The invention discloses an all-dimensional
LED illumination package structure implemented by the aid of a transparent
ceramic COB (
chip on board) substrate. The all-dimensional
LED illumination package structure comprises a
bulb, an
anode contact, a
screw head, a heat conduction column, an
anode wire, a
cathode wire and a transparent
ceramic COB
chip. The transparent
ceramic COB
chip is respectively connected with the heat conduction column, the
anode wire and the
cathode wire. The transparent ceramic COB chip is of a
layered structure, the transparent
ceramic substrate is arranged at the bottommost layer of the transparent ceramic COB chip, a
silver paste circuit layer or a
copper-based circuit layer is arranged on an upper layer of the
ceramic substrate, and LED chips are arranged on an upper layer of the
silver paste circuit layer. Three holes are formed in the transparent ceramic COB chip and include an anode wiring hole, a
cathode wiring hole and a heat conduction column mounting hole. The all-dimensional
LED illumination package structure has the advantages that the all-dimensional LED illumination package structure aims to realize an LED all-dimensional illumination effect, an
illumination angle is enlarged to 270 degrees from the traditional 120-165 degrees, spatial light rays are soft and uniform, and users feel comfortable visually; the all-dimensional LED illumination package structure is favorable for improving light outputted by the LED chips, the
luminous efficacy can be improved to 130 lumens from the original 100 lumens, heat gathered on the backs of the LED chips can be reduced, and the service lives of the LED chips and the service lives of LEDs can be prolonged.