COG chip inversion bonding device

Abstract

The invention discloses a COG chip inversion bonding device which comprises a precalibration clamping device, a base plate positioning device and a delivering device, wherein the precalibration clamping device calibrates the position of a chip; the base plate positioning device positions a glass base plate bonded with the chip; the delivering device delivers the chip and the glass base plate; the precalibration clamping device and the base plate positioning device are sequentially fixed on a base; and the delivering device is respectively connected with drive parts on the precalibration clamping device and the base plate positioning device. The traditional delivering device chip is placed in the position of the precalibration clamping device, and the precalibration clamping device chip carries out precalibration; the position of the glass base plate on the base plate positioning device is calibrated by the base plate positioning device; and finally, the control device controls the clamping device to bond the chip on the glass base plate. Because the positions of the chip and the glass base plate are respectively calibrated before the chip is bonded, the bonding precision of the chip can be improved.

Description

technical field [0001] The invention relates to a COG chip flip-chip bonding device for the COG chip bonding process on a glass display substrate. Background technique [0002] COG uses anisotropic conductive film ACF and thermocompression welding technology to mount the integrated circuit chip on the glass substrate of the display screen, thereby reducing the product volume, increasing the assembly density, reducing costs, and realizing large-scale production. COG technology is widely used in various flat-panel displays and personal mobile products, and is currently the highest packaging form of packaging. [0003] During the COG chip bonding process, various means and methods must be used to take the chip out of the material box and transfer it to the bonding position on the glass plate to achieve precise positioning with the glass plate. [0004] In the existing COG chip bonding process, it is necessary to take out the bonded chip from the material box and transfer it to...

AI Technical Summary

Problems solved by technology

When the existing chip is taken out, because the position in the chip magazine is not fixed, that is, the position and direction of multiple chips are not unique, so when the chip is taken out, the direction and position of each chip are different. At the same time, the position of the chip is not fixed, which affects the accuracy of the bonding position; at the same time, when the chip is bonded, because the size of the glass substrate is small, even if the position of the glass substrate is shifted, the chip will not be bonded. will produce a large error

But for larger-sized glass substrates, such as 12-inch and above glass substrates, when the glass position is slightly shifted, a large error will occur during chip bonding, so the accuracy of chip bonding is not high

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