47results about How to "Difference in density" patented technology

The present invention aims to provide an ink which has a sufficiently large area factor even in a small ink droplet quantity and can obtain images having a high image density, and further has a superior storage stability. According to the present invention, a cyan ink is provided which is used in an ink set having four kinds of aqueous inks consisting of a cyan ink, a magenta ink, a yellow ink and a black ink in which each ink comprises at least water, a water-insoluble coloring material, and a plurality of water-soluble organic solvents having a good medium or good mediums for the water-insoluble coloring material and a poor medium or poor mediums for the water-insoluble coloring material, wherein, the ratio B1 / A1 is from 0.5 or more to 3.0 or less, where A1 denotes the total content (mass %) of the good medium based on the total mass of the cyan ink and B1 denotes the total content (mass %) of the poor medium based on the total mass of the cyan ink, and a water-soluble organic solvent which shows the maximum Ka value among the respective Ka values of the plurality of water-soluble organic solvents as determined by the Bristow method is the poor medium.

A semiconductor device having redistribution interconnects in the WPP technology and improved reliability, wherein the redistribution interconnects have first patterns and second patterns which are electrically separated from each other within the plane of the semiconductor substrate, the first patterns electrically coupled to the multi-layer interconnects and the floating second patterns are coexistent within the plane of the semiconductor substrate, and the occupation ratio of the total of the first patterns and the second patterns within the plane of the semiconductor substrate, that is, the occupation ratio of the redistribution interconnects is 35 to 60%.

A radiation curable resin composition suitable for making three dimensional objects comprising at least one epoxy compound, a cationic photoinitiator, wherein the resin composition has a first color or no color before cure and wherein a three dimensional object made from the resin by subjecting the resin to radiation shows a second color which is different from the color of the resin composition before cure.

The present invention relates to resin compositions suitable for making colored three dimensional objects and to methods for making colored three dimensional objects.

A current collector includes a metal foil with a plurality of through-holes formed therein. The metal foil is divided into two regions of: a distant region distant from a connection portion to be connected to an external terminal; and a close region being close to the connection portion and having the same area as the distant region. The open area ratio of the distant region of the metal foil is larger than that of the close region. Thus, the electrical resistance of the close region is smaller than that of the distant region. Therefore, production of heat in the close region due to passage of current can be suppressed.

A gas fired furnace capable of operating with a 16:1 turndown ratio or greater. The furnace includes a plurality of burners (10) grouped into at least (14a) first and second (14b) groups, each group connected to a source of combustible gas through a control valve (30a, 30b, 30c). The control valve (30c) controlling at least one group of burners is of a modulating type having an output proportional to a control signal applied to the valve. The burners fire into associated heat exchange tubes (20a), each tube having an inlet (24) and an outlet. The tube outlets are connected to a collector chamber (44) that includes a baffle plate (60) that divides the collector into two sections, one of the sections communicating with the outlets of the tubes associated with the first group of burners, the other section communicating with the outlets of the heat exchanger tubes associated with the other group of burners.

A semiconductor device having redistribution interconnects in the WPP technology and improved reliability, wherein the redistribution interconnects have first patterns and second patterns which are electrically separated from each other within the plane of the semiconductor substrate, the first patterns electrically coupled to the multi-layer interconnects and the floating second patterns are coexistent within the plane of the semiconductor substrate, and the occupation ratio of the total of the first patterns and the second patterns within the plane of the semiconductor substrate, that is, the occupation ratio of the redistribution interconnects is 35 to 60%.

A semiconductor device is provided with dummy patterns at an originally thinner portion of each of layers, and each of these dummy patterns is electrically connected to a reference wire that is either a power-supply wire or a ground wire.

In an exposure device according to the present invention, a plurality of exposure bands each containing multiple dots is formed on photographic paper by repeating main scanning in a main scanning direction based on image data that contains multiple pixels and the transfer of the photographic paper in a sub scanning direction. Of the multiple dots contained in each of two continuous exposure bands, the mean value of the pixel levels of two pixels corresponding to two dots with the same positional relationship for the main scanning direction is calculated to derive interpolation data. Thus, the region between the two dots neighboring in the sub scanning direction on the photographic paper is exposed on the basis of the interpolation data.

In a stator of a rotating electric machine, an annular stator core has slots. A stator winding includes phase windings of three phases of differing electrical phases that are housed in the slots and wound around the stator core. Three phase bus bars electrically connect the respective phase windings to an external apparatus. Each of the phase windings are configured by multiple parallel windings. The phase bus bars are integrated with a fixing member to form a bus bar module. Each of the phase bus bars include branch portions and a trunk portion. The branch portions are electrically connected to the respective phase windings. The trunk portion electrically connects together the branch portions, and is configured that a cross-sectional area of an end portion closest to the phase winding is smaller than a cross-sectional area of an end portion closest to the external apparatus.

A substrate processing apparatus includes a reaction chamber with a structure allowing pressure reduction, a shower head for supplying a processing gas into the reaction chamber including a gas diffusion plate in which through holes are formed, and a substrate support for placing a substrate. Each ones of through holes provided in a peripheral region of the gas diffusion plate is formed so that an area of an inlet thereof is larger than an area of an outlet thereof. With use of the substrate processing apparatus, a processing gas can be supplied uniformly in the gas diffusion plate. Therefore, substrate processing such as film deposition and film etching can be uniformly performed.

A method of manufacturing a solid-state imaging device is provided. The method includes: forming an insulating layer extending over an effective pixel region where a plurality of pixels each having a photoelectric conversion element is arranged and a peripheral area adjacent to the effective pixel region; forming an opening in the insulating layer located immediately above the photoelectric conversion element on the effective pixel region; forming a dummy opening in the insulating layer on the peripheral region; and forming a buried layer on the insulating layer to fill the opening and the dummy opening formed in the insulating layer.

A liquid ejecting head includes driving elements and electrodes each extending a second direction for ejecting liquid of pressure chambers through nozzles. The driving elements are classified into a first element group and a second element group. The electrodes are arranged along a first direction intersecting the second direction and are classified into a first electrode group electrically connected to the first element group, a second electrode group electrically connected to the second element group and a third electrode group not contribute to the ejecting liquid.

A device for the thermal treatment of yarns comprising at least one inlet opening and at least one outlet opening for at least one transport means, which transports the yarn through the device, and comprising separating elements at the inlet opening and the outlet opening for thermal shielding, in order to minimise the exchange of media to the environment. The separating elements are configured to have a low bending rigidity and are arranged such that a surface load is applied onto the yarn lying on the transport means, for example a conveyor belt, which is not greater than 0.005 kg*cm−2.