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Device for preventing liquid from splashing back

A liquid and object technology, applied in the field of liquid backsplash prevention device, can solve the problem of wafer secondary pollution, etc., achieve the effect of increasing anti-deformation ability and overcoming secondary pollution

Inactive Publication Date: 2012-12-19
BEIJING SEVENSTAR ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The invention provides a device for preventing liquid splashback, which is used to solve the problem of secondary pollution of the wafer caused by the liquid thrown off the wafer due to high-speed rotation colliding with the side wall and bouncing back to the wafer in the wafer cleaning process

Method used

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  • Device for preventing liquid from splashing back
  • Device for preventing liquid from splashing back

Examples

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Embodiment Construction

[0021] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0022] figure 2 Shown is a schematic structural view of the device for preventing liquid splashback in an embodiment of the present invention. Such as figure 2 As shown, the liquid splash prevention device in the embodiment of the present invention includes a chuck 2 for placing objects, a rotating shaft 6 fixedly connected to the chuck 2 for rotating the chuck 2, and a side ring arranged around the chuck 2 wall 3, and an organic thin film 4 is arranged on the inner side of the side wall 3, in this embodiment, the organic thin film 4 can be glued, plated or coated on the inner side of the side wall 3, preferably plated or coated, so that the organic thin film 4 and Th...

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PUM

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Abstract

The invention provides a device for preventing liquid from splashing back. The device comprises a chuck for placing an object, a rotating shaft and a side wall, wherein the rotating shaft is fixedly connected with the chuck and is used for driving the chuck to rotate; the side wall is annularly arranged around the chuck; liquid on the object is spin-dried by rotation of the chuck; the side wall is used for preventing the liquid thrown away from the object against splashing out of the side wall; an organic film is arranged on the inner side of the side wall; and the anti-deformation ability of the liquid is increased by the organic film, so that the liquid from the object is prevented against splashing back to the object via the side wall, and secondary pollution to the object is avoided.

Description

technical field [0001] The invention relates to the technical field of a device for preventing liquid from splashing back, in particular to a device for preventing liquid from splashing back used in a semiconductor wafer cleaning process. Background technique [0002] As the feature size of integrated circuits enters the deep sub-micron stage, wafer cleaning has developed from simple groove cleaning to single-chip cleaning with higher precision. During the cleaning process of a single wafer, the liquid on the wafer can be dried by using high-speed rotation to make the wafer dry. [0003] figure 1 Shown is a schematic structural view of wafer cleaning equipment in the prior art. Such as figure 1 As shown, when the wafer 1 is cleaned, the wafer 1 needs to be placed on the chuck 2 at first; 400 revolutions per second; finally by controlling the spray arm motor 8, the liquid spray arm 5 and the semiconductor wafer 1 to be cleaned are placed at a certain height distance, gene...

Claims

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Application Information

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IPC IPC(8): B08B13/00
Inventor 刘伟吴仪
Owner BEIJING SEVENSTAR ELECTRONICS CO LTD
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