The present invention provides a stacked
chip-type band-pass filter. The stacked
chip-type band-pass filter comprises a
ceramic matrix and sixth-order resonators, wherein each
resonator is one three-layer strip line
resonator; in the sixth-order resonators: the first-order
resonator, the third-order resonator and the fifth-order resonator are located at a lower plane, and the second-order strip line resonator, the fourth-order strip line resonator and the sixth-order strip line resonator are located at an upper plane; and the stacked
chip-type band-pass filter further comprises a Z-type
coupling line used for cross
coupling of the second-order strip line resonator and the fourth-order strip line resonator. The stacked chip-type band-pass filter is provided with the sixth-order three-layerstrip line resonators, the three-layer strip lines of each resonator forms two extra flat plate loading
capacitor to allow the lengths of the resonators to be far smaller than 1 / 4
wavelength; the sixth-order resonators are arranged on two planes at different heights to employ a vertical space so as to shorten the crosswise space while ensuring the same
coupling amount, and therefore, the stacked chip-type band-pass filter is higher in integration, small in volume, little in pass-band
insertion loss, high in stop band inhibition and high in reliability.