31results about How to "Downsizing and thinning" patented technology

In a semiconductor device in which a plurality of wiring substrates each mounting an electronic component are stacked and sealed by a resin, the semiconductor device can be downsized, thinned, and highly reliable, and its manufacturing cost can be reduced. By using a metal paste for electrical connection between the stacked lower-layer side wiring substrate and upper-layer side wiring substrate, a connecting pitch can be smaller than that in a connecting method of using a solder ball including Cu core, and the connection at low temperature can be achieved. Also, by coating a metal paste by a print-coating method or a dispense-coating method, manufacturing steps are simplified, so that the manufacturing cost is reduced.

A multilayered device comprises an insulation sheet 1 having at least two foldable areas 11, 12 which are multilayered by being folded; and a first conductor 21A, 22A which is formed on a first face 11A, 12A and constitutes a first coil 51A, 52A having one turn or more, and a second conductor 21B, 22B which is formed on a second face 11B, 12B and constitutes a second coil 51B, 52B having one turn or more in the same winding direction as that of the first coil in each of the foldable areas, at least four conductors are disposed in parallel with each other by folding the insulation sheet so as to constitute an inductor, and thus, it enables to thin the thickness of the multilayer, to downsize and to lightweight even when it constitutes a coil device having a larger winding number.

A packaging material for a cell including a laminated article having at least a coating layer, a barrier layer, and a sealant layer in the stated order, wherein: the coating layer has at least three layers including a first, second and third coating layer, and is disposed so that the first coating layer is positioned as the outermost layer and the third coating layer is positioned on the barrier-layer-side; and the first coating layer, the second coating layer, and the third coating layer are formed from a cured product of a resin composition containing a heat-curing resin and a curing accelerator so as to sufficiently exhibit a specific hardness, whereby the thickness can be reduced, exceptional chemical resistance, moldability, and inter-layer adhesion between the barrier layer and the coating layer can be obtained, and the lead time can be reduced to enable an improvement in production efficiency.

An image pickup lens includes an aperture stop, a first lens with positive refractive power having a convex object-side surface, a second lens with negative refractive power having a concave image-side surface, a third lens with positive refractive power having a convex image-side surface, a fourth lens with negative refractive power as a double-sided aspheric lens having a concave object-side surface, and a fifth lens with negative refractive power of a meniscus shape as a double-sided aspheric lens having a concave image-side surface, wherein the fifth lens is designed so that the negative refractive power weakens as the distance from the optical axis increases, and wherein the following conditional expression (1) is satisfied:

0.55<f1/f<1.0  (1)

where f represents a focal length of an overall image pickup lens, and f1 represents a focal length of the first lens.

An electronic device manufacturing method includes: setting a solder material on electrodes of a first circuit assembly; setting a resin having a flux action on one surface of a second circuit assembly so as to entirely cover solder bumps formed on the one surface of the second circuit assembly; setting the second circuit assembly on the first circuit assembly via the resin so that the solder material set on the electrodes of the first circuit assembly and the solder bumps of the second circuit assembly are put into contact with each other; and applying thermal energy to connecting portions between the solder material and the solder bumps and to the resin. By carrying out these processes, an electronic device in which the first circuit assembly and the second circuit assembly are joined together and in which their junction portions are sealed by the resin is manufactured. As a result, in the electronic device, junction reliability can be improved.

A switching power supply has a function of improving a power factor, and outputs insulated DC. The switching power supply performs two kinds of controls for switching devices exclusive to each other: controlling of a switching device provided in a direction in which the discharging of a primary-side smoothing capacitor is prohibited at the time of suspension of commercially available AC power and near the zero cross of an input voltage; and causing a switching device provided between the output side of a third winding and the primary-side smoothing capacitor to control a charging current, thereby charging a capacitor in a boosted manner.

Provided is a hard disk drive including a flat disk mounting surface including no recessed portion which causes minute deformation hindering accurate recording/reproducing. The hard disk drive includes: a magnetic disk (2), which is rotationally driven for recording and reproducing information; a rotor hub (12) including a disk mounting surface (15) on which the magnetic disk (2) is mounted in an outer circumferential portion thereof; and a clamp (30) for pressurizing and fixing the magnetic disk (2) to the mounting surface (15). In the vicinity of an edge portion of the disk mounting surface (15) to which the clamp (30) pressurizes, a pore having a length of 10 μm or more in a circumferential direction is not allowed to exist.

In a method of manufacturing a semiconductor pressure sensor, a multilayer structure including a polysilicon diaphragm, a polysilicon gauge resistor formed on a side of a space which is to serve as a vacuum chamber below the polysilicon diaphragm, and a group of insulating films containing the polysilicon diaphragm and the polysilicon gauge resistor and having an etching solution introduction hole in contact with a sacrificial layer is formed on the sacrificial layer. Then, an etching solution is supplied through the etching solution introduction hole and the sacrificial layer is etched with the etching solution, to thereby obtain a diaphragm body formed of the multilayer structure, which functions on the vacuum chamber, and a surface of a silicon substrate below a first opening of a first insulating film is etched to thereby form the space which is to serve as the vacuum chamber and a diaphragm stopper disposed in the space, protruding toward near the center of the diaphragm body. With this structure, it is possible to provide a technique for suppressing the variation in the performance of a semiconductor pressure sensor when the semiconductor pressure sensor is downsized.

This invention provides a socket for a circuit board that adds function of electrical resistive element to a contact. A socket includes a socket body extending at a longitudinal direction; and a plurality of contacts disposed in two lines along the longitudinal direction of the socket body. When a memory module is connected to the socket body, terminals formed on opposite surfaces of the memory module are electrically and elastically connected by the contacts. The contact includes a contact portion which contacts the terminal, a bent portion for generating an elastic force, and a base portion. The contact is made of a conductive metal having elastic properties, and the contact used for carrying signal is provided with a resistor of an electrical resistive material that is different from the conductive metal. The resistor is connected in a current path between the base portion and the terminal of the memory module.

An optical sensor has a glass base having a concave portion, and a glass lid is bonded to the base and overlies the concave portion to form an hermetically sealed cavity portion. A photoelectric conversion element is accommodated in the cavity portion. Internal wirings are each connected at one end to the photoelectric conversion element and extend through notches formed in a peripheral edge of the base. The other ends of the internal wirings are connected inside the notches to external wirings that extend along an outside surface of the base and terminate in external terminals.

In order to provide a printer for an electronic voting device, capable of smoothly transporting a recording sheet having a free end and capable of realizing downsizing and simplification, a container (7) includes a main body portion (7d) mounted on to a casing (6a) of a printer (6) and a movable portion (7e) attached to the main body portion (7d) so as to be capable of being opened and closed. In a state where the container (7) is opened, a fanfold sheet (16) in a state where a deflection thereof is small is inserted as it is, and the movable portion (7e) is then closed with respect to the main body portion (7d). As a result, the fanfold sheet (16) is retained in the container (7) in a state where the fanfold sheet (16) is largely deflected in a U-shape. The fanfold sheet (16) can smoothly be supplied from the container (7) into the casing (6a) The printer (6) prints electronic voting contents on the fanfold sheet (16) which is smoothly supplied. When the printed content is visually confirmed, the printer (6) prints characters indicating approval thereof. After that, a printed portion of the fanfold sheet (16) is cut off to be discharged.