The invention discloses a connection method for a heat-conducting wire and a
metal substrate. By the adoption of the connection method, the problems that the heat-conducting wire is not matched with
metal due to heat expansion, so that cracks are generated easily, and consequentially a connector fails and the wettability between molten liquid and the heat-conducting wire is poor are solved. The connection method comprises the steps that the end, to be connected, of the heat-conducting wire is cleaned, and
surface coating treatment is conducted on one end of the heat-conducting wire, so that the end of the heat-conducting wire is coated with a
coating with the thickness being 0.01 mm-1 mm;
solder paste containing expansion particles is fully smeared on the end, to be connected, of the heat-conducting wire, and the heat-conducting wire is placed into a groove, with the
diameter being 5 mm-8 mm, in the
metal substrate after the
solder paste containing the expansion particles is solidified; heating is conducted till the
solder paste of the end, to be connected, of the heat-conducting wire is fully molten, and heat preservation is conducted; and cooling is conducted till the indoor temperature is reached. According to the connection method for the heat-conducting wire and the
metal substrate, the expansion particles are added into the solder paste so that the size of solder in the
molten state can be expanded rapidly, and accordingly air is exhausted, seams in the groove are filled with the solder, seamless connection between the heat-conducting wire and the
metal substrate is achieved, and the efficient heat
conductivity of the heat-conducting wire can be brought into full play easily.