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Stacked chip-type band-pass filter

A band-pass filter, chip technology, applied in the field of filters, can solve problems such as large volume, and achieve the effect of small volume, high integration, and shortened lateral spacing

Inactive Publication Date: 2019-02-01
SHENZHEN ZHENHUA FU ELECTRONICS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a multilayer chip bandpass filter to solve the problem of large volume of the multilayer chip bandpass filter existing in the prior art

Method used

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  • Stacked chip-type band-pass filter

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Embodiment Construction

[0025] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0026] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0027] In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indic...

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Abstract

The present invention provides a stacked chip-type band-pass filter. The stacked chip-type band-pass filter comprises a ceramic matrix and sixth-order resonators, wherein each resonator is one three-layer strip line resonator; in the sixth-order resonators: the first-order resonator, the third-order resonator and the fifth-order resonator are located at a lower plane, and the second-order strip line resonator, the fourth-order strip line resonator and the sixth-order strip line resonator are located at an upper plane; and the stacked chip-type band-pass filter further comprises a Z-type coupling line used for cross coupling of the second-order strip line resonator and the fourth-order strip line resonator. The stacked chip-type band-pass filter is provided with the sixth-order three-layerstrip line resonators, the three-layer strip lines of each resonator forms two extra flat plate loading capacitor to allow the lengths of the resonators to be far smaller than 1 / 4 wavelength; the sixth-order resonators are arranged on two planes at different heights to employ a vertical space so as to shorten the crosswise space while ensuring the same coupling amount, and therefore, the stacked chip-type band-pass filter is higher in integration, small in volume, little in pass-band insertion loss, high in stop band inhibition and high in reliability.

Description

technical field [0001] The invention belongs to the field of filters, and more specifically relates to a laminated chip band-pass filter. Background technique [0002] As an important device for signal frequency selection and interference filtering, bandpass filters directly affect the signal transmission quality of the entire system in microwave and millimeter wave systems such as communication and radar. With the continuous development of electronic systems in the direction of high frequency, high integration and high performance, the miniaturization of filters has become a research hotspot in academia and industry. The use of planar integration technologies (such as printed circuit boards (PCBs) and integrated passive devices (IPDs)) and stacking technologies (such as low-temperature co-fired ceramics (LTCC)) can greatly reduce the size of the filter. The former has large high-frequency loss and low filter quality factor (Q value), which limits its application in high-fr...

Claims

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Application Information

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IPC IPC(8): H01P1/20H01P7/08
CPCH01P1/20H01P7/08H01P1/20345
Inventor 黎燕林肖倩朱建华刘季超周丽洁王志华
Owner SHENZHEN ZHENHUA FU ELECTRONICS
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