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52results about How to "Reliably realized" patented technology

Agile digital communication network with rapid rerouting

An agile digital communications network has a number of routers that serve as nodes in a mesh network communicating between a user device (e.g., computer, server, etc.) and a target device (e.g., disc storage cabinets, tape, jukebox, etc.). The routers operate on an open shortest path first protocol, each router having two or more interfaces or links to other routers. When a link connected to a router is down and is in the shortest path to another router identified in a communication packet, the packet is forwarded to the identified router on a precalculated alternate route that does not use the unavailable link. IP tunneling assures that routing loops do not occur and send the packet back to the router with the unavailable link because it would have been in the shortest path of an intermediate router. A tunneling technique is provided that maximizes the levels of encapsulation needed at two, regardless of the size or configuration of the network. An unavailable link is not broadcast immediately throughout the network, giving the link an opportunity to be restored before all of the routers are called on to recalculate the shortest paths and alternate paths. During a short interval following the discovery of an unavailable link, then, a router connected to that link is in a state identified as the Use Alternate Path state, and the link is repeatedly checked for availability. Each router calculates and stores the alternative paths to each other router after first calculating the shortest path to each other router. The alternate paths are pulled up and used when an unavailable link is detected. Dijkstra's algorithm is used to calculate the shortest paths. A new algorithm called the iterative dynamic Dijkstra's algorithm is used to calculate the alternative routes.
Owner:THE ARIZONA BOARD OF REGENTS ON BEHALF OF THE UNIV OF ARIZONA

Flexible printed circuit board unit contributing to reliable soldering and suppression of increased temperature

A thermal component is mounted on the front surface of an isolator sheet within a first specific area. A thermally-conductive material is located on the back surface of the isolator sheet on the back of the first specific area. An electrically-conductive material is located on the front surface of the isolator sheet within a second specific area. A thermally-insulating material is located on the back surface of the isolator sheet on the back of the second specific area. The flexible printed circuit board unit of this type allows heat of the thermal component to efficiently radiate from the thermally-conductive material. An increase in temperature can be suppressed in the thermal component. Heat can reliably stay in the electrically-conductive material when a solder material is applied to the surface of the electrically-conductive material. The solder material is allowed to reliably fuse.
Owner:FUJITSU LTD

Method of manufacturing a semiconductor device having a high breakdown voltage and low on-resistance

A semiconductor device includes a semiconductor substrate of a first conductivity type, in which an extended drain region of a second conductivity type and a source region of the second conductivity type are formed with an interval therebetween, wherein the extended drain region includes a plurality of buried layers, each formed by burying an impurity layer of the first conductivity type, the plurality of buried layers extending substantially parallel to a substrate surface and with an interval therebetween in a depth direction. A concentration of an impurity of the second conductivity type in the extended drain region at a depth of about 6 μm from the substrate surface is about 1×1015 / cm3 or more and is about 30% or more of that at a depth of about 2 μm from the substrate surface.
Owner:PANASONIC CORP

Liquid droplet discharge device and method of manufacturing liquid droplet discharge device

In a liquid droplet discharge head, a liquid repellent layer is continuously formed from a liquid droplet discharge surface to a middle position in a thickness direction of an end surface of a nozzle plate.
Owner:SEIKO EPSON CORP

Semiconductor device and method for manufacturing the same

ActiveUS20140306267A1Simple manufacturing processDeterioration of suppression characteristicsTransistorSolid-state devicesImpuritySemiconductor
A semiconductor device including a semiconductor substrate in which a diode region and an IGBT region are formed is provided. In the semiconductor device, the diode region includes a second conductivity type cathode layer. An impurity concentration of second conductivity type impurities of the cathode layer is distributed in a curve pattern having at least two peaks, and the impurity concentration of the second conductivity type impurities is higher than that of first conductivity type impurities at all depths of the cathode layer.
Owner:DENSO CORP

Current-perpendicular-to-the-plane structure magnetoresistive element and method of making same

The upper portion of a magnetoresistive film is interposed between insulators in the lateral direction of a recording track in a current-perpendicular-to-the-plane structure magnetoresistive element. Domain control magnetic layers sandwich the upper portion of the magnetoresistive film along with the insulators in the lateral direction. The insulators serve to establish a narrower path for electric current between the lower portion of the magnetoresistive film and an upper electrode layer. The substantial width in the lateral direction can thus be reduced in the magnetoresistive film. In addition, a longitudinal biasing magnetic field established between the domain control magnetic layers efficiently acts on the magnetoresistive film. In particular, if a free magnetic layer is included in the upper portion of the magnetoresistive film, the free magnetic layer can be subjected to a larger longitudinal biasing magnetic field. A single domain property can be realized in the free ferromagnetic layer enough. The Barkhausen noise can be reduced.
Owner:FUJITSU LTD
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