Data chain device suitable for high overload impact environment, and potting method thereof

Abstract

The invention discloses a data chain device suitable for a high overload impact environment, and a potting method thereof, and belongs to the technical field of high overload protection. By using the corresponding arrangement of a high-frequency module and a low-frequency module are correspondingly arranged, potting all parts in the low-frequency module in a first inner shell through a first potting adhesive and potting the low-frequency module and the high-frequency module in a middle shell through a second potting adhesive, the data link device which is good in integrity and resistant to high overload impact can be formed. According to the data chain device suitable for the high overload impact environment, energy generated when high overload impact occurs can be absorbed through deformation and damage of potting materials with different densities, and the purposes of reducing the impact pulse peak value and widening the impact pulse time are achieved, it is ensured that the data chain device can bear multiple times of high overload impact when applied in a severe environment, damage to internal components of the device due to the high overload impact effect is reduced, stability and reliability of device setting and application are fully ensured, and the data chain device has good application prospects and popularization value.

Description

technical field [0001] The invention belongs to the technical field of high overload protection, and in particular relates to a data link device suitable for a high overload impact environment and a potting method thereof. Background technique [0002] In the fields of aerospace and military equipment, environments with high overload shocks are often encountered, which will cause a series of high-frequency components to be superimposed on the ideal overload curve of the equipment, making the measured overload far greater than the ideal overload, and causing the equipment to fail due to high Due to the superposition of frequency components, it withstands multiple high overload shocks during one operation, which seriously affects the circuit system and mechanical structure of the equipment, causing problems such as circuit short circuit or open circuit, power supply damage, electronic system component damage, metal component fracture and deformation, etc. In turn, the circuit ...

AI Technical Summary

Problems solved by technology

[0005] (1) The thermal expansion coefficient difference between the existing potting material and the printed board base material or device pins and pads is too large, which leads to the disengagement between the glue and the printed board and device during the temperature cycle;

[0006] (2) The large shrinkage rate of the potting material and the poor performance in the low temperature environment lead to damage to the components in the circuit board during the potting process, and the device is damaged

The shrinkage rate of the potting material is large, and the shrinkage of the glue during the curing process of the glue will generate a large stress, which will cause the device to break

Especially for QFP and SOP packaged devices, when the device body is larger and the pins are thinner, the stress generated by the curing of the glue will cause the pins to crack or fall off from the printed board pad.

[0007] (3) The strength of the potting material is low, which leads to cracks in the glue under the impact of high g value. In the electromagnetic environment, a single launch will produce multiple high g value impacts, causing the crack to spread and lead to cracking of the solder joints of the device. The device is damaged and cannot withstand the impact of more than 10000g;

[0008] (4) The fluidity of the potting glue is poor. During the potting process, the glue cannot be effectively filled to the narrow space or the bottom of the device, and there is a cavity at the bottom of the device, which leads to uneven stress on the printed board or device. failure under action;

[0009] (5) The structural reinforcement design involved in the potting process is immature, and the structural design often leads to poor potting operability; it cannot adapt to the stress of multiple high-g impacts, and the structure breaks after multiple impacts

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