290results about "Resistor cooling/heating/ventillation" patented technology

A power stack includes cooling pipes and semiconductor modules which are alternately laminated. Each cooling pipe includes an inside space dissected into cooling passages in which coolant flows. Both surfaces of the semiconductor module in a laminating direction are brought into contact with surfaces of neighboring cooling pipes. The semiconductor modules are classified into a plurality of groups mutually differentiated in their heat generation rates. And, any two semiconductor modules belonging to the same group having the highest heat generation rate are spaced from each other so that a cooling pipe is not sandwiched between these semiconductor modules in the laminating direction.

A power stack includes cooling pipes and semiconductor modules which are alternately laminated. Each cooling pipe includes an inside space dissected into cooling passages in which coolant flows. Both surfaces of the semiconductor module in a laminating direction are brought into contact with surfaces of neighboring cooling pipes. The semiconductor modules are classified into a plurality of groups mutually differentiated in their heat generation rates. And, any two semiconductor modules belonging to the same group having the highest heat generation rate are spaced from each other so that a cooling pipe is not sandwiched between these semiconductor modules in the laminating direction.

A metal oxide varistor integrally formed with a heat protection structure that will automatically go to open circuit in conditions of overheating due to sustained over-voltages. The metal oxide varistor integrally formed with a heat protection structure has a body, an insulation bracket, a number of terminals and a fuse. The insulation bracket is deposited on the body and has a number of slots. The fuse connects to the body and one of the terminals. The fuse is mounted one of the slots of the insulation bracket. The fuse reacts to the overheating timely and the melting fuse spreads quickly with the assistance of capillary action evolved by the slots of the insulation bracket to speed up the action to go to open circuit in against damage due to sustained over-voltages.

An object of the present invention is to attain greater improvement of response characteristic in a temperature sensor having a thermistor element held in a metal tube. The invention provides a temperature sensor (1) including a cylindrical metal tube (3) having a front end side blocked, a thermistor element (2), and a sheath member (8) connected to the thermistor element (2) and held in the inside of the metal tube (3), wherein: the metal tube (3) has a small-diameter portion (33) located on the front end side and entirely having an inner diameter smaller than the outer diameter of the sheath member (8), and a large-diameter portion (36) located on the rear end side of the small-diameter portion (33) and having a diameter larger than the outer diameter of the small-diameter portion (33); and a thermistor sintered body (21) is held in the small-diameter portion (33) and cement (10) is filled in between a front end of the thermistor sintered body (21) and a front end of an inner wall of the metal tube (3) and on the front end side viewed from a read end surface of the thermistor sintered body (21).

A method and an arrangement for discharging an energy storage system for electrical energy, particularly in a vehicle having a hybrid drive line, by means of a first discharge resistor, wherein a coolant such as carbon dioxide gas is provided to the first discharge resistor during discharge of the energy storage system for leading off heat as well as a hybrid vehicle comprising such an arrangement.

A metal oxide varistor integrally formed with a heat protection structure that will automatically go to open circuit in conditions of overheating due to sustained over-voltages. The metal oxide varistor integrally formed with a heat protection structure has a body, an insulation bracket, a number of terminals and a fuse. The insulation bracket is deposited on the body and has a number of slots. The fuse connects to the body and one of the terminals. The fuse is mounted one of the slots of the insulation bracket. The fuse reacts to the overheating timely and the melting fuse spreads quickly with the assistance of capillary action evolved by the slots of the insulation bracket to speed up the action to go to open circuit in against damage due to sustained over-voltages.

A temperature sensor (1) including a cylindrical metal tube (3) having a front end side blocked, a thermistor element (2), and a sheath member (8) connected to the thermistor element (2) and held in the inside of the metal tube (3), wherein: the metal tube (3) has a small-diameter portion (33) located on the front end side and entirely having an inner diameter smaller than the outer diameter of the sheath member (8), and a large-diameter portion (36) located on the rear end side of the small-diameter portion (33) and having a diameter larger than the outer diameter of the small-diameter portion (33); and a thermistor sintered body (21) is held in the small-diameter portion (33) and cement (10) is filled in between a front end of the thermistor sintered body (21) and a front end of an inner wall of the metal tube (3) and on the front end side viewed from a rear end surface of the thermistor sintered body (21).

A ball grid array resistor network that has a ground plane to reduce noise and improve signal integrity. The ball grid array resistor network includes a substrate having a first and a second surface and vias that extending through the substrate between the first and second surfaces. Resistors are located on the first surface between the vias. Conductors are located over the vias and are electrically connected to ends of the resistors. A cover coat covers the conductors and resistors. A ground plane is located on the second surface. An insulating layer is located over the ground plane. Ball pads are located over the vias. The ball pads are electrically connected to the vias. Solder spheres are attached to the ball pads.

A process is described for integrating two closely spaced thin films without deposition of the films through deep vias. The films may be integrated on a wafer and patterned to form a microscale heat-trimmable resistor. A thin-film heating element may be formed proximal to a thin-film resistive element, and heat generated by the thin-film heater can be used to permanently trim a resistance value of the thin-film resistive element. Deposition of the thin films over steep or abrupt topography is minimized by using a process in which the thin films are deposited in a sequence that falls between depositions of thick metal contacts to the thin films.

A surface-mount positive coefficient thermistor includes a plate-like positive coefficient thermistor element, a pair of electrodes on the respective two main surfaces of the positive coefficient thermistor element, a pair of metal terminals each having a cutout at one end region connected to the corresponding electrode, the metal terminals including a metal having a low thermal conductivity, and solders each connecting the end region of the corresponding metal terminal to the outermost layer of the corresponding electrode. The metal terminal is readily and uniformly soldered to the electrode in a short period of time.

A surface-mountable over-current protection device comprises one PTC material layer, first and second connecting conductors, first and second electrodes and an insulating layer. The PTC material layer has a resistivity less than 0.2 Ω-cm, and comprises crystalline polymer and conductive filler dispersed therein. The first and second connecting conductors are capable of effectively dissipating heat generated from the PTC material layer. The first and second electrodes are electrically connected to first and second surfaces of the PTC material layer through the first and second connecting conductors, respectively. The dissipation factor depending on the ratio of the total area of the electrodes and the conductors to the area of the PTC material layer is greater than 0.6. At 25° C., the value of the hold current of the device divided by the product of the area of the PTC material layer and the number of the PTC material layer is greater than 1A / mm2.

The invention relates to an arrangement comprising a shunt resistor with at least an electrically conductive first connecting leg and an electrically conductive second connecting leg. A resistance area of the shunt resistor is electrically connected to the first connecting leg and to the second connecting leg. The arrangement further comprises a circuit carrier with a first metallization and a second metallization. The first connecting leg is directly joined to the first metallization and the second connecting leg is directly joined to the second metallization. The resistance area of the shunt resistor is in thermal contact with the thermally conductive substrate by use of a thermal filler arranged between the resistance area and the substrate, and / or by directly contacting the resistance area with the substrate. The invention further relates to a method for producing an arrangement with a shunt resistor and a circuit carrier.

A resistor includes first and second opposite terminations, a resistive element formed from a plurality of resistive element segments between the first and second opposite terminations, at least one segmenting conductive strip separating two of the resistive element segments, and at least one open area between the first and second opposite terminations and separating at least two resistive element segments. Separation of the plurality of resistive element segments assists in spreading heat throughout the resistor. The resistor or other electronic component may be packaged by bonding to a heat sink tab with a thermally conductive and electrically insulative material. The resistive element may be a metal strip, a foil, or film material.

The invention discloses a metal oxide arrester. The metal oxide arrester comprises a hollow insulating cylinder, an upper metal sealing plate, a lower metal sealing plate, a conducting post and a cluster parachute, wherein the upper metal sealing plate is arranged on the upper end of the hollow insulating cylinder, the lower metal sealing plate is arranged on the lower end of the hollow insulating cylinder, the conducting post is axially arranged in the hollow insulating cylinder, the cluster parachute covers the outer surface of the hollow insulating cylinder, a gap radially exists between the hollow insulating cylinder and the conducting post, the upper end of the conducting post makes contact with the upper metal sealing plate, the lower end of the conducting post makes contact with the lower metal sealing plate, and the conducting post is formed in a way that zinc oxide resistance discs and metal conductors are alternately overlapped. The invention provides the metal oxide arrester with high heat dissipation performance, and the problem of easiness in thermal breakdown and thermal explosion of a metal oxide arrester with an existing structure is solved.

A heater (10) for installation on a potable water tank (12). The heater (10) comprises a blanket (14) including an electrical resistance heating element (16) and a connection pad (18) for electrically connecting the heating element (16) to lead lines (20) to an aircraft power source (22). The water tank (12) is typically positioned under the cabin floor or other locations on an aircraft which are susceptible to cold temperatures, moisture invasion, and pressure drops / rises caused by changing altitudes. The heater (10) maintains the tank (12) at an acceptable temperature range and prevents freezing of the water.

An electrostatic discharge protection component comprising a ceramic sintered body having ceramic substrate 12, varistor portion 10 formed thereon excluding some non-formed portion 18, and glass ceramic layer 14 further formed thereon, a pair of terminal electrodes 13a, 13b disposed by exposing a part thereof at non-formed portion 18 on ceramic substrate 12 of the ceramic sintered body, a pair of external electrodes 16a, 16b, and heat conducting portion 15 vertically penetrating ceramic substrate 12, a light-emitting diode or the like mounted on heat conducting portion 15 at non-formed portion 18, it is possible to reduce the size and to efficiently dissipate the heat generated by the component mounted.

A device combining a thermal fuse and a resistor has a solid ceramic base of the wirewound resistor is changed to be hollow, a thermal fuse is disposed inside the ceramic base, the ceramic tube is the housing of the thermal fuse, one lead wire of the thermal fuse is passing through the end cap of one end of the wirewound resistor, the other end of the thermal fuse is extended out of the end cap of the other end of the wirewound resistor, the end cap of the wirewound resistor is extended out with a lead wire, then the whole product is encapsulated by epoxy resin. The device can serve as a basic unit, which is directly assembled to an existing high-frequency charger, it can take the place of the existing simple wirewound resistor or the wirewound resistor with a thermal fuse external contacted.

An integrated circuit has a circuit component and a heating component thermally coupled together in a region thermally isolated from other parts of the integrated circuit. The thermal isolation can be provided by a bridge over a cavity in the substrate or caps over a thin substrate. A control circuit, which may be responsive to a sensing component thermally coupled to the heating component, controls the heating component to heat the circuit component to a temperature greater than that of the other parts of the integrated circuit, to control a temperature-dependent characteristic of the circuit component. The circuit component can for example be a resistor whose resistance is precisely determined and / or adjusted via the control circuit.

A hoisting machine is provided that is capable of efficiently dissipating heat generated from an inverter incorporated in the hoisting machine main body into the surrounding air with a simple structure and hence capable of performing high-frequency operation.A hoisting machine having a load hoisting motor and a speed reduction mechanism and driving the load hoisting motor with an inverter 12 incorporated in the hoisting machine main body is provided with a heat dissipation means that dissipates heat generated from the inverter 12 to a speed reduction mechanism casing 15 that houses the speed reduction mechanism. The heat dissipation means is a means for attaching the inverter 12 directly to the speed reduction mechanism casing 15 in close contact therewith through surface contact at least a part of the inverter 12.

The invention provides a chip resistor. The chip resistor comprises a resistor sheet, an inner shell which wraps the surface of the resistor sheet, a heat sink bonded to the surface of the resistor sheet through an insulating thermal conductive adhesive, an outer shell at the outermost layer and electrode pins connected with the two ends of the resistor sheet and located outside the outer shell, and the inner shell is provided with a hollowed-out part for coating the insulating thermal conductive adhesive. A manufacturing method of the chip resistor includes the steps of blanking the resistorsheet and the electrode pins, then processing and connecting the resistor sheet and the electrode pins to form a resistor body, conducting rough adjustment and fine adjustment on a resistance value ofthe resistor body, packaging for the first time to form the inner shell, blanking the heat sink, bonding the heat sink to the resistor sheet through the insulating thermal conductive adhesive, packaging for the second time, cutting and bending the electrode pins to form a side U shape, and finally conducting post-processing to obtain the chip resistor. According to the chip resistor, after roughadjustment and fine adjustment are conducted on the resistance value of the resistor body, packaging is conducted for the first time, a layer of inner shell wraps the resistor body to ensure that theheat sink is not contact with the resistor sheet, and the obtained chip resistor has high precision, fast heat dissipation, long service life, safety and reliability, and high product yield.

A technique is disclosed for cooling resistive elements, such as brake resistors used in motor drives, as well as other resistors. A phase change heat spreader is thermally coupled to the resistive element and a continuous phase change cycle takes place in the heat spreader to extract heat from the resistive element. The element and heat spreader may be packaged as a modular unit or may be integrated into a system.

A hoist capable of high frequency operation by efficiently releasing heat of an inverter, which is incorporated in a hoist body, to ambient air by using a simple structure. The hoist has a load lifting and lowering electric motor and a reduction gear mechanism, and the motor is driven by the inverter (12) incorporated in the hoist body. The hoist further has heat release means for releasing heat emitted from the inverter (12) to a reduction gear mechanism casing (15). The heat release mechanism is installation means for installing the inverter (12) on the reduction gear mechanism casing (15) with at least a part of the inverter (12) made to be in direct intimate surface contact with the casing (15).

A surface-mountable over-current protection device comprises one PTC material layer, first and second connecting conductors, first and second electrodes and an insulating layer. The PTC material layer has a resistivity less than 0.2 Ω-cm, and comprises crystalline polymer and conductive filler dispersed therein. The first and second connecting conductors are capable of effectively dissipating heat generated from the PTC material layer. The first and second electrodes are electrically connected to first and second surfaces of the PTC material layer through the first and second connecting conductors, respectively. The dissipation factor depending on the ratio of the total area of the electrodes and the conductors to the area of the PTC material layer is greater than 0.6. At 25° C., the value of the hold current of the device divided by the product of the area of the PTC material layer and the number of the PTC material layer is greater than 1A / mm2.

This present invention provides a high power water-cooling resistor used for high voltage direct current converter valve, which adopts water-cooling directly. It is characterized by that there are four resistance films, the resistance layer with required resistance, wherein the power of each resistance film can be up to 1500 w at least to form high power resistor. The water flows through one side of resistance film-substrate to take away the heat produced by resistor. The resistor adopts insulated cooling. The thermal resistance between resistor and water is extremely low, and the heat transfer area is also large, the temperature of the resistor declines greatly at the same power. It makes the high power water-cooling resistor have high power to volume ratio; its power can be up to 6 kW under adequate water flow condition. It is suitable for high power condition. The inside space of resistor body is large, so there are some advantages when water cut off is test. The case of the resistor is made of white high strength pps engineering plastic, and it can bear 2 Mpa water pressure, which is better than PVDF material. The inlet and outlet are all the bottom of the resistor, and the wire terminals are the top.

A method and an arrangement for discharging an energy storage system for electrical energy, particularly in a vehicle having a hybrid drive line, by means of a first discharge resistor, wherein a coolant such as carbon dioxide gas is provided to the first discharge resistor during discharge of the energy storage system for leading off heat as well as a hybrid vehicle comprising such an arrangement.

An over-current protection device comprises at least one PTC component, at least one thermal dissipation layer, at least one adhesive layer and at least two isolation layers, wherein the PTC component is formed by interposing a PTC material between two electrode layers. The at least one adhesive layer as a thermal conductive medium is interposed between the PTC component and at least one thermal dissipation layer to combine them. The at least two isolation layers separate the thermal dissipation layer, adhesive layer and electrode layers into two electrical independent portions.

A resistor and a manufacturing method thereof are disclosed. Since a ceramic tube formed of a ceramic material is used and the ceramic tube is joined to sealing electrodes by use of brazing rings, joining strength and durability of the resistor are considerably improved. The resistor may be stably used at a high voltage due to excellent heat dissipation characteristics thereof.

A circuit protection device includes a metal oxide varistor (MOV), a spring terminal and a thermal disconnect coupling the spring terminal to the MOV. A gas discharge tube (GDT) is coupled to the MOV. The spring terminal is biased such that upon occurrence of an overvoltage condition, heat generated by the MOV melts the thermal disconnect and allows the spring terminal to be displaced away from the MOV, thereby creating an opening circuit.