Filling and sealing glue for auxiliary gun probe and preparation method thereof
A technology of potting glue and auxiliary gun, which is applied in the field of high-temperature glue, can solve the problems of affecting the success rate of sampling and carbon determination, inconvenient use, and high price, so as to improve potting efficiency, low fluidity, and improve use performance effect
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[0032] The present invention also provides a preparation method of potting glue for sub-lance probes, comprising the following steps:
[0033] A) Drying, grinding and sintering 0.5-10 wt% active metal compound in sequence to obtain an activated powder;
[0034] B) ball milling and mixing the activated powder with the 10wt%-90wt% high-alumina fine powder, 5wt%-40wt% plate corundum, and 10wt%-50wt% water glass to obtain the potting glue for the sub-gun probe .
[0035] In the present invention, the kind, source and dosage of the active metal compound, high alumina fine powder, plate corundum and water glass are the same as those of the above active metal compound, high alumina fine powder, plate corundum and water glass, the source and the amount thereof are as follows: The dosage is the same and will not be repeated here.
[0036] In the present invention, the drying method of the active metal compound is preferably vacuum drying, preferably drying in a vacuum oven; the dryin...
Embodiment 1
[0046] Dry 10g of lithium carbonate (active metal compound) at 80°C, grind and heat up to 750°C at a rate of 2°C / min, and sinter for 6 hours to obtain an activated powder.
[0047]The obtained activated powder was ball milled for 7 hours with 40 g of high alumina fine powder, 38 g of plate alumina and 28 g of water glass at a ball milling speed of 60 r / min to obtain a potting compound.
[0048] The high-temperature-resistant inorganic potting compound prepared in this example has low fluidity and initial curing time of 15 minutes, but the curing strength can reach 54 MPa, the curing shrinkage is very small, only 0.05%, and the thermal shock stability is good, and the highest temperature resistance is 1720°C. It meets the high temperature resistance requirements on site, and can significantly improve the potting efficiency of sub-gun probes, without leakage, and after potting, it will cure without cracking. Potting quality is high.
Embodiment 2
[0050] Dry 8g of calcium chloride (active metal compound) at 85°C, grind and heat up to 780°C at a rate of 4°C / min, and sinter for 6 hours to obtain an activated powder.
[0051] The obtained activated powder was mixed with 45g of high alumina fine powder, 25g of plate alumina and 38g of water glass for 5 hours by ball milling at a ball milling speed of 100r / min to obtain a potting compound.
[0052] The high-temperature-resistant inorganic potting glue prepared in this example is light brown viscous glue, the initial curing time is 20min, the curing strength can reach 45MPa, the curing shrinkage is small, only 0.1%, and the thermal shock stability is good, and the maximum resistance is 1720 ℃. It meets the high temperature resistance requirements on site, and can significantly improve the potting efficiency of sub-gun probes, without leakage, and after potting, it will cure without cracking. Potting quality is high.
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Abstract
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