192results about How to "Potential risk" patented technology

A system to provide automobile financing to individuals with relatively lower credit scores or ratings, or no credit rating, due to lack of credit or lending purchases, that would otherwise only qualify for sub-prime, higher interest loans. Due to the overall system structure, lower rate interest loans can be extended to participants. The system utilizes the auto financing loan applicant's term of employment and / or other employment performance data as the principal credit criteria to qualify the creditworthiness of an applicant versus the applicant's credit score or credit rating. Applicant's driving records are also reviewed as system automobile loan approval credit criteria. Loan applicants provide employment related information and execute a letter of authorization providing the system with authority / rights to contact the applicant's employer to verify said employment information. In order to provide participants with lower interest rates than would otherwise be available through conventional channels, automobiles financed under the system must meet minimum profile criteria, including the year of the auto, the mileage, retail value relative to the wholesale value, and autos financed under the system are covered by extended warranties and have GPS systems installed for asset protection purposes. In utilizing employment term as the principal creditworthiness criteria, the system can to be offered through employers as an employee loyalty reward program.

A driver assisting system calculates a risk perceived (RP) by a driver from the environment, and a potential risk. At least one actuator is coupled to a driver controlled input device (or a driver's seat) to provide a first force to the driver controlled input device to stimulate the driver with a first form of tactile stimulus thereby to forward the calculated risk perceived (RP) to the driver, and to provide a second force to the driver controlled input device to stimulate driver with a second form of tactile stimulus thereby to forward the calculated potential risk to the driver.

A fabricating method of an embedded package structure includes following steps. First, a first circuit structure and a second circuit structure are formed respectively on a first board and a second board which are combined to form an integrated panel. The first board and the second board are then separated. Next, an embedded element is electrically disposed on the first circuit structure. At least one conductive bump is formed on the second circuit structure. Thereafter, a semi-cured film is provided, and a laminating process is performed to laminate the first circuit structure on the first board, the semi-cured film, and the second circuit structure on the second board. The semi-cured film encapsulates the embedded element and the at least one conductive bump pierces through the semi-cured film and electrically connects the first circuit structure.