The invention provides a gluing method for a
thinning-type
wafer. The gluing method comprises the following steps that S1, a preset vacuum degree is set, a to-be-glued
wafer is sucked on a
wafer holding table under the preset vacuum degree, the wafer holding table is controlled to rotate at a first rotation speed, and the center of the wafer is glue-applied through a glue
nozzle; S2, after glue-applying is finished, the wafer holding table rotates at a second rotation speed to conduct glue-applying reflow, wherein the second rotation speed is less than the first rotation speed; S3, the wafer holding table rotates at a third rotation speed first, and then at a fourth rotation speed to perform glue
spinning at variable speeds on the wafer, wherein third rotation speed is less than the fourthrotation speed; S4, the wafer holding table is controlled to conduct glue
spinning at a fifth rotation speed, and the
photoresist spinning is completed; S5, the wafer holding table is controlled to rotate at a sixth rotation speed to make
photoresist form a film on the surface of the wafer, wherein the fifth rotation speed is less than the sixth rotation speed; and S6, the wafer holding table rotates at a seventh rotation speed, and the wafer is scanned from a first position to a second position through a cleaning
nozzle for trimming treatment. The uniformity of the
photoresist on the surfaceof the wafer can be improved, and the photoresist accumulation and liquid splashing are avoided.