40results about How to "Minimize connection" patented technology

A system and method for reducing impedance loading of semiconductor integrated circuit devices implementing protective device structures that contributes to impedance loading at an I / O pad connection. The method comprises providing a fuse device between the I / O pad connection and the protective device; connecting a current source device associated with each fuse device in the integrated circuit, the current source device connected to one end of the fuse device; providing fuse selection circuit for activating current flow through a selected fuse device between the current source and the I / O connection, the current flow being of an amount sufficient for blowing the fuse and disconnecting the protective device from the circuit structure, thereby reducing impedance loading at the I / O connection. Such a system and method is employed in a memory system comprising integrated circuit chips disposed in a stacked relation, with each chip including: a layer of active circuitry formed at a first layer of each chip; a plurality of through conducting structures disposed substantially vertically through each chip for enabling electronic connection with active circuitry at the first layer; second conducting device disposed at an end of the through conducting structure at an opposite side of a chip for connection with a corresponding through conductive structure of an adjacent stacked chip, the stacked chip structure formed by aligning one or more through conducting structures and second conducting devices of adjacent chips, whereby a chip of the stack is electronically connected to active circuitry formed on other chips of the stack. The stacked chip structure is ideal for reducing data access latency in memory systems employing memory chips such as DRAM.

This invention relates to a mechanism and method for enhancing the performance of both two stroke and four stroke cycle reciprocating piston internal combustion engines, reciprocating piston pumps and compressors by generating an Epitrochoidal path of travel for the lower end of the connecting rod. The piston, attached to the upper end of the connecting rod, will be made to dwell at the lower part of its travel, enhancing the output of the engine, pump or compressor through better utilization of the available cylinder pressure.

The film bulk acoustic wave resonator includes a laminate structure composed of a piezoelectric layer, and first and second electrode layers interposing at least part of the piezoelectric layer, in which the first metal electrode is dispersively formed on an electrode plane facing the second metal electrode, and a gap is formed in a substrate correspondingly to the laminate-structured resonance part. Except for an area of a wire electrode electrically connected to the first electrode layer and an area of a wire electrode electrically connected to the second electrode layer, the piezoelectric layer, first electrode layer and second electrode layer do not come in contact with the insulating substrate but are supported on a hollow. Also, a prop is formed in the gap to support the laminate structure.

An electro-orthodontic appliance is provided that helps accelerate orthodontic tooth movement through the application of a controlled electrical current to gum and teeth, thus stimulating osteogenesis.

This invention is a convertible multi-diameter sleeve for optical fiber connectors to allow optical fiber cables with plug ferrules of different internal and external diameters to be pushed into the sleeve and connected with precise core alignment keeping stable conditions. The sleeve has at least one slot extending part way along the length of the sleeve.

There is provided a system for generating configuration data for implementing a circuit design in a segmented reconfigurable device. A placement and routing design aiding system (30) includes a database (31) for storing hardware information (89) including data of PEs included in each segment and data of a first-level and second-level routing matrix and an apparatus (33) for mapping the circuit design onto the PEs. The mapping apparatus (33) generates mappings of the circuit design onto the PEs by carrying out an iterative algorithm that minimizes a cost function based on the hardware information (89). The cost function includes an item that minimizes usage of the second-level routing matrix (22) that connects between the segments.

A seal is provided between a nozzle and a manifold. The seal provides a melt channel between an outlet of the manifold and a nozzle channel. The seal has higher thermal expansion coefficient than both the nozzle and the manifold to provide an improved seal between the manifold and the nozzle when the injection molding apparatus is at an operating temperature.

A kneepad includes connectors (32 and 34) at its lower side edges (30 and 31) below the position of articulation of the joint. The connectors are biased toward a plurality of ribs (40) integrally formed in the external side surface of the outer hard shell (22) for trapping the side seams of the pant leg against the ribs and holding the kneepad firmly in place.