51results about How to "Guaranteed arrangement" patented technology

The invention relates to a dowel having cutting devices at the lower side of the pressing plate at the circumference of said pressing plate for cutting into the insulating panel when the pressing plate is pulled into the insulating panel. The invention further relates to a method, in which a bore-hole is drilled through the insulating panel into the substructure, the dowel and the expansion element are inserted into the bore-hole, the expansion element is driven into the pressing plate and the dowel sleeve, and wherein simultaneously the pressing plate is pulled into the insulating panel under compression of the insulating panel, and the insulating panel is cut in at the circumference of the pressing plate by means of cutting devices. The invention further relates to a method in which a bore-hole is drilled trough the insulating panel into the substructure, a circle with at least the radius R is cut into the insulating panel by means of cutting devices, the dowel and the expansion element are inserted into the bore-hole, the expansion element is driven into the pressing plate and the dowel sleeve, and simultaneously the pressing plate is pulled into the insulating panel under compression of the insulating panel.

The invention belongs to the technical field of semiconductors, and particularly discloses a micro device laser peeling huge quantity transfer device and method based on winding process, The inventioncomprises a micro device stripping and transferring module, an auxiliary tape carrying module, a transition tape carrying module, a transfer tape carrying module, a substrate carrying module, a microdevice filling module, a curing module, a packaging module and a substrate transferring module, wherein the micro device stripping and transferring module is used for realizing the detection and stripping of the micro device; The auxiliary tape module is used to adhere the stripping micro-device; The transition tape module is used for picking up the micro device and transferring it to the transfer tape module. The transfer tape module is used for picking up the micro device and transferring it to the substrate carrying module. A substrate carry module is used for pas that micro device into afilling module, a curing module, a packaging module and a substrate handling module to realize filling, curing, packaging and loading and unloading. The invention realizes the massive transfer of themicro device by using the winding process and the laser technology, and has the advantages of high production efficiency, low production cost and the like.

The invention relates to a locking device (1), particularly for a vehicle sent, which comprises a retainer region (5) for receiving a counter element (6), a catch (3) which can be pivoted between a locking position that locks the counter element in said retainer region, and an unlocking position, and a compensation element (9) that can be pivoted between a contact position for tensioning the counter element in the direction of the retainer region and a release position for releasing said counter element.

The invention provides an isolating grounding switch and GIS equipment using the isolating grounding switch. The isolating grounding switch includes a shell, which is provided with an isolated static contact seat, a fast grounding static contact seat, a grounding static contact seat and a mounting base corresponding to each static contact seat, an isolation static contact seat, a fast grounding static contact seat and a grounding At least one of the static contact seats is adjustable in radial position on the corresponding mounting base through a position adjustment mechanism to realize the axial alignment of the static contact seat and the corresponding moving contact. At least one of the isolated static contact seat, the fast grounding static contact seat and the grounding static contact seat is adjustable connected to the installation base. The central axes of the moving contacts coincide with each other to ensure the centering arrangement of the two. When the moving contacts and the static contact seats are inserted into each other, it can reduce wear and tear, reduce the generation of metal foreign objects, and ensure the normal operation of the isolation grounding switch.

The invention discloses an oil supply control lubrication system for a transmission case. An oil supply pump feeds hydraulic oil in an oil tank into a heat radiation system to perform cooling, cooled hydraulic oil returns to the transmission case and then flows into different oil ways, one oil way is that the cooled hydraulic oil directly flows into a hydraulic element to participate in power transmitting, and the other oil way is that the oil is supplied for a control pump. The hydraulic oil pumped by the control pump is subjected to refined filtration and divided into two ways, one way is that the hydraulic oil serving as control oil is provided for a main control valve, and the other way is that the hydraulic oil flows into the lubrication system. Oil for an inert pump is supplied through two oil ways, one oil way is that the oil is sucked from the oil tank, and the other oil way is that the oil of an outlet of the control pump flows into an inlet of the inert pump through a one-way valve and then directly enters the lubrication system through the inert pump. By adopting the technical scheme and a reasonable allocation scheme, the problems including pump power loss and oil-gas leakage from a tank body in the prior art are solved.

An arc electric welding head comprising a first contact device housing a first duct for feeding a first electrode and providing electrical contact between a first power source and said first electrode, a second contact device housing a second duct for feeding a second electrode and providing electrical contact between a second power source and said second electrode, said first and second contact devices being electrically insulated from each other, said first and second ducts being parallel.

The invention discloses a surface-mounted miniature superimposed circuit attenuator and a preparation method thereof. The size of the attenuator is 2.5mm*4mm*0.635mm. The front of the attenuator is provided with a first attenuation circuit and a second attenuation circuit. The attenuation circuit and the second attenuation circuit are connected in series, and the first attenuation circuit and the second attenuation circuit have a common resistance. In the present invention, the attenuation circuit with higher attenuation value is obtained by connecting two attenuation circuits in series, and the relative resistance value is relatively small, which can better meet the precision requirements; and creatively let the first attenuation circuit and the second attenuation circuit share the same Use one resistor to form the respective attenuation circuit, which effectively reduces the volume of the attenuation sheet, making it easier to arrange in the high-frequency circuit, and the terminal conductor of the attenuation sheet is processed in one time, further improving the accuracy and accuracy of the attenuation sheet quality.

The invention belongs to the technical field of semiconductors, and specifically discloses a micro-device laser peeling mass transfer device and method based on a winding process, which includes a micro-device peeling transfer module, an auxiliary carrier tape module, a transition carrier tape module, a transfer carrier Belt module, substrate carrying module, micro-device filling module, curing module, packaging module and substrate handling module, micro-device peeling transfer module is used to realize the detection and peeling of micro-device; auxiliary tape-carrying module is used for adhesion and stripping of micro-device; transition The carrier tape module is used to pick up micro devices and transfer them to the transfer carrier tape module; the transfer carrier tape module is used to pick up micro devices and transfer them to the substrate carrier module; the substrate carrier module is used to send micro devices into Filling, curing, packaging and loading and unloading are realized in the filling module, curing module, packaging module and substrate handling module. Through the invention, the mass transfer of micro devices is realized by using the winding process and the laser technology, and has the advantages of high production efficiency, low production cost and the like.

The invention relates to the technical field of coin packaging, in particular to a method and device for automatically arranging, stacking and plastically packaging coil rolls packaged into shapes of straight tubes in large-batch production. The method for automatically arranging, stacking and plastically packaging the coil rolls is stable in packaging stability and high in production efficiency and includes the following steps of regularly arranging the coin rolls, stacking the coin rolls and plastically packaging the coin rolls. The device for automatically arranging, stacking and plastically packaging the coil rolls is simple in structure, convenient to operate, capable of being widely applied to automatic packaging production of the coin rolls and also applicable to automatic packaging of similar articles in the shapes of straight tubes. The coin rolls packaged into the shapes of straight tubes in the large-batch production process can be automatically arranged, stacked and plastically packaged, the packaging quality is stable, and the production efficiency is high.