The invention discloses an anti-overload
potting process for a
missile-borne product, and belongs to the technical field of
missile-borne. The anti-overload
potting process is characterized by comprising the following steps that a, caulking is carried out on a gap on the
missile-borne product by using
silicon rubber, and preparation of an
epoxy resin AB type
potting adhesive is started after the gap is caulked; b, the prepared
epoxy resin AB type potting
adhesive is poured into a needle cylinder; c, the missile-borne product is fixed on a vibration meter, the vibration meter is started, and the
epoxy resin AB type potting
adhesive is injected to the interior of the missile-borne product at a
constant speed; and d, after the potting amount and the potting state are verified to meet the requirements, the missile-borne product is taken down from the vibration meter and transferred into a high-temperature box for placement, the missile-borne product is taken out after the epoxy resin AB type potting adhesive is completely solidified and hardened, finally, the
silicone rubber for caulking the missile-borne product is cleaned, and the potting of the missile-borne product is completed. According to the anti-overload potting process, the whole potting operation is simple and easy to implement, the potting efficiency can be effectively improved, the potting uniformity can be kept in the potting process, and the potting quality and the potting effect are improved.