38results about How to "Improve bonding accuracy" patented technology

The invention provides a single-face bonding method suitable for hard alloy strips in a hard alloy hard-face machining process and application. A locating groove plate for bonding is scientifically designed, the hard alloy strips are placed on the locating groove plate, the hard alloy strips are bonded through punched single-face adhesive tape, and the hard alloy strips or blocks are fixed through spot welding; and then the adhesive tape is placed on a steel surface of a to-be-machined component, and through spray welding, bead weld and grinding, the steel surface is machined into a hard surface. According to the method, the aim that a large number of hard alloy strips are bonded at a time is simply and easily achieved, the bonding efficiency is greatly improved, and the conditions that due to manual operation, the bonding angles are different, and the bonding intervals are uneven are avoided; the bonding precision is improved, and wear resistance of the product hard surface can be effectively ensured and improved; and the method can be well applied to the aspect of hard-face machining of centering guides or TC bearings of drilling tools or screw drilling tools.

The invention relates to a BTO intelligent correction device and method of a full-automatic lead bonding machine. The full-automatic lead bonding machine comprises a workbench for bearing a chip workpiece, a bonding head provided with a chopper, and an imaging optical system. The BTO intelligent correction device comprises a basic mark point, a detector and a difference value correction system, wherein the basic mark point is arranged on the workbench and used for being aligned and identified by the imaging optical system to serve as an original point of a plane coordinate system; the detector is arranged at a theoretical BTO position, away from the basic mark point, on the workbench and used for detecting the distance between the detector and the chopper and generating an electric signal through induction when the chopper moves to an adjacent position above the detector; and the difference value correction system is used for pre-storing theoretical position coordinates when the chopper is induced, calculating a difference value between actual position coordinates and the theoretical position coordinates when the chopper is induced, obtained by the imaging optical system, and obtaining a BTO deviation value for performing compensation correction. The device is simple and small in structure, no extra equipment is added, the BTO deviation can be automatically corrected in real time, and the bonding precision of the chopper is improved.

The invention relates to the technical field of semiconductor manufacturing and particularly relates to a wafer bonding device and method. The device includes a first fixing device which is capable of moving only in the X and Y axis directions and is used for fixing a to-be-bonded first wafer on which a first calibration sign is arranged, a reference sign arranged on the first fixing device, a second fixing device which is capable of moving in the X, Y and X axis directions and is opposite to the first fixing device, a rotation device which is arranged at a surface of the second fixing device facing the first fixing device and is used for fixing a to-be-bonded second wafer on which a second calibration sign is arranged, an image acquisition device which is oppositely arranged, can synchronously move along X, Y and Z axes and is used for acquiring the first calibration sign and the second calibration sign, and a reference sign acquisition device used for reading the reference sign. The device is advantaged in that the first calibration sign and the second calibration sign can be clearly acquired by the image acquisition device, and wafer bonding accuracy is improved.

A wire bonding method and apparatus are provided for electronic components to enable PR processing and wire bonding to be carried out substantially concurrently. The apparatus comprises a bond head carrying a bonding tool for performing wire bonding and a rotary motor coupled to the bond head that is configured to change an angular orientation of the bonding tool relative to an electronic component to be bonded. There are first and second carriers for respectively mounting electronic components for wire bonding, and an optical system is arranged and configured to view bonding points on an electronic component mounted on the first carrier when the bonding tool is located over an electronic component mounted on the second carrier to perform wire bonding.

The invention discloses a clamping device for precalibration of a COG chip, which comprises a base, a first motor and a fixing device, wherein the first motor is fixed on the base; the first motor is connected with a first rotating wheel fixed with a first rotating shaft through a first transmission belt; the first rotating shaft is connected with the base; a first cam is arranged on the first rotating shaft; a first transmission rod which is in close contact with the first cam is arranged outside the first cam; the first transmission rod which is provided with a first calibration block is connected with the base slidably; a first spring is arranged between the first transmission rod and the base; the first transmission rod is connected with a first sliding block through a first transmission piece; the first sliding block is matched with a first guide rod on the base slidably; a second calibration block is arranged on the first sliding block; and the second calibration block and the first calibration block are oppositely arranged and are respectively positioned at two sides of the fixing device. The clamping device for precalibration of the COG chip can calibrate the position of the bonded chip to improve the bonding accuracy of the chip.

The invention discloses a display device and a bonding method thereof, and display equipment. The display device comprises a display panel and a driving carrier bonded with the display panel, wherein first pins on the display panel are arranged in the arrangement direction from a first center pin to two sides, first distances between adjacent edges of every two adjacent first pins are equal, and the widths of the first pins are sequentially increased; and second pins on the driving carrier are arranged in a direction from a second center pin to two sides, the widths of the second pins are equal, and second distances between the adjacent edges of every two adjacent second pins are sequentially increased. According to the display device provided by an embodiment of the invention, the distances between the pins on the display panel is not changed, the width of the pins is gradually increased from center to edge, the width of the pins on the driving carrier is not changed, the distance between the pins is gradually increased from center to edge, poor products caused by swelling amount difference are corrected, and bonding precision is improved.

The present invention discloses a method for detecting semiconductor micro - device bond strength. Said method is according to formula (II) designing a group of similar press arm pattern: 8 alpha / 3 <=l <= 50000 / alpha (II), measuring bonding surface crack in one length L, then calculating or comparing bond strength. Said invented method can conveniently detecting bond strength of semiconductor micro - device.

The present invention relates to the technical field of semiconductor manufacturing, in particular to a wafer bonding equipment, including: a first fixing device that can only move along the X-axis and Y-axis directions, and is used to fix the first wafer to be bonded. A wafer is provided with a first calibration mark; a reference mark is set on the first fixing device; a second fixing device movable along the X axis, Y axis, and Z axis is arranged opposite to the first fixing device; the rotation device , arranged on the side of the second fixing device facing the first fixing device, for fixing a second wafer to be bonded, and a second calibration mark is provided on the second wafer; for the oppositely arranged and synchronous along the X-axis 1, Y-axis, and Z-axis moving image capture devices are respectively used to capture the first calibration mark and the second calibration mark; a reference mark capture device is used to read the reference mark. Beneficial effects: it can ensure that the image acquisition device can clearly capture the first calibration mark and the second calibration mark at the same time, thereby improving the wafer bonding precision.

The invention discloses a wire bonding clamp which comprises a fixed shaft, a gear box, a pinion, a bull wheel, a small shaft and a big shaft, wherein one end of the fixed shaft is connected with an equipment working platform, the other end of the fixed shaft is connected with the gear box, the bull wheel is meshed with the pinion, the small shaft and the big shaft are respectively center shafts of the pinion and the bull wheel, the bull wheel and the pinion are embedded inside the gear box, the end face of the bull wheel is provided with a bull wheel lug boss, and the end face of the bull wheel lug boss is provided with uniformly-distributed through holes for fixing a device to be clamped. The bull wheel is driven to rotate through rotation of the pinion, and the bull wheel drives the device fixed on the bull wheel to rotate simultaneously so that the device is switched into the next working face. The invention realizes continuous switching of a plurality of side surfaces in a three-dimensional space of the device, and avoids multiple times of installation of the device, thus suspend time of the wire bonding clamp is greatly saved and production efficiency is increased. The clamp is convenient and simple in operation; and processing precision is increased, and better welding quality is ensured.

The invention discloses a device and a method for compensating wedge-shaped errors in wafer bonding, belonging to the field of semiconductor wafer processing. The device includes an upper bearing platform and a lower bearing platform, the lower bearing platform is provided with a first adsorption device, the upper surface of the lower bearing platform is provided with a gasket, and the gasket is connected with a gasket driving device, and the The lower surface of the lower bearing platform is provided with a lifting and angle adjustment device; the upper bearing platform includes an inner frame and an outer frame, the edge area of ​​the inner frame is located above the outer frame, and the inner frame is connected to the outer frame through a gravity balance device. The outer frame is floatingly connected, a plurality of capacitive sensors are arranged on the edge area of ​​the inner frame, and a second adsorption device is arranged on the inner frame. The invention adopts the method of wedge error compensation to eliminate the wedge error between the upper and lower wafers, so that two non-parallel wafers can achieve three-dimensional parallelism, and finally achieve the effect of improving wafer bonding precision.

The invention relates to a medical device phantom, fixture and processing technology. The phantom is used for correcting the accuracy of the upper moving axis of a large medical device, and the light equivalent of X-ray or nuclear magnetic resonance. The first part and the second part at the end; a reference line is set in the body, and the reference line is perpendicular to the first part and the second part respectively. A fixture comprising a base, a pair of positioning columns vertically arranged on both sides of the base; the bottom ends of the pair of positioning columns are connected to the base, and a positioning plate is connected to the top end, and the positioning plate is Describe a pair of positioning columns to do lifting motion. A processing technology for a medical device phantom mainly processes the above-mentioned medical device phantom. The structure of the mold body of the present invention is simple, and the processing procedure is simple, and the precision of each component manufactured is high, and the bonding precision, bonding fastness, bonding aesthetics, etc. between each component can effectively control the overall precision and reduce deformation. .

The invention discloses a glass circuit board based FPC (flexible printed circuit) board hot-pressing device, processing system and method. The hot-pressing device comprises a rotating platform capable of rotating intermittently, wherein the rotating platform is provided with two layers of fixing boards which are mutually parallel and can rotate simultaneously, one layer is hot-pressing fixing board used for fixing hot-pressing assemblies, the other layer is a jig fixing board for fixing jig assemblies, the rotating platform is divided into a plurality of station areas, and one hot-pressing assembly and one jig assembly are arranged in each station area; each hot-pressing assembly comprises a lifting control mechanism, a hot-pressing head and a buffering mechanism; a loading platform, a first preset platform, an ACF (anisotropic conductive film) attachment assembly, a second preset platform, the hot-pressing device and an unloading platform are mounted on a mounting platform. The work efficiency of the hot-pressing device can be improved, the area occupied by the equipment can be reduced, and the cost is saved.

The invention discloses a chip bonding device and method. The chip bonding device comprises a chip supply unit, a chip pickup unit, a chip measurement unit, a chip temporary load-bearing unit and a chip bonding unit which are correspondingly arranged in sequence, wherein the chip temporary load-bearing unit comprises a load-bearing rotary table and bonding hands distributed on the load-bearing rotary table along the circumferential direction, the chip pickup unit picks up a chip on the chip supply unit, the chip is subjected to alignment through the chip measurement unit and then transferred to the bonding hand, and the bonding hand receives the chip and transfers the chip to a substrate borne on the chip bonding unit for bonding. The chip bonding device is applicable to a chip mounting mode with the chip facing upwards and a chip mounting mode with the chip facing downwards, and expands the application range of the equipment; the bonding hands are driven to transmit the chips throughthe load-bearing rotary table so as to save the transmission time, and the plurality of bonding hands operate simultaneously so as to improve the production rate; and the chip is aligned through the chip measurement unit, and the chip supply unit is provided with a separation detection system, so that the position of the chip is aligned, and the bonding accuracy is improved.

The invention provides a vacuum apparatus, a substrate alignment apparatus, and a method of forming a pre-bonded wafer. The vacuum apparatus includes an upper fixing module, a lower fixing module, anda vacuum module. The vacuum module is configured to form a vacuum cavity between the upper fixing module and the lower fixing module after an upper substrate is aligned with a lower substrate. The vacuum module includes a housing, a sealing module, and a vacuum interface. The housing has an opening and is configured to sleeve the outer sides of the upper fixing module and the lower fixing modulein a manner that the opening is arranged upwards. The sealing module is disposed between the upper fixing module and the housing to seal the upper fixing module and the housing to form a sealed cavity. The vacuum interface penetrates through the sidewall of the housing and provides a vacuum input for the sealed cavity to form a vacuum cavity. The vacuum apparatus eliminates a spacer structure between two substrates and avoids a series of alignment and bonding errors introduced by the spacer.

The invention provides a bonding heating control device and a method thereof. The device comprises a heating controller, two heating devices and two heating driving devices. Each heating device is used for heating and pressurizing a silicon wafer or a glass sheet. Each heating device is provided with a heater and at least two temperature sensors. The heating controller is used for measuring each temperature sensor in the two heating devices and outputting PWM opening of a heater. Each heating driving device drives the heater to work according to the PWM opening output by the heating controller. The two heating devices work independently at the same time so that heating time is saved and heating efficiency is improved. Graphite pieces are arranged on upper and lower sides of a heating disc so as to make the temperature spread evenly. Meanwhile, a heating process is divided into three stages, rapid heating in a rate heating stage shortens the heating time and increases a yield; and adjustable power in a heating rate stage is realized and more process parameters are provided for a bonding process.

The invention provides a single-face bonding method suitable for hard alloy strips in a hard alloy hard-face machining process and application. A locating groove plate for bonding is scientifically designed, the hard alloy strips are placed on the locating groove plate, the hard alloy strips are bonded through punched single-face adhesive tape, and the hard alloy strips or blocks are fixed through spot welding; and then the adhesive tape is placed on a steel surface of a to-be-machined component, and through spray welding, bead weld and grinding, the steel surface is machined into a hard surface. According to the method, the aim that a large number of hard alloy strips are bonded at a time is simply and easily achieved, the bonding efficiency is greatly improved, and the conditions that due to manual operation, the bonding angles are different, and the bonding intervals are uneven are avoided; the bonding precision is improved, and wear resistance of the product hard surface can be effectively ensured and improved; and the method can be well applied to the aspect of hard-face machining of centering guides or TC bearings of drilling tools or screw drilling tools.