30results about How to "High design" patented technology

An object is to manufacture a semiconductor device including an oxide semiconductor at low cost with high productivity in such a manner that a photolithography process is simplified by reducing the number of light-exposure masks. In a method for manufacturing a semiconductor device including a channel-etched inverted-staggered thin film transistor, an oxide semiconductor film and a conductive film are etched using a mask layer formed with the use of a multi-tone mask which is a light-exposure mask through which light is transmitted so as to have a plurality of intensities. In etching steps, a first etching step is performed by dry etching in which an etching gas is used, and a second etching step is performed by wet etching in which an etchant is used.

In a method for manufacturing a semiconductor device including a channel-etched inverted-staggered thin film transistor, an oxide semiconductor film and a conductive film are etched using a mask layer formed with the use of a multi-tone mask which is a light-exposure mask through which light is transmitted so as to have a plurality of intensities. The etching step is performed by dry etching in which an etching gas is used.

An object is to manufacture a semiconductor device including an oxide semiconductor at low cost with high productivity in such a manner that a photolithography process is simplified by reducing the number of light-exposure masks. In a method for manufacturing a semiconductor device including a channel-etched inverted-stagger thin film transistor, an oxide semiconductor film and a conductive film are etched using a mask layer formed with the use of a multi-tone mask which is a light-exposure mask through which light is transmitted so as to have a plurality of intensities. The etching step is performed by wet etching in which an etching solution is used.

An object is to manufacture a semiconductor device including an oxide semiconductor at low cost with high productivity in such a manner that a photolithography process is simplified by reducing the number of light-exposure masks. In a method for manufacturing a semiconductor device including a channel-etched inverted-staggered thin film transistor, an oxide semiconductor film and a conductive film are etched using a mask layer formed with the use of a multi-tone mask which is a light-exposure mask through which light is transmitted so as to have a plurality of intensities. In etching steps, a first etching step is performed by wet etching in which an etchant is used, and a second etching step is performed by dry etching in which an etching gas is used.

There is provided a head mounted display including a glasses-type frame to be worn on a head of an observer; two optical modules including two image creation devices, and two light guides having two light guide plates coupled one-to-one with the two image creation devices and placed closer to a center of a face of the observer than the image creation devices are as a whole, that guide light beams output from the image creation devices and output the light beams toward pupils of the observer; and an optical plate supporting the two light guides, wherein the optical plate is attached to a center part of the frame.

An object is to manufacture a semiconductor device including an oxide semiconductor at low cost with high productivity in such a manner that a photolithography process is simplified by reducing the number of light-exposure masks. In a method for manufacturing a semiconductor device including a channel-etched inverted-stagger thin film transistor, an oxide semiconductor film and a conductive film are etched using a mask layer formed with the use of a multi-tone mask which is a light-exposure mask through which light is transmitted so as to have a plurality of intensities. The etching step is performed by wet etching in which an etching solution is used.

An object is to manufacture a semiconductor device including an oxide semiconductor at low cost with high productivity in such a manner that a photolithography process is simplified by reducing the number of light-exposure masks. In a method for manufacturing a semiconductor device including a channel-etched inverted-staggered thin film transistor, an oxide semiconductor film and a conductive film are etched using a mask layer formed with the use of a multi-tone mask which is a light-exposure mask through which light is transmitted so as to have a plurality of intensities. In etching steps, a first etching step is performed by wet etching in which an etchant is used, and a second etching step is performed by dry etching in which an etching gas is used.

In a method for manufacturing a semiconductor device including a channel-etched inverted-staggered thin film transistor, an oxide semiconductor film and a conductive film are etched using a mask layer formed with the use of a multi-tone mask which is a light-exposure mask through which light is transmitted so as to have a plurality of intensities. The etching step is performed by dry etching in which an etching gas is used.

In a manufacturing method of a nonvolatile semiconductor memory device including a variable resistive element having a variable resistor made of a perovskite-type metal oxide film, the variable resistor is formed at a temperature which is lower than the melting point of a metal wire layer that has been formed before formation of the variable resistor. More preferably, the variable resistor is formed by a praseodymium calcium manganese oxide, which is represented by a general formula, Pr1-xCaxMnO3, carried out at a film forming temperature in a range from 350° C. to 500° C. according to a sputtering method.

There is provided a head mounted display including a glasses-type frame to be worn on a head of an observer; two optical modules including two image creation devices, and two light guides having two light guide plates coupled one-to-one with the two image creation devices and placed closer to a center of a face of the observer than the image creation devices are as a whole, that guide light beams output from the image creation devices and output the light beams toward pupils of the observer; and an optical plate supporting the two light guides, wherein the optical plate is attached to a center part of the frame.

Etching is performed using mask layers formed by a multi-tone mask which is a light-exposure mask through which light is transmitted to have a plurality of intensity, in a method for manufacturing a display device including an inverted staggered thin film transistor with a channel-etched structure. Further, a gate wiring layer and a source wiring layer are formed over a substrate in the same step, and the source wiring layer is separated (disconnected) at an intersection of the gate wiring layer and the source wiring layer. The separated source wiring layers are connected to each other electrically through an opening (a contact hole) via a conductive layer formed over a gate insulating layer in the same step as formation of source and drain electrode layers.

An indicator panel is shaped by thermoforming an indicator panel. The indicator panel includes a resin substrate and an inkjet design film on the substrate. The design film is formed by printing a UV hardening ink in an inkjet printing, and hardening. A crack and a removal of the design film can be decreased such that the formed indicator panel can have a high-quality design.

An object is to manufacture a semiconductor device including an oxide semiconductor at low cost with high productivity in such a manner that a photolithography process is simplified by reducing the number of light-exposure masks. In a method for manufacturing a semiconductor device including a channel-etched inverted-staggered thin film transistor, an oxide semiconductor film and a conductive film are etched using a mask layer formed with the use of a multi-tone mask which is a light-exposure mask through which light is transmitted so as to have a plurality of intensities. In etching steps, a first etching step is performed by dry etching in which an etching gas is used, and a second etching step is performed by wet etching in which an etchant is used.

The invention concerns a design for generating a multi color image over a projection surface to be applied in digital projectors with reflective LCD chips (LCoS) as image generating elements, in which the light stream, emitted from a white light source, passes over a color modulator, a polarization beam splitter or a color splitter and for the purpose of generating polarized light that divides the light from optical elements in two partial light streams of different polarization planes at the image generating elements and the light portions that serve for generating the images produced by the image generating elements will be reflected in the projection objective. According to the invention, two image generating elements are intended for at least one basic color.

An operational amplifier circuit includes a first stage amplifier circuit, a second stage amplifier circuit and a first feedforward circuit. The first stage amplifier circuit is coupled to a first input node for receiving a first input signal and amplifying the first input signal to generate a first amplified signal. The second stage amplifier circuit is coupled to the first stage amplifier circuit for receiving the first amplified signal and amplifying the first amplified signal to generate a first output signal at a first output node. The first feedforward circuit is coupled between the first input node and the second stage amplifier circuit for feeding the first input signal forward to the second stage amplifier circuit.

A multi-secured RFID (Radio Frequency Identification) electronic seal includes a bolt, a bolt pedestal and a RFID system. The bolt has a male bolt portion with an electrical connecting point. The bolt pedestal has a female pedestal portion with several nodes to electrically connect with the electrical connecting point to provide plural selections of connecting and disconnecting. The RFID system includes a RFID chip and a transmission conductor embedded in the bolt, and an antenna installed on the bolt pedestal. When the bolt and the bolt pedestal is securely locked together, whether the RFID chip is electrically connects to the antenna depends on if the electrical connecting point connects a preset node, so that a RFID signal may be selectively transmitted by the RFID chip through the antenna.

A method for forming a variable capacitor includes providing a semiconductor substrate of a first conductivity type and forming an active region of a second conductivity type within the substrate. The method forms a first dielectric layer overlying the active region. The method provides a conductive gate layer over the first dielectric layer and selectively patterns the conductive gate layer to form a plurality of holes in the conductive gate layer. A perimeter of the holes and a spacing between a first and a second holes are selective to provide a high quality factor (Q) of the capacitor. The method implants impurities of the second conductivity type into the active region through the plurality of holes in the conductive layer. The method also includes providing a second dielectric layer and patterning the second dielectric layer to form contacts to the active region and the gate.

An operational amplifier circuit includes a first stage amplifier circuit, a second stage amplifier circuit and a first feedforward circuit. The first stage amplifier circuit is coupled to a first input node for receiving a first input signal and amplifying the first input signal to generate a first amplified signal. The second stage amplifier circuit is coupled to the first stage amplifier circuit for receiving the first amplified signal and amplifying the first amplified signal to generate a first output signal at a first output node. The first feedforward circuit is coupled between the first input node and the second stage amplifier circuit for feeding the first input signal forward to the second stage amplifier circuit.

A multi-secured RFID (Radio Frequency Identification) electronic seal includes a bolt, a bolt pedestal and a RFID system. The bolt has a male bolt portion with an electrical connecting point. The bolt pedestal has a female pedestal portion with several nodes to electrically connect with the electrical connecting point to provide plural selections of connecting and disconnecting. The RFID system includes a RFID chip and a transmission conductor embedded in the bolt, and an antenna installed on the bolt pedestal. When the bolt and the bolt pedestal is securely locked together, whether the RFID chip is electrically connects to the antenna depends on if the electrical connecting point connects a preset node, so that a RFID signal may be selectively transmitted by the RFID chip through the antenna.

A security camera system includes a base unit and sensor modules for generating image data. The base unit includes several mounting sockets arranged at different elevational and azimuthal directions around the base unit, and the sensor modules attach, for example, magnetically, to the mounting sockets. Each mounting socket includes a socket ID, which is read by a reader module of the sensor modules and used to stitch together the image data from different sensor modules. The sensor modules are powered wirelessly via induction and communicate wirelessly with the base unit via wireless transceivers and antennas.

A multilayer ceramic electronic component includes an end surface of a second external electrode and an end surface of a fourth external electrode that face a mounting surface of a mounting substrate on which a first multilayer ceramic electronic component body and a second multilayer ceramic electronic component body are mounted. A first metal terminal is connected to the second external electrode, a second metal terminal is connected to the fourth external electrode, and a connection terminal is connected across a first external electrode and a third external electrode. An insulator is disposed between the first multilayer ceramic electronic component body and the second multilayer ceramic electronic component body.

The invention discloses a carbon fiber composite material honeycomb and a preparation method and application thereof. A hole wall material defining honeycomb hole lattices is a carbon fiber composite material laminated combination body, and the carbon fiber composite material honeycomb is prepared by laying and compacting unidirectional carbon fiber prepreg according to a preset laying sequence. The preparation method comprises the steps: firstly, paving prepreg and carrying out cold pressing to obtain a hole wall laminated combined body blank, then repeatedly paving the laminated combined body blank by utilizing a mold until the width of a honeycomb to be prepared is reached, finally, simultaneously realizing shape maintenance curing and node gluing curing of the laminated combined body, and thus realizing the preparation of the light high-strength high-rigidity carbon fiber composite material honeycomb. The requirements of weight and comprehensive mechanical property indexes (comprising plane stretching, plane compression, plane shearing performance, long beam bending performance and the like) of the honeycomb are met.

A method and corresponding apparatus for searching for a signal is presented. The apparatus may be configured to select a first bin within a range of bins characterizing an uncertainty region. The bins may represent a phase within a bandwidth of interest. The apparatus may also be configured to compare a local signal, having a phase corresponding to the first bin, with a received signal, the received signal being received via a transmission medium. The apparatus may report whether the local signal matches the received signal. The apparatus may assign weightings to the bins if the local signal does not match the received signal. If a match is not found, the apparatus may select a next bin according to the weightings or according to characteristic of the transmission medium until a matching bin is obtained. One benefit of the search is reduced search time to allow, for example, a cell phone to synchronize the phase of a received signal more quickly than is currently done.

An in-mold forming apparatus including a first mold and a second mold for injection molding and a film feeding mechanism for feeding in-mold foil between the first mold and the second mold. A transfer foil is formed on the in-mold foil. The in-mold forming apparatus further includes a mold closing mechanism for closing the first mold and the second mold, thereby to fix the in-mold foil inside a cavity formed between the first mold and the second mold, a resin injection forming mechanism for injecting fused resin into the cavity, thereby to unit the transfer foil formed on the in-mold foil with the resin, and a charger arranged in the neighborhood of at least one of the first mold, the second mold, and the in-mold foil. The charger includes a charging unit for freeing ions and charging particles in the neighborhood of the in-mold foil, and an electrode for adsorbing the particles charged by the ions.

A method and corresponding apparatus for searching for a signal is presented. The apparatus may be configured to select a first bin within a range of bins characterizing an uncertainty region. The bins may represent a phase within a bandwidth of interest. The apparatus may also be configured to compare a local signal, having a phase corresponding to the first bin, with a received signal, the received signal being received via a transmission medium. The apparatus may report whether the local signal matches the received signal. The apparatus may assign weightings to the bins if the local signal does not match the received signal. If a match is not found, the apparatus may select a next bin according to the weightings or according to characteristic of the transmission medium until a matching bin is obtained. One benefit of the search is reduced search time to allow, for example, a cell phone to synchronize the phase of a received signal more quickly than is currently done.

A method for forming a variable capacitor includes providing a semiconductor substrate of a first conductivity type and forming an active region of a second conductivity type within the substrate. The method forms a first dielectric layer overlying the active region. The method provides a conductive gate layer over the first dielectric layer and selectively patterns the conductive gate layer to form a plurality of holes in the conductive gate layer. A perimeter of the holes and a spacing between a first and a second holes are selective to provide a high quality factor (Q) of the capacitor. The method implants impurities of the second conductivity type into the active region through the plurality of holes in the conductive layer. The method also includes providing a second dielectric layer and patterning the second dielectric layer to form contacts to the active region and the gate.

A packaging article for containing and holding food products includes a barrier layer for limiting permeability of oxygen through and into the article and an oxygen scavenging layer, which oxygen scavenging layer together with a second plastic material is contained within a cavity in a first plastic material forming walls, bottom(s) and lid(s) of the packaging article, which first plastic material is suitable for contact with food products. A method of manufacturing a packaging finished in one injection molding cycle includes placing the barrier layer in a mold, injecting the first plastic material suitable for contact with food products into the mold, and injecting the second plastic material with the oxygen scavenger into the mold.

A security camera system includes a base unit and sensor modules for generating image data. The base unit includes several mounting sockets arranged at different elevational and azimuthal directions around the base unit, and the sensor modules attach, for example, magnetically, to the mounting sockets. Each mounting socket includes a socket ID, which is read by a reader module of the sensor modules and used to stitch together the image data from different sensor modules. The sensor modules are powered wirelessly via induction and communicate wirelessly with the base unit via wireless transceivers and antennas.