise inherently coupled by adjacency of transmitters, the port to port near-end crosstalk and far-end crosstalk noise is substantially reduced.

An adaptive bandwidth bus is provided that switches between a current mode of operation and a voltage mode of operation. Furthermore, related methods include transmitting a data signal in a current mode or a voltage mode and transmitting a control signal to indicate whether the signal should be transmitted in the current mode or the voltage mode.

The present disclosure is directed to systems and methods for a multiport connector assembly, used in telecommunication systems, that is designed to reduce electrical port to port crosstalk noise. The assembly is adapted to reduce noise from adjacent ports by placing balancing isolators and capacitor radiators in noise reducing regions of a printed circuit board. The signals are radiated in properly selected areas to rebalance the noise generated from adjacent transmission ports. By rebalancing noise inherently coupled by adjacency of transmitters, the port to port near-end crosstalk and far-end crosstalk noise is substantially reduced.

An integrated audio signal processing circuit is described for reducing crosstalk noise in an integrated headset switch for a headset having two speakers, a microphone sharing a common ground. The audio signal processing circuit includes two audio amplifiers and also has two terminals configured to be either a microphone connection terminal or a headset ground connection terminal, respectively, depending on the type of the headset. An audio amplifier reference node is coupled to inputs of the audio amplifiers. The audio signal processing circuit has a first switch device responsive to a headset ground selection signal and configured to connect the audio amplifier reference node to the detected headset ground connection terminal. The audio signal processing circuit also has a second switch device responsive to the headset ground selection signal and configured to couple the detected headset ground connection terminal to a ground terminal of the audio processing circuit.

The present invention is an electronic circuit that reduces crosstalk in communications systems employing twisted pair, Ethernet, polyphase or shielded wire transmission media. The present invention includes three stages of crosstalk noise reduction. Stage 1 filters common mode noise from the transmission media and balances the resistive and reactive parasitic electrical characteristics of the transmission media that couple each line to the local ground over the operating frequency band. The second Stage performs differential crosstalk noise reduction in real time using multiple feedback loops. It can dynamically locate and set optimal system operating conditions for minimal differential crosstalk coupling for the specific environmental and interfering channel utilization conditions. The third Stage utilizes digital signal processing techniques to further reduce any residual crosstalk after analog-to-digital conversion. The third Stage also functions as a digital controller for the entire system as well as portions of subsystems including the feedback loops of Stage 2.

A structure 14 for particle immobilization has a plurality of holding holes 9 for holding respective test particles in order to detect light emitted from a substance which indicates the presence of a component for constructing each of the test particles, and the structure 14 for particle immobilization comprises a flat plate substrate 15, and a holding unit 20 which is arranged on the substrate 15 and which is formed with the plurality of holding holes 9. In this configuration, a light shielding film 19 which reduces light noise is provided for the substrate 15 or the holding unit 20 in order that the light noise such as the background noise and the crosstalk noise can be reduced, and a large number of test particles can be optically observed highly sensitively and highly accurately.

A buffer cell and an inverter cell are embedded in advance in an internal open space of each of mega-cells and IO cells composing a semiconductor integrated circuit. Thereafter, in cases where it is expected that a cross-talk noise is generated in a signal transmitting through a particular wire of the semiconductor integrated circuit, one mega-cell or one IO cell, which is placed in a position nearest to a generation position of the cross-talk noise, is selected from the mega-cells and the IO cells, and the buffer cell or the inverter cell embedded in the selected mega-cell or the selected IO cell is inserted into the particular wire. Therefore, because the capacitance between the particular wire and each wire adjacent to the particular wire is reduced, the cross-talk noise can be reduced.

An adaptive bandwidth bus is provided that switches between a current mode of operation and a voltage mode of operation. Furthermore, related methods include transmitting a data signal in a current mode or a voltage mode and transmitting a control signal to indicate whether the signal should be transmitted in the current mode or the voltage mode.

A cable reduces loop inductance by changing the cross-sectional shape of the conductive elements of power supply and return conductors to something other than the traditional circular cross sectional shape, e.g., to a thin generally rectangular shape. The power supply and return conductors are also controlled in placement along the length of the cable, so that mutual inductance is maximized within a given power supply circuit, and minimized between the given power supply circuit and other power supply circuits within the cable. The return power supply conductor may optionally be sized for multiple power supply circuits, which may further reduce loop inductance and reduce crosstalk noise between different power supply circuits within a common cable. The power supply and return conductors may be part of a hybrid cable used to power and communicate with plural remote radio units proximate a top of a tower.

This invention relates a method of six-dimensional optical multilayer storage using two-photon absorption writing, erasing and optical coherence tomography reading and the apparatus designed based on this method. The invented system stores data in three spatial dimensions plus three physical dimensions of wavelength, intensity and polarization. It has large storage capacity of over 32 Tbytes per DVD sized disk and ultrafast reading speed of over 25 Gbits / s with high signal-to-noise ratio of over 76 dB. The larger capacity of over 1 Pbyte per disk is potential. Furthermore, the invented system has relatively simple optical structure, easy light manipulation for addressing the storage cell and high compatibility with the CDs and DVDs. It is an actually practicable optical large capacity storage technology.

The present invention has an object to provide a substrate with a built-in functional element, including the functional element above a metal plate, in which crosstalk noise between signal wirings can be reduced and higher characteristic impedance matching can be achieved. An aspect of the present invention provides a substrate with a built-in functional element, including: a metal plate that includes a concave portion and serves as a ground; the functional element that is placed in the concave portion and includes an electrode terminal; a first insulating layer that covers the functional element and is placed in contact with the metal plate; a first wiring layer including first signal wiring that is opposite the metal plate with the first insulating layer being interposed therebetween; a second insulating layer that covers the first wiring layer; and a ground layer formed of a ground plane that is opposite the first wiring layer with the second insulating layer being interposed therebetween.

A low crosstalk transmission connector includes a housing that houses a metal spring plate, a load bar, a terminal module and a locating frame, a cable organizer, which has an axle hole that receives a 8-wire cable and 8 wire grooves that separate the 8 insulated wires of the cable, and a metal shield that accommodates the cable organizer and has a bottom clamping plate and a top clamping plate respectively hooked on the bottom and top sides of the housing to ensure high steadity. The 4th and 6th metal contact terminals and the 1st, 2nd, 3rd, 5th, 7th and 8th metal contact terminals of the terminal module have the respective front contact portions curved in two reversed directions to reduce crosstalk noise, thereby improving transmission quality.

A network connector socket includes an insulated body, first contacts, and second contacts. Each first contact includes a first fixed segment fixed in the insulated body. The first fixed segments are arranged in parallel on a first plane. Each second contact includesa second fixed segment fixed in the insulated body. The second fixed segments extend on a second plane spaced apart with the first plane and are arranged in parallel. One of the first fixed segments is bent and extends to cross at least one of the second fixed segments. For one of the first contacts, the corresponding first fixed segment has a larger transverse width than that of the rest. For one of the second contacts, the corresponding second fixed segment has a larger transverse width than that of the rest. Thus, the crosstalk noise between the contacts is reduced by capacitive compensation.

A technique which reduces the influence of external noise such as crosstalk noise in a semiconductor device to prevent a circuit from malfunctioning. A true signal wire and a bar signal wire which are susceptible to noise and part of an input signal line to a level shifter circuit, and shield wires for shielding these signal wires are laid on an I / O cell. Such I / O cells are placed side by side to complete a true signal wire connection and a bar signal wire connection. These wires are arranged in a way to pass over a plurality of I / O cells and are parallel to each other or multilayered.

There is provided an optical module in which leaked light or the like from a plurality of optical elements on the same substrate is made less likely to affect adjacent optical elements, and a cross-talk noise can be thereby significantly reduced. The optical module includes an internal waveguide in a first trench of a substrate, a mirror section, and optical elements. A plurality of the first trenches of the substrate are formed independently of each other and substantially in parallel with each other, and lengths of adjacent first trenches from the end surface of the substrate are made different from each other. The optical elements are mounted on the surface of the substrate so as to oppose the minor sections formed at the tip portions of the first trenches having the different lengths.

An audio system has a first channel for receiving a first input signal and driving a first speaker and a second channel for receiving a second input signal and driving a second speaker. A first feedforward circuit couples an input of the second channel circuit to an input of the first channel circuit. A second feedforward circuit couples an input of the first channel circuit to an input of the second channel circuit. Circuit parameters of the first and the second feedforward circuits are determined such that a first detected output signal is zero when the first input signal is non-zero and the second input signal is zero, and a second detected output signal is zero when the second input signal is non-zero and the first input signal is zero. The audio system is configured to operate using the determined circuit parameters for the first and the second feedforward circuits.

An image reading apparatus in which cross-talk noise occurring between plural reading units is reduced, an image reading method and an image reading program are provided. There are included plural reading units that respectively operates at different timings, a reference data generation unit that acquires first read data as a result of reading of a first read object, acquires an operation state of the plural reading units during the reading of the first reading object, generates reference data based on the first read data, associates the operation state with the reference data obtained in the operation state and stores them, and a correction unit that acquires second read data as a result of reading of a second read object, acquires an operation state of the plural reading units during the reading of the second reading object, acquires the reference data corresponding to the operation state, and corrects the second read data based on the reference data.

A delay line structure includes a serpentine delay line, a first grounding guard trace and a second grounding guard trace. The serpentine delay line is disposed in a layout layer of a substrate in a manner of extending from an input end to an out put end in serpentine so as to form at least a first coupling area having a first opening toward a first direction and at least a second coupling area having a second opening toward a direction opposite to the first direction. The first grounding guard trace is disposed in the layout layer in a manner of extending from the first opening toward the first coupling area and an end of the first grounding guard trace close to the first opening is electrically connected to the grounding circuit through a first via. The second grounding guard trace is disposed in the layout layer in a manner of extending from the second opening toward the second coupling area and an end of the second grounding guard trace close to the second opening is electrically connected to the grounding circuit through a second via.

An image reading apparatus in which cross-talk noise occurring between plural reading units is reduced, an image reading method and an image reading program are provided. There are included plural reading units that respectively operate at different timings, a noise calculation unit that acquires first read data as a result of reading of a first read object as the read object by the plural reading units, acquires an operation state of the plural reading units during the reading of the first read object, and calculates, based on the operation state and the first read data obtained in the operation state, noise information based on the operation state, and a noise removal unit that acquires second read data as a result of reading of a second read object as the read object different from the first read object by the plural reading units, and removes noise from the second read data based on the noise information calculated by the noise calculation unit.

A suspension substrate according to the present invention includes: an insulating layer; a spring material layer provided on one face of the insulating layer and having conductivity; and a plurality of wirings provided on the other face of the insulating layer. One wiring includes a head-side wiring part extending from the head portion, and a plurality of division wiring parts respectively bifurcated from the head-side wiring part. The spring material layer includes a spring material main body, and a wiring spring material part separated from the spring material main body, via a groove. A conductive connecting part extending through the insulating layer is provided in the insulating layer. Each of the division wiring parts of the one wiring is connected with the wiring spring material part, via the conductive connecting part.

The invention discloses an array-type light addressable potentiometric sensor comprising an SOI (Silicon-On-Insulator) substrate and a plurality of isolating islands formed on the SOI substrate, wherein the SOI substrate in the isolating islands is provided with light addressable potentiometric sensing units, a diffusion ring, a substrate electrode and an on-chip reference electrode. The invention further discloses a manufacturing method of the array-type light addressable potentiometric sensor, and the method comprises the steps of: (1) manufacturing the isolating islands; (2) manufacturing the diffusion ring; (3) manufacturing the light addressable potentiometric sensing units; (4) manufacturing the on-chip reference electrode; and (4) manufacturing the substrate electrode. According tothe invention, the degree of isolation between the light addressable potentiometric sensing units are effectively enhanced by adopting the SOI substrate in combination with the isolation channel groove, and the unique design of the on-chip reference electrode in the invention is more favorable for the microminiaturization and integration of the sensor.

A data transferring circuit includes a data transferor configured to transfer data through a plurality of parallel data transfer lines, wherein the data transferor is further configured to partially invert the transferred data in response to an inversion signal, and a pattern sensor configured to enable the inversion signal when data transferred through the parallel data transfer lines is to cause three sequential lines to transfer data of a logic value through a middle one of the sequential lines and data of an inverse of the logic value through the remaining ones of the sequential lines or cause all of the transfer lines to transfer data of a same logic value.

A suspension substrate according to the present invention includes: an insulating layer; a spring material layer provided on one face of the insulating layer and having conductivity; and a plurality of wirings provided on the other face of the insulating layer. One wiring includes a head-side wiring part extending from the head portion, and a plurality of division wiring parts respectively bifurcated from the head-side wiring part. The spring material layer includes a spring material main body, and a wiring spring material part separated from the spring material main body, via a groove. A conductive connecting part extending through the insulating layer is provided in the insulating layer. Each of the division wiring parts of the one wiring is connected with the wiring spring material part, via the conductive connecting part.

An integrated semiconductor structure and a method for fabricating an integrated semiconductor structure in a bulk semiconductor wafer.

The invention provides a connection device and a manufacturing method thereof. The connection device comprises a circuit board and a connector, wherein the connector is arranged on the circuit board; the connector is located on a component installation layer of the circuit board; a grounding trace, connected with a ground layer of the circuit board, on the circuit board surrounds a signal transmission pin of the connector to form a loop on the component installation layer; and the loop surrounds the signal transmission pin. According to the connection device and the manufacturing method thereof, the quality of SI during signal transmission can be improved.

The invention discloses a two-dimensional code image optical encryption method and system, a device and a storage medium. An original image to be encrypted is stored by using a two-dimensional code image; carrying out gray scale transformation on the two-dimensional code image; obtaining a transformed two-dimensional code pixel matrix; then, carrying out optical encryption operation based on fractional Fourier transform on the image; and after the encryption operation, carrying out threshold-based effective information extraction and integration operation to obtain a final encrypted image, sothat introduction of extra system complexity can be avoided, noise crosstalk among a plurality of images is reduced, and lossless recovery of the original image in a later decryption process is facilitated by using the two-dimensional code as a container of the original image.