In order to provide a practically lead-free glass composition having a low softening point and an excellent water resistance for use in various parts of electronic equipment and a magnetic head using the same, a glass composition is provided, which contains 0.5 to 14 wt % of SiO2, 3 to 15 wt % of B2O3, 4 to 22 wt % of ZnO, 55 to 90 wt % of Bi2O3, 0 to 4 wt % of Al2O3, 0 to 5 wt % of at least one selected from the group consisting of Li2O, Na2O and K2O, and 0 to 15 wt % of at least one selected from the group consisting of MgO, CaO, SrO and BaO.