A process for producing a solder product and a
copper product from a first lead-
tin based
metal composition having at least 40% wt of
copper and at least 5.0% wt together of
tin and lead. The process includes the steps ofpartially oxidizing a first liquid bath having the first lead-
tin based
metal composition, thereby forming a first dilute
copper metal composition and a first solder refining
slag, followed by separating the
slag from the metal composition, andpartially oxidizing a second liquid bath having the first dilute
copper metal composition, thereby forming a first high-
copper metal composition and a third solder refining
slag, followed by separating the third solder refining slag from the first high-
copper metal composition,whereby the solder product is derived from the first solder refining slag.