31results about How to "Improve integration accuracy" patented technology

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An object recognition device includes: a sensor; a storage device; and a processor configured to detect a first object and a second object around the vehicle, initially set, based on a detection position of the first object, an integration determination distance used to determine that the first object and the second object belong to the same object, estimate a traveling direction of the first object based on the sensor detection information, increase the integration determination distance along the traveling direction, after increasing the integration determination distance along the traveling direction, determine, based on the integration determination distance, whether the first object and the second object belong to the same object, and output the first object and the second object as the same object when it is determined that the first object and the second object belong to the same object.

The invention discloses an analog-digital conversion circuit for a dynamically tuned gyroscope, which comprises a divided circuit, an integrating circuit, a logic control circuit, a switching circuit, a shaping circuit, a constant-current source circuit and an output circuit. The analog-digital conversion circuit has the following advantages: (1) as the resistance-type divided circuit is adopted, an integrator can work in a few milliampere state, and the integral accuracy is improved; (2) the ternary widening logic is utilized for replacing the dual logic, the absolute value of the zero position of a ternary logic convertor is small, and the variation of the zero position is also small; (3) the measuring range of the analog-digital conversion circuit disclosed by the invention meets the great dynamic requirement of -600 degrees / s to 600 degrees / s, the clock signal is increased from 128 KHz to 256 KHz to ensure the resolution ratio of angular velocity measurement, and the degree of linearity in the temperature field of [-40 DEG C, +60 DEG C] is less than 8*10<-4>, so the degree of linearity in the entire temperature field range is ensured, and the accuracy of analog-digital conversion is improved.

The invention discloses a production method of a touch display screen. The production method includes the main steps of firstly, preparing alignment marks on induction glass and display screen glass of a capacitive touch screen; secondly, bonding an IC (integrated circuit) and a flexible circuit board to the display screen glass and bonding the flexible circuit board to the induction glass; thirdly, inspecting the display screen glass and the induction glass; fourthly, applying optical adhesive between the display screen glass and the induction glass; fifthly, using a camera of an alignment device to capture the positions of the alignment marks on the display screen glass and the induction glass, allowing a controller of the alignment device to calculate deflection of the display screen glass and the induction glass, and controlling a motor to drive the display screen glass or induction glass to move for correction; and sixthly adhering the display screen glass and the induction glass. Precision in integration of the capacitive touch screen and a display module is improved, production flow of TLI (transport-level interface) products is shortened, rejection rate of products is reduced, product precision is more than doubled, and accordingly product grade and market competitiveness are improved.

The invention discloses an LED module and a display device, and relates to the field of display technology. The LED module comprises: an LED substrate, a driving substrate and a connection structure; the LED substrate comprises a PCB substrate, a plurality of first signal lines and are arranged in an array The LED chips and the first signal wiring are arranged on the PCB substrate with the PCB substrate as the substrate, and the first pole and the second pole of the LED chip are respectively connected to different first signal wirings; the driving substrate includes glass a substrate, a driving chip and a plurality of second signal wirings, the driving chip and the second signal wirings are arranged on the glass substrate with the glass substrate as the substrate, and one end of the second signal wiring is electrically connected to the driving chip; the first signal wiring is The wire and the second signal trace are electrically connected through the connection structure. The invention can effectively reduce the IR voltage drop of the signal line between the driving chip and the LED chip while improving the integration precision of the driving chip.

The invention discloses a monitoring displacement and cutoff frequency-based inter-storey displacement correcting method. The monitoring displacement and cutoff frequency-based inter-storey displacement correcting method comprises acquiring the acceleration data of every monitored storey, the inter-storey displacement data of one of the monitored storeys and a corresponding measured displacement time-travel curve; acquiring and preprocessing inter-storey acceleration data; performing discrete Fourier transformation, frequency domain integration and inverse Fourier transformation on the acceleration data of a storey with measured displacement to acquire an integrating speed time travel curve and an integrating displacement time travel curve; inputting different cutoff frequencies and performing calculation to determine the cut-off frequency corresponding to minimum errors of the integrating displacement time travel curve and the measured displacement time travel curve; applying the determined cutoff frequency to acceleration integration corresponding to other storeys to be monitored, and performing frequency domain integration to acquire all inter-storey displacements. The monitoring displacement and cutoff frequency-based inter-storey displacement correcting method can effectively avoid difficulty in direct inter-storey displacement monitoring, saves complex calculation procedures of error reduction in existing integration manners and further improves integration precision.

The invention relates to a temperature conversion method and a low-power high-precision integrated temperature sensor. The low-power high-precision integrated temperature sensor is composed of a band gap reference circuit with a sensing core, a positive and negative synchronous switch capacitor integral circuit, a current source and a sampling capacitor dynamic element matching module, a clock generating circuit, a divider and buffer circuit and a fully differential analog-to-digital converter. The sensing core circuit in the traditional technology and the band gap reference circuit are combined and integrated, so that the circuit structure is simplified; the current source dynamic element matching module is arranged and thus a base-emitter junction voltage difference in proportion to the absolute temperature is generated, wherein the polarity of the voltage difference changes alternately; with the novel positive and negative synchronous switch capacitor integral circuit, the improved temperature conversion function is completed and the dynamic range utilization rate of the analog-to-digital converter is improved; dynamic element matching is carried out on the sampling capacitor, thereby improving the integral accuracy; and the analog-to-digital converter is used for carrying out quantization processing on an effective temperature signal to provide a digital output. Therefore, the temperature error and circuit power consumption of the sensor can be effectively reduced; and the method and the sensor are suitable for the low-power high-precision temperature sensing application.

The invention relates to a digital integrator implementing method based on ideal reconstruction filter impulse response fitting. An analog signal can be fitted by sampling weighing due to time delay of an ideal reconstruction filter impulse response, so that an integral of the analog signal can be obtained by sampling weighing on an integral of the ideal reconstruction filter impulse response. According to the digital integrator implementing method, the integral of the ideal reconstruction filter impulse response can be calculated off line, and a signal integral is calculated by performing weighted summation on a signal sampling value; therefore, the integral precision is high; the digital integrator implementing method is suitable for a complicated environment in which detected current contains higher harmonic.

The invention discloses an electronic current transformer signal reduction method based on a Rogowski coil, which is characterized in that: the method comprises the following steps: 1) performing digital integration on signals on the secondary side of an electronic current transformer to obtain an integral output value; 2) calculating a system frequency f according to data y after integration by a zero crossing algorithm; 3) calculating a direct current component z1 of data y(i) after the integration according to the calculated system frequency f by a summation algorithm; 4) obtaining a direct current component z2 of data x(i) before the integration according to the change rate of the direct current component z1 before the integration; and 5) filtering a direct current component z2 in an integration algorithm, and filtering the direct current z1 after the integration by a point-wise attenuation method in the process of digital integration to obtain a final integral output value. The electronic current transformer signal reduction method can filter the direct current components before and after the integration so as to improve the integral accuracy, avoid the angular deviation problem in a lossy integration algorithm, and improve the steady state and transient state indexes of devices.